Abstract:
Systems and methods are disclosed for MCM (multiple chip module) packages having multiple stacked demodulator dies that share one or more MCM pins. The shared pins can include clock generation pins, clock input/output pins, receive signal path input pins, voltage supply pins, ground supply pins, and/or any other desired pins. In addition to reducing footprint sizes for printed circuit board (PCB) applications, the multi-demodulator MCM package embodiments described herein also allow for improved routing of connection traces on PCBs.
Abstract:
A system and method of keyword spotting using two neural networks is disclosed. The system is in sleep mode most of the time, and wakes up periodically. Upon waking, a limited duration of audio is examined. This may be performed using an auxiliary neural network. If any audio activity is detected in this duration, the system fully wakes and examines a longer duration of audio for keywords. The keyword spotting is also performed by the main neural network, which may be a convolutional neural network (CNN).
Abstract:
A system and method of minimizing interference and retries in an environment where two or more network protocols utilize the same frequency spectrum is disclosed. A lower-power network controller is co-located with a WIFI controller. The lower-power network controller parses incoming packets as they are received and generates a request signal once it is determined that the incoming packet is destined for this device. This maximizes the likelihood that no WIFI traffic will occur while the incoming packet is being received.
Abstract:
In one embodiment, an internal buffer may be provided within an integrated circuit (IC) to convert a signal to an output current to be output via a pin of the IC, under control of a switch which can be controlled based on a configuration setting of the IC, and may selectively directly couple the signal to the pin when the IC is coupled to an external driver circuit.
Abstract:
Systems and methods are disclosed for MCM (multiple chip module) packages having multiple stacked demodulator dies that share one or more MCM pins. The shared pins can include clock generation pins, clock input/output pins, receive signal path input pins, voltage supply pins, ground supply pins, and/or any other desired pins. In addition to reducing footprint sizes for printed circuit board (PCB) applications, the multi-demodulator MCM package embodiments described herein also allow for improved routing of connection traces on PCBs.
Abstract:
In one form, an integrated receiver includes a tracking bandpass filter, a tunable lowpass filter, and a mixer formed on a single integrated circuit chip. The tracking bandpass filter has an input for receiving a radio frequency (RF) input signal, and an output, and comprises a variable capacitor having a capacitance that varies in response to a bandpass frequency control signal, in parallel with an integrated inductor. The integrated inductor comprises a plurality of windings formed in a plurality of metal layers. The tunable lowpass filter has an input coupled to the output of the tracking bandpass filter, and an output and having a tuning input for receiving a cutoff frequency signal. The mixer has a signal input coupled to the output of the tunable lowpass filter, a local oscillator input for receiving a local oscillator signal, and a signal output for providing a converted RF signal.
Abstract:
In one embodiment, an internal buffer may be provided within an integrated circuit (IC) to convert a signal to an output current to be output via a pin of the IC, under control of a switch which can be controlled based on a configuration setting of the IC, and may selectively directly couple the signal to the pin when the IC is coupled to an external driver circuit.