公开(公告)号：US20230223345A1

公开(公告)日：2023-07-13

申请号：US17959780

申请日：2022-10-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangsoo LEE ,  Hyungjoon KIM ,  Eunhyun KIM ,  Hyunggon SHIN

IPC: H01L23/535 ,  H01L27/11556 ,  H01L27/11529 ,  H01L27/11582 ,  H01L27/11573

CPC classification number: H01L23/535 ,  H01L27/11556 ,  H01L27/11529 ,  H01L27/11582 ,  H01L27/11573

Abstract: A semiconductor device includes a first semiconductor structure, and a second semiconductor structure on the first semiconductor structure. The second semiconductor structure includes a substrate having first and second regions, gate electrodes spaced apart from each other on the first region, extending by different lengths and respectively including a pad region having an upper surface exposed upwardly, interlayer insulating layers alternately stacked with the gate electrodes, channel structures penetrating through the gate electrodes, gate contact plugs penetrating through the pad region of each of the gate electrodes and extending into the first semiconductor structure, and an insulating structure alternating with the interlayer insulating layers below each of the pad regions and surrounding the gate contact plugs. The insulating structure includes a first insulating layer and a second insulating layer surrounding at least a portion of the first insulating layer and including a material different from any of the first insulating layer.

公开(公告)号：US20210168598A1

公开(公告)日：2021-06-03

申请号：US17171396

申请日：2021-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonghan PARK ,  Duckey LEE ,  Sangsoo LEE ,  Taesun YEOM ,  Hyewon LEE

IPC: H04W12/04 ,  H04L29/08 ,  H04W8/24 ,  H04W8/20 ,  H04L29/06 ,  H04W12/10 ,  H04L9/32 ,  H04W12/30

Abstract: A method for downloading a profile of an electronic apparatus is provided. The method includes receiving profile information from a profile information transfer server, transmitting a profile request to an identified profile providing server based on the profile information, and receiving a profile installable in a universal integrated circuit card (UICC) of the electronic apparatus from the profile providing server, and an electronic apparatus. Further, the present disclosure may provide a profile information providing server providing the profile information to the electronic apparatus and an operation thereof, and a profile providing server providing a profile to the electronic apparatus and an operation thereof Further, the present disclosure may provide a method for swapping a profile between apparatuses, a method for acquiring profile information using code information, a method for modifying a profile providing server, and an apparatus performing the same.

公开(公告)号：US20190357046A1

公开(公告)日：2019-11-21

申请号：US16525327

申请日：2019-07-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonghan PARK ,  Duckey LEE ,  Hyewon LEE ,  Sangsoo LEE

IPC: H04W12/06 ,  H04W12/00 ,  H04W8/20 ,  H04L29/06 ,  H04L9/32 ,  H04W4/60 ,  H04W4/50

Abstract: A profile downloading method and apparatus is provided for a terminal to download and install a profile in a communication system. The communication method of the terminal includes transmitting a first message including information on a profile to be received from a profile provision server; receiving a second message including information indicating whether an encryption code input is required and a first modified encryption code; generating, when the first modified encryption code is successfully authenticated, a second modified encryption code; transmitting to the profile provision server a third message including information requesting to the profile provision server for the second modified encryption code and profile download, and receiving a fourth message including information on the profile from the profile provision server.

公开(公告)号：US20190268765A1

公开(公告)日：2019-08-29

申请号：US16402804

申请日：2019-05-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonghan PARK ,  Duckey LEE ,  Sangsoo LEE ,  Taesun YEOM ,  Hyewon LEE

IPC: H04W12/04 ,  H04L29/08 ,  H04W12/00 ,  H04L9/32 ,  H04W8/24 ,  H04W8/20 ,  H04L29/06 ,  H04W12/10

Abstract: A method for downloading a profile of an electronic apparatus is provided. The method includes receiving profile information from a profile information transfer server, transmitting a profile request to an identified profile providing server based on the profile information, and receiving a profile installable in a universal integrated circuit card (UICC) of the electronic apparatus from the profile providing server, and an electronic apparatus. Further, the present disclosure may provide a profile information providing server providing the profile information to the electronic apparatus and an operation thereof, and a profile providing server providing a profile to the electronic apparatus and an operation thereof. Further, the present disclosure may provide a method for swapping a profile between apparatuses, a method for acquiring profile information using code information, a method for modifying a profile providing server, and an apparatus performing the same.

公开(公告)号：US20170155507A1

公开(公告)日：2017-06-01

申请号：US15325649

申请日：2015-07-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonghan PARK ,  Duckey LEE ,  Sangsoo LEE ,  Songyean CHO

IPC: H04L9/08 ,  H04B1/3816 ,  H04L29/06 ,  H04W8/18

Abstract: The present disclosure relates to a method and a device for installing a profile of an embedded universal integrated circuit boards (eUICC) and, more particularly, to a method and a device for remotely installing mobile communication subscriber information (profile) substituting for a universal integrated circuit boards (UICC), on a security module. The present disclosure relate to a method and a device for installing a profile of an eUICC of a network device, the method comprising the steps of: acquiring at least one of or more profiles encrypted with a first password key and one or more first password keys encrypted with a second password key; and when profile installation for the eUICC starts, transmitting to, at least one eUICC, the one or more encrypted profiles and the one or more encrypted first password keys, wherein the first password key is re-encrypted by the first password key with a third password key and transmitted to the one or more eUICCs and the encrypted profiles are decrypted by the first password key and installed on the one or more eUICCs, respectively.

公开(公告)号：US20170111076A1

公开(公告)日：2017-04-20

申请号：US15292258

申请日：2016-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-Chul CHOI ,  Li-Yeon KANG ,  Kwangmin GIL ,  Jinkeun PARK ,  Min-Woo YOO ,  Sangsoo LEE ,  Min-Jong LIM ,  Jae-Hoon CHOI ,  Chang-Ryong HEO ,  Dongsub KIM ,  Sangkyu LEE

IPC: H04B1/3888

CPC classification number: H04B1/3888 ,  H04B1/38 ,  H04M1/185

Abstract: An electronic device may include: at least one protective member disposed in at least one area of the electronic device; at least one sensor configured to detect the drop of the electronic device; a protective member driving module configured to activate the protective member to change the shape of the protective member according to whether the drop of the electronic device is detected; and at least one processor configured to receive a drop sensing signal detected by the sensor and to control the protective member driving module to change the shape of the protective member.

公开(公告)号：US20160301529A1

公开(公告)日：2016-10-13

申请号：US15096850

申请日：2016-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonghan PARK ,  Duckey LEE ,  Sangsoo LEE ,  Taesun YEOM ,  Hyewon LEE

IPC: H04L9/30 ,  H04L9/08 ,  H04W12/04 ,  H04L29/06 ,  H04W8/24 ,  H04L29/08

CPC classification number: H04W12/04 ,  H04L9/3247 ,  H04L63/126 ,  H04L67/26 ,  H04L67/303 ,  H04W8/183 ,  H04W8/205 ,  H04W8/245 ,  H04W12/10

Abstract: A method for downloading a profile of an electronic apparatus is provided. The method includes receiving profile information from a profile information transfer server, transmitting a profile request to an identified profile providing server based on the profile information, and receiving a profile installable in a universal integrated circuit card (UICC) of the electronic apparatus from the profile providing server, and an electronic apparatus. Further, the present disclosure may provide a profile information providing server providing the profile information to the electronic apparatus and an operation thereof, and a profile providing server providing a profile to the electronic apparatus and an operation thereof. Further, the present disclosure may provide a method for swapping a profile between apparatuses, a method for acquiring profile information using code information, a method for modifying a profile providing server, and an apparatus performing the same.

Abstract translation: 提供一种用于下载电子设备的简档的方法。 该方法包括从简档信息传送服务器接收简档信息，基于简档信息向所识别的简档提供服务器发送简档请求，以及从简档中接收可安装在电子设备的通用集成电路卡（UICC）中的简档 提供服务器和电子设备。 此外，本公开可以提供向电子设备提供简档信息的简档信息提供服务器及其操作，以及向电子设备提供简档的简档提供服务器及其操作。 此外，本公开可以提供用于在设备之间交换简档的方法，用于使用代码信息获取简档信息的方法，用于修改简档提供服务器的方法，以及执行该配置文件的设备的方法。

公开(公告)号：US20250063338A1

公开(公告)日：2025-02-20

申请号：US18935776

申请日：2024-11-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heejeong CHO ,  Sanghwi LEE ,  Jeongdon KANG ,  Killyeon KIM ,  Jaehyeon SEO ,  Sangsoo LEE ,  Yoonjung JUNG

IPC: H04W8/18 ,  H04L9/40 ,  H04L67/51 ,  H04M1/72412 ,  H04W4/50 ,  H04W4/60 ,  H04W4/80 ,  H04W12/041 ,  H04W12/06 ,  H04W12/30 ,  H04W12/42 ,  H04W52/02 ,  H04W76/11 ,  H04W76/14 ,  H04W76/15 ,  H04W88/04 ,  H04W88/06

Abstract: An entitlement server establishes a communication connection with a user equipment and receives from the user equipment a first request for a specific service activation through a communication connection. The first request includes information indicating whether to activate the specific service and the specific service is for transmitting and/or receiving a call via a cellular communication connection with a telephone number of the user equipment at an external electronic device connected, via a short-range communication connection, with the user equipment. A second request for configuration information is received from the user equipment a through the communication connection and includes one or more service identifiers corresponding to one or more services, including the specific service, available to the external electronic device. Subsequent to transmission of the first request and/or the second request, the entitlement server transmits to the user equipment the configuration information associated with the activated specific service available to the external electronic device.

公开(公告)号：US20240334180A1

公开(公告)日：2024-10-03

申请号：US18741677

申请日：2024-06-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kangjin YOON ,  Jonghan PARK ,  Duckey LEE ,  Sangsoo LEE ,  Hyewon LEE ,  Jinkyu HAN ,  Sujung KANG ,  Youngsun RYU

IPC: H04W8/24 ,  H04L67/303 ,  H04W4/50 ,  H04W4/70 ,  H04W88/02

CPC classification number: H04W8/245 ,  H04W4/50 ,  H04L67/303 ,  H04W4/70 ,  H04W88/02

Abstract: The present disclosure relates to a communication scheme and system for the convergence of a 5G communication system for supporting a higher data transfer rate after the 4G system and the IoT technology. The present disclosure may be applied to intelligent services (e.g., a smart home, a smart building, a smart city, a smart car or connected car, healthcare, digital education, retain business, security and safety-related service) based on the 5G communication technology and IoT-related technology. The present disclosure provides methods and apparatus for supporting a profile transfer between terminals and methods and apparatus for supporting easy use of a communication product.

公开(公告)号：US20230123234A1

公开(公告)日：2023-04-20

申请号：US17703201

申请日：2022-03-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keunwook SHIN ,  Kyung-Eun BYUN ,  Sangsoo LEE ,  Changhyun KIM ,  Changseok LEE

IPC: H01L29/786 ,  H01L29/16 ,  H01L27/11597 ,  H01L27/11582

Abstract: Provided is a thin film structure including a substrate, a metal layer on the substrate and spaced apart from the substrate, and a two-dimensional material layer between the substrate and the metal layer. The two-dimensional material layer may be configured to limit and/or block an electron transfer between the substrate and the metal layer. A resistivity of a metal layer on the two-dimensional material layer may be lowered by the two-dimensional material layer.