公开(公告)号：US12237285B2

公开(公告)日：2025-02-25

申请号：US18236545

申请日：2023-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gayoung Kim ,  Hyungsun Jang

IPC: H01L23/00

Abstract: A semiconductor package includes: a semiconductor chip including a chip pad on a first surface; a first insulating layer arranged on the semiconductor chip and including an insulating hole exposing the chip pad; a redistribution pattern including a redistribution via pattern arranged on an internal surface of the first insulating layer configured to define the first insulating hole and on a surface of the chip pad, and a redistribution line pattern arranged on a surface of the first insulating layer; an under bump metal (UBM) conformally arranged along a surface of the redistribution pattern; and a connection terminal arranged on the UBM, wherein the redistribution line pattern and the UBM provide a dummy space of a shape protruding in a direction toward the first surface of the semiconductor chip, and a portion of the connection terminal fills the dummy space.

公开(公告)号：US11967578B2

公开(公告)日：2024-04-23

申请号：US17479042

申请日：2021-09-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaekul Lee ,  Hyungsun Jang ,  Gayoung Kim ,  Minjeong Shin

IPC: H01L23/48 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L24/20 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/2101 ,  H01L2224/2105 ,  H01L2224/221 ,  H01L2224/73101 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: A semiconductor package includes a lower redistribution layer disposed on a lower surface of the semiconductor chip including an insulating laver, a redistribution pattern, a via, an under bump metal (UBM), and a post disposed on the redistribution pattern. The post vertically overlaps with the UBM. A mold layer is on the lower redistribution layer and surrounds the semiconductor chip. A connecting terminal is connected to the UBM. The UBM includes a first section contacting the redistribution pattern, and a second section contacting the insulating layer. The lost has a ring shape having an inner surface and an outer surface when viewed a top view. A maximum width of the inner surface is less than a Maximum width of an upper surface of the first section. A maximum width of the outer surface is greater than the maximum width of the upper surface of the first section.