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11.发明申请COMMON MODE FILTER FOR IMPROVING MAGNETIC PERMEABILITY AND HIGH FREQUENCY CHARACTERISTICS 有权用于改善磁性渗透性和高频特性的共通滤波器公开(公告)号：US20160307687A1
公开(公告)日：2016-10-20
申请号：US15099921
申请日：2016-04-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chin Mo KIM , Jung Wook SEO , Eun Hye NA , Hak Kwan KIM , Hyung Jin JEON , Sung Yong AN
IPC: H01F27/255 , H01F27/28
CPC classification number: H01F27/255 , H01F1/348 , H01F17/0013 , H01F2017/0093
Abstract: A common mode filter includes a magnetic substrate in which ferrite particles having anisotropy and a planar structure are disposed to have a planar orientation.
Abstract translation: 共模滤波器包括其中具有各向异性的铁氧体颗粒和平面结构设置成具有平面取向的磁性基板。
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公开(公告)号：US20150091688A1
公开(公告)日：2015-04-02
申请号：US14106349
申请日：2013-12-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chang Ryul JUNG , Kang Ryong CHOI , Sung Yong AN
IPC: H01F27/28
CPC classification number: H01F17/0006 , H01F41/041 , H01F41/043 , H01F41/046
Abstract: There is provided a coil sheet including: a base sheet, and a coil unit disposed on the base sheet and including a central conductive part and a surface conductive part formed on surfaces of the central conductive part, wherein when a thickness of the surface conductive part formed on lateral surfaces of the central conductive part is ‘a’ and a thickness of the surface conductive part formed on an upper surface of the central conductive part is ‘b’, a
Abstract translation: 提供了一种线圈片，其包括：基片和设置在基片上并包括中心导电部分的线圈单元和形成在中心导电部分的表面上的表面导电部分，其中当表面导电部分的厚度 形成在中心导电部分的侧表面上的是“a”，并且形成在中心导电部分的上表面上的表面导电部分的厚度为“b”，可以满足a
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13.发明申请公开(公告)号：US20150038079A1
公开(公告)日：2015-02-05
申请号：US14446026
申请日：2014-07-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Kyun KWON , Sung Jae LEE , Hak Kwan KIM , Sung Yong AN
CPC classification number: H04B5/0081 , H01Q1/1257 , H01Q1/243 , H01Q3/24 , H04B5/0087
Abstract: The present invention relates to a device for wireless communication and a method for wireless communication. The device for wireless communication, which consists of a front surface having a display unit for displaying a screen thereon, a back surface opposite to the front surface, and a plurality of side surfaces except the front surface and the back surface, includes: a plurality of antennas provided on one surface selected from the plurality of side surfaces; and a near field communication (NFC) module connected to at least one of the plurality of antennas to transceive data and improves the degree of freedom in designing the device for wireless communication while increasing a read range and a read rate of near field communication.
Abstract translation: 本发明涉及无线通信装置及无线通信方法。 该无线通信装置包括具有用于显示屏幕的显示单元的前表面，与前表面相对的后表面以及除前表面和后表面之外的多个侧表面的多个设备，包括：多个 设置在从所述多个侧表面中选择的一个表面上的天线; 以及连接到所述多个天线中的至少一个天线以接收数据的近场通信（NFC）模块，并且在增加近场通信的读取范围和读取速率的同时提高了设计用于无线通信的设备的自由度。
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公开(公告)号：US20220231430A1
公开(公告)日：2022-07-21
申请号：US17713453
申请日：2022-04-05
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae Yeong KIM , Ji Hyung JUNG , Chin Mo KIM , Sung Nam CHO , Sung Yong AN
Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.
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公开(公告)号：US20220102872A1
公开(公告)日：2022-03-31
申请号：US17547633
申请日：2021-12-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ju Hyoung PARK , Kyu Bum HAN , Jae Yeong KIM , Jeong Ki RYOO , Sung Nam CHO , Sung Yong AN
Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.
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Patent Agency Ranking
公开(公告)号：US20220029274A1
公开(公告)日：2022-01-27
申请号：US17499212
申请日：2021-10-12
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae Yeong KIM , Sung Nam CHO , Sung Yong AN , Ji Hyung JUNG , Chin Mo KIM
Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.
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公开(公告)号：US20210066814A1
公开(公告)日：2021-03-04
申请号：US16732661
申请日：2020-01-02
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jae Yeong KIM , Ji Hyung JUNG , Chin Mo KIM , Sung Nam CHO , Sung Yong AN
Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.
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公开(公告)号：US20210066782A1
公开(公告)日：2021-03-04
申请号：US16743453
申请日：2020-01-15
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Sung Nam CHO , Sung Yong AN , Jae Yeong KIM , Ju Hyoung PARK
Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.
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公开(公告)号：US20210050651A1
公开(公告)日：2021-02-18
申请号：US16738297
申请日：2020-01-09
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ji Hyung JUNG , Sung Yong AN
Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate, a first patch antenna, a second patch antenna, and a feed via. The second ceramic substrate is disposed to oppose the first ceramic substrate. The first patch antenna includes a seed layer, disposed on a surface of the first ceramic substrate, and a plating layer disposed on the seed layer. The second patch antenna disposed on the second ceramic substrate. The feed via includes a seed layer, formed along an internal wall of a via hole penetrating through the first ceramic substrate in a thickness direction, and a conductive material surrounded by the seed layer in the via hole. The seed layer of the first patch antenna and the seed layer of the feed via are connected to each other.
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公开(公告)号：US20210036407A1
公开(公告)日：2021-02-04
申请号：US16828788
申请日：2020-03-24
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Chin Mo KIM , Sung Yong AN , Ji Hyung JUNG , Jae Yeong KIM , Ju Hyoung PARK , Sung Nam CHO
Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.
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