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公开(公告)号:US20210313239A1
公开(公告)日:2021-10-07
申请号:US17224658
申请日:2021-04-07
Applicant: SEMES CO., LTD.
Inventor: Jung Suk GOH , Young Dae CHUNG , Ji Hoon JEONG
IPC: H01L21/66 , H01L21/311
Abstract: A substrate processing method and a substrate processing apparatus for removing material on a substrate are disclosed. In order to remove the material, a processing liquid including a chemical liquid and water is supplied on the substrate so that a liquid layer maintained by surface tension is formed. The material is removed from the substrate by a reaction between the material and the processing liquid. A size distribution of by-product particles formed by the reaction between the material and the processing liquid is measured by a dynamic light scattering method. A supply of the processing liquid is controlled based on the size distribution of the by-product particles.
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公开(公告)号:US20210159092A1
公开(公告)日:2021-05-27
申请号:US16951718
申请日:2020-11-18
Applicant: SEMES CO., LTD.
Inventor: Jung Suk GOH , Sun Mi KIM , Ji Su HONG , Kuk Saeng KIM , Cheng Bin CUI , Pil Kyun HEO
Abstract: Disclosed is a substrate treatment apparatus. The apparatus includes a support unit that supports and rotates a substrate and a spray unit equipped with one or more nozzles to spray a dual fluid that is a mixture of a cleaning agent and carbon dioxide onto the substrate.
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