公开(公告)号：US11183953B2

公开(公告)日：2021-11-23

申请号：US16152076

申请日：2018-10-04

Applicant: STMicroelectronics S.r.l.

Inventor： Francesco Procopio ,  Attilio Frangi

IPC: H02N2/18 ,  H01L41/113

Abstract: A piezoelectric transducer includes an anchorage and a beam of semiconductor material extending in cantilever fashion from the anchorage in a main direction parallel to a first axis and having a face parallel to a first plane defined by the first axis and by a second axis perpendicular to the first axis. A piezoelectric layer is on the face of the beam. A cross-section of the beam is perpendicular to the first axis and is asymmetrical and shaped so the beam deformations out of the first plane in response to forces applied to the anchorage and oriented parallel to the first axis.

公开(公告)号：US20190044458A1

公开(公告)日：2019-02-07

申请号：US16152076

申请日：2018-10-04

Applicant: STMicroelectronics S.r.l.

Inventor： Francesco Procopio ,  Attilio Frangi

IPC: H02N2/18 ,  H01L41/113

Abstract: A piezoelectric transducer includes an anchorage and a beam of semiconductor material extending in cantilever fashion from the anchorage in a main direction parallel to a first axis and having a face parallel to a first plane defined by the first axis and by a second axis perpendicular to the first axis. A piezoelectric layer is on the face of the beam. A cross-section of the beam is perpendicular to the first axis and is asymmetrical and shaped so the beam deformations out of the first plane in response to forces applied to the anchorage and oriented parallel to the first axis.

公开(公告)号：US10135365B2

公开(公告)日：2018-11-20

申请号：US14980762

申请日：2015-12-28

Applicant: STMicroelectronics S.R.L.

Inventor： Francesco Procopio ,  Attilio Frangi

IPC: H02N2/18 ,  H01L41/113

Abstract: A piezoelectric transducer includes: an anchorage; a beam of semiconductor material, extending in cantilever fashion from the anchorage in a main direction parallel to a first axis and having a face parallel to a first plane defined by the first axis and by a second axis perpendicular to the first axis; and a piezoelectric layer on the face of the beam. A cross-section of the beam perpendicular to the first axis is asymmetrical and is shaped so that the beam presents deformations out of the first plane in response to forces applied to the anchorage and oriented according to the first axis.

公开(公告)号：US10054471B2

公开(公告)日：2018-08-21

申请号：US14498966

申请日：2014-09-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Dario Paci ,  Francesco Procopio ,  Carlo Valzasina ,  Paolo Angelini ,  Francesco Diazzi ,  Roberto Pio Baorda ,  Danilo Karim Kaddouri

IPC: G01N25/18 ,  G01D18/00 ,  G01K13/00 ,  H05B3/16 ,  B81C99/00 ,  G01R33/00 ,  G01R33/09

CPC classification number: G01D18/00 ,  B81B2207/012 ,  B81B2207/03 ,  B81C99/003 ,  G01K13/00 ,  G01R33/0017 ,  G01R33/09 ,  H05B3/16

Abstract: An integrated sensor device including a first die, housing a sensor element to detect a quantity external to the sensor device and transduce the external quantity into an electrical sensing signal; a second die mechanically coupled to the first die so that the first and second dies are stacked on one another along one and the same axis; and at least one heater of a resistive type integrated in the first die and/or in the second die, having a first conduction terminal and a second conduction terminal configured to couple respective first and second conduction terminals of a signal generator for causing an electric current to flow, in use, between the first and second conduction terminals of the heater and generate heat by the Joule effect. It is possible to carry out calibration in temperature of the sensor element.

公开(公告)号：US10031155B2

公开(公告)日：2018-07-24

申请号：US14971155

申请日：2015-12-16

Applicant: STMicroelectronics S.r.l.

Inventor： Francesco Procopio ,  Carlo Valzasina

IPC: G01P15/09 ,  G01L1/16 ,  H01L41/113 ,  H01L41/25 ,  H01L41/27 ,  G01P15/08

Abstract: The piezoelectric sensor is formed in a semiconductor material chip having a surface defining a plane and integrating a structure for sensing forces acting in the plane. The chip is formed by a substrate defining a cantilever having a first end, constrained to an anchorage portion of the substrate, and a second end, which is free to bend under the action of external forces. The cantilever has first and second longitudinal halves, each carrying a respective strip element of piezoelectric material, which extends parallel to the chip plane.

公开(公告)号：US20140077798A1

公开(公告)日：2014-03-20

申请号：US13905006

申请日：2013-05-29

Applicant: STMicroelectronics S.r.l.

Inventor： Lorenzo Baldo ,  Francesco Procopio ,  Sarah Zerbini

IPC: G01R33/028

CPC classification number: G01R33/0286 ,  G01R33/0005 ,  G01R33/028 ,  G01R33/038

Abstract: Two suspended masses are configured so as to be flowed by respective currents flowing in the magnetometer plane in mutually transversal directions and are capacitively coupled to lower electrodes. Mobile sensing electrodes are carried by the first suspended mass and are capacitively coupled to respective fixed sensing electrodes. The first suspended mass is configured so as to be mobile in a direction transversal to the plane in presence of a magnetic field having a component in a first horizontal direction. The second suspended mass is configured so as to be mobile in a direction transversal to the plane in presence of a magnetic field having a component in a second horizontal direction, and the first suspended mass is configured so as to be mobile in a direction parallel to the plane and transversal to the current flowing in the first suspended mass in presence of a magnetic field having a component in a vertical direction.

Abstract translation: 两个悬挂质量被配置为使得在相互横向上在磁力计平面中流动的相应电流流动，并且电容耦合到下电极。 移动感测电极由第一悬浮质量携带并且电容耦合到相应的固定感测电极。 第一悬挂质量被配置为在存在具有在第一水平方向上的分量的磁场的情况下在横向于平面的方向上是可移动的。 第二悬挂质量被配置为在存在具有在第二水平方向上的分量的磁场的情况下在横向于平面的方向上是可移动的，并且第一悬挂质量被配置为在平行于 并且在存在具有在垂直方向上的分量的磁场的情况下横向于在第一悬浮质量块中流动的电流。