POWER STORAGE DEVICE
    12.
    发明申请
    POWER STORAGE DEVICE 审中-公开
    电源存储设备

    公开(公告)号:US20140099529A1

    公开(公告)日:2014-04-10

    申请号:US14042855

    申请日:2013-10-01

    Abstract: A power storage device with a higher degree of safety is provided. Further, a power storage device with improved cycle life is provided. In the power storage device, an ionic liquid as a solvent of an electrolyte solution, and an exterior body is covered with a conductive component so as to prevent direct contact between a positive electrode current collector and the exterior body. This suppresses elution of the positive electrode current collector due to contact between different kinds of metals and accordingly prevents a phenomenon in which the eluted metal of the positive electrode current collector is deposited on a negative electrode and the deposited metal comes in contact with a positive electrode. Thus, an internal short-circuit caused by the contact can be prevented.

    Abstract translation: 提供了一种具有较高安全性的蓄电装置。 此外,提供了具有改善的循环寿命的蓄电装置。 在蓄电装置中,作为电解质溶液的溶剂的离子液体和外部主体被导电性部件覆盖,以防止正极集电体与外部体之间的直接接触。 这抑制了由于不同种类的金属之间的接触导致的正极集电体的溶出,因此防止了正极集电体的洗脱金属沉积在负极上并且沉积的金属与正极接触的现象 。 因此,可以防止由接触引起的内部短路。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20130334611A1

    公开(公告)日:2013-12-19

    申请号:US13961197

    申请日:2013-08-07

    CPC classification number: H01L23/66 H01L23/49855 H01L2924/0002 H01L2924/00

    Abstract: The semiconductor device of the invention includes a transistor, an insulating layer provided over the transistor, a first conductive layer (corresponding to a source wire or a drain wire) electrically connected to a source region or a drain region of the transistor through an opening portion provided in the insulating layer, a first resin layer provided over the insulating layer and the first conductive layer, a layer containing conductive particles which is electrically connected to the first conductive layer through an opening portion provided in the first resin layer, and a substrate provided with a second resin layer and a second conductive layer serving as an antenna. In the semiconductor device having the above-described structure, the second conductive layer is electrically connected to the first conductive layer with the layer containing conductive particles interposed therebetween. In addition, the second resin layer is provided over the first resin layer.

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