公开(公告)号：US20140045288A1

公开(公告)日：2014-02-13

申请号：US13965846

申请日：2013-08-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ki Seok KIM ,  Je Won KIM ,  Ju Bin SEO ,  Seong Seok YANG ,  Sang Seok LEE ,  Joon Sub LEE ,  Jin Bock LEE

IPC: H01L33/58

CPC classification number: H01L33/58 ,  H01L33/0095 ,  H01L2933/0091

Abstract: A method of manufacturing a semiconductor light emitting device includes preparing a light emitting structure including first and second conductivity type semiconductor layers and an active layer interposed therebetween, forming a plurality of seeds on at least one surface of the light emitting structure, and forming a plurality of dome-shaped protrusions by forming optical waveguide groups from the plurality of respective seeds and combining the optical waveguide groups.

Abstract translation: 一种制造半导体发光器件的方法包括制备包括第一和第二导电类型半导体层和介于其间的有源层的发光结构，在发光结构的至少一个表面上形成多个晶种，并形成多个 通过从多个种子形成光波导组合并组合光波导组，从而形成圆顶形突起。