公开(公告)号：US20210313239A1

公开(公告)日：2021-10-07

申请号：US17224658

申请日：2021-04-07

Applicant: SEMES CO., LTD.

Inventor： Jung Suk GOH ,  Young Dae CHUNG ,  Ji Hoon JEONG

IPC: H01L21/66 ,  H01L21/311

Abstract: A substrate processing method and a substrate processing apparatus for removing material on a substrate are disclosed. In order to remove the material, a processing liquid including a chemical liquid and water is supplied on the substrate so that a liquid layer maintained by surface tension is formed. The material is removed from the substrate by a reaction between the material and the processing liquid. A size distribution of by-product particles formed by the reaction between the material and the processing liquid is measured by a dynamic light scattering method. A supply of the processing liquid is controlled based on the size distribution of the by-product particles.

公开(公告)号：US20210159092A1

公开(公告)日：2021-05-27

申请号：US16951718

申请日：2020-11-18

Applicant: SEMES CO., LTD.

Inventor： Jung Suk GOH ,  Sun Mi KIM ,  Ji Su HONG ,  Kuk Saeng KIM ,  Cheng Bin CUI ,  Pil Kyun HEO

IPC: H01L21/67 ,  B08B3/04

Abstract: Disclosed is a substrate treatment apparatus. The apparatus includes a support unit that supports and rotates a substrate and a spray unit equipped with one or more nozzles to spray a dual fluid that is a mixture of a cleaning agent and carbon dioxide onto the substrate.