公开(公告)号：US20160005778A1

公开(公告)日：2016-01-07

申请号：US14730348

申请日：2015-06-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsu Jun

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Provided is a semiconductor package including: a substrate; an image sensor chip disposed on the substrate and including a first surface that faces the substrate and a second surface that is opposed to the first surface; an adhesion layer interposed between the substrate and the image sensor chip; and a first cavity surrounded by the first surface, an upper surface of the substrate and a side surface of the adhesion layer. The first surface includes a first central portion and a first edge portion, the adhesion layer includes a first adhesion part directly contacting the first central portion and a second adhesion part directly contacting the substrate, and the first adhesion part has an area corresponding to about 5% to about 50% of an area of the first surface.

Abstract translation: 提供一种半导体封装，包括：基板; 设置在所述基板上并且包括面向所述基板的第一表面和与所述第一表面相对的第二表面的图像传感器芯片; 插入在基板和图像传感器芯片之间的粘附层; 以及由第一表面围绕的第一腔，衬底的上表面和粘合层的侧表面。 所述第一表面包括第一中心部分和第一边缘部分，所述粘附层包括直接接触所述第一中心部分的第一粘附部分和与所述基底直接接触的第二粘合部分，并且所述第一粘合部分具有对应于约5 ％至约50％的第一表面面积。

公开(公告)号：US11914271B2

公开(公告)日：2024-02-27

申请号：US17845317

申请日：2022-06-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjin Kang ,  Hyunsu Jun ,  Younggyu Jung

IPC: G03B17/17 ,  G02B17/02 ,  H04M1/02 ,  G02B27/10

CPC classification number: G03B17/17 ,  G02B17/023 ,  G02B27/106 ,  H04M1/0264

Abstract: A multi-input folded camera includes a plurality of folding devices, a common lens array, and a sensor. The folding devices change paths lights that are incident to the folding devices and output a plurality of folded lights propagating along a plurality of paths. The common lens array combines the folded lights received through an input surface of the common lens array to output a combined light through an output surface of the common lens array. The sensor is at an optical axis of the common lens array to receive the combined light. Performance of a mobile device including the multi-input folded camera is enhanced by sufficient light amounts using the multiple folding devices and combining the lights through the multiple light paths. In implementing an under display camera (UDC), an entire-region display is supported without an aperture in a display panel.

公开(公告)号：US11380726B2

公开(公告)日：2022-07-05

申请号：US16904895

申请日：2020-06-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunsu Jun

IPC: H01L27/146

Abstract: A sensor device including an interposer including a first via and a lower pad, the lower pad being on a bottom surface of the interposer; an image sensor chip on a top surface of the interposer, the image sensor chip including a logic chip and a sensing chip on the logic chip, the logic chip including first wiring patterns and a second via, and the sensing chip including second wiring patterns; a conductive structure penetrating a portion of the logic chip and the sensing chip, the conductive structure being connected to at least one of the first wiring patterns and at least one of the second wiring patterns; and a passivation layer on an inner surface of the conductive structure, wherein a side surface of the interposer is coplanar with a side surface of the image sensor chip.

公开(公告)号：US11252308B2

公开(公告)日：2022-02-15

申请号：US17336931

申请日：2021-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunsu Jun ,  Kihyun Kwon ,  Seunghak Lee

IPC: H04N5/225

Abstract: A camera module is provided. The camera module includes a substrate; a first camera disposed on the substrate and configured to generate a first image based on a first optical signal; a second camera disposed on the substrate and configured to generate a second image based on a second optical signal; a power management integrated circuit disposed on the substrate and configured to generate a plurality of voltages based on an external power voltage received from an external power supply and provide the plurality of voltages to the first camera and the second camera; a metal fixing member coupled to the first camera and the second camera; and a thermal interface material disposed between the power management integrated circuit and the metal fixing member along a direction perpendicular to an upper surface of the substrate.

公开(公告)号：US20210048605A1

公开(公告)日：2021-02-18

申请号：US16834583

申请日：2020-03-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JIHYUNG LIM ,  Seunghak Lee ,  Hyunsu Jun

IPC: G02B7/09 ,  H04N5/225 ,  G02B13/00

Abstract: A light-folding camera includes a light folding device, a light path control device LPC, a first sensor and a second sensor. The light folding device outputs a folded light propagating in a first horizontal direction substantially perpendicular to a vertical direction by changing a light path of a vertical light that is incident on the light folding device in the vertical direction. The light path control device outputs a first light propagating in the first horizontal direction by passing at least a first portion of the folded light, or outputs a second light propagating in a second horizontal direction substantially perpendicular to the vertical direction by changing a light path of at least a second portion of the folded light. The first sensor receives the first light propagating in the first horizontal direction. The second sensor receives the second light propagating in the second horizontal direction.

公开(公告)号：US20150325611A1

公开(公告)日：2015-11-12

申请号：US14685898

申请日：2015-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsu Jun

IPC: H01L27/146 ,  H01L23/04 ,  H01L27/02 ,  H01L23/538

CPC classification number: H01L27/146 ,  H01L23/04 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5386 ,  H01L24/97 ,  H01L27/0248 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package can include a substrate and a semiconductor chip inside the semiconductor package mounted on the substrate. A first conductive pattern can be on the substrate inside the semiconductor package and can be electrically connected to an input/output of the semiconductor chip. A holder can be on the substrate, where the holder can be configured to provide a recess in which the semiconductor chip is located. An electrically insulating adhesive layer can be configured to electrically insulate the first conductive pattern from an Electric Static Discharge (ESD) source located outside the semiconductor package and configured to adhere the holder to the substrate.

Abstract translation: 半导体封装可以包括衬底和安装在衬底上的半导体封装内部的半导体芯片。 第一导电图案可以在半导体封装内的衬底上，并且可以电连接到半导体芯片的输入/输出。 保持器可以在基板上，其中保持器可以被配置成提供半导体芯片所在的凹部。 电绝缘粘合剂层可以被配置为将第一导电图案与位于半导体封装外部的电静电放电（ESD）源电绝缘并且被配置为将保持器粘附到基板。