公开(公告)号：US11328760B2

公开(公告)日：2022-05-10

申请号：US16527415

申请日：2019-07-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Lee ,  JungSik Kim ,  Youngdae Lee ,  Duyeul Kim ,  Sungmin Yim ,  Kwangil Park ,  Chulsung Park

IPC: G11C11/4072 ,  G11C5/04 ,  H01L25/065 ,  G11C11/408 ,  G11C11/409 ,  H01L23/498 ,  G11C29/02 ,  G11C29/50 ,  G11C7/10

Abstract: A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.

公开(公告)号：US10418087B2

公开(公告)日：2019-09-17

申请号：US15640854

申请日：2017-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyung Lee ,  JungSik Kim ,  Youngdae Lee ,  Duyeul Kim ,  Sungmin Yim ,  Kwangil Park ,  Chulsung Park

IPC: G11C11/4072 ,  H01L25/065 ,  G11C11/408 ,  G11C11/409 ,  H01L23/498 ,  G11C29/02 ,  G11C29/50 ,  G11C5/04 ,  G11C7/10

Abstract: A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.

公开(公告)号：US20190185827A1

公开(公告)日：2019-06-20

申请号：US16224427

申请日：2018-12-18

Applicant: Samsung Electronics Co., Ltd. ,  Korea Advanced Institute of Science and Technology

Inventor： Hongsoon Rhee ,  Kijun Jeong ,  Jaehyung Lee ,  Jinhwan Park ,  Donghoon Hur

IPC: C12N9/10 ,  C12P19/18 ,  C12P19/04

CPC classification number: C12N9/1059 ,  C07K14/195 ,  C12P19/04 ,  C12P19/18 ,  C12Y204/01012

Abstract: Provided is a recombinant microorganism having enhanced cellulose synthase gene stability, a method of producing cellulose by using the recombinant microorganism, and a method of preparing the recombinant microorganism.

公开(公告)号：US20180148696A1

公开(公告)日：2018-05-31

申请号：US15826187

申请日：2017-11-29

Applicant: Samsung Electronics Co., Ltd. ,  Korea Advanced Institute of Science and Technology

Inventor： Jinsuk Lee ,  Kijun Jeong ,  Jaehyung Lee ,  Jiae Yun ,  Jinkyu Kang ,  Goun Kim ,  Jinhwan Park

IPC: C12N9/10 ,  C12P19/04

CPC classification number: C12N9/1059 ,  C12P19/04 ,  C12Y204/01012

Abstract: Provided are a recombinant microorganism including a genetic modification that increases activity of a cellulose synthase, a gene that encodes the cellulose synthase having increased activity, and a method of producing cellulose by using the recombinant microorganism.