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    Semiconductor package
    11.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US10607971B2

    公开(公告)日：2020-03-31

    申请号：US15968143

    申请日：2018-05-01

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yun Hyeok Im ,  Hee Seok Lee ,  Tae Woo Kang ,  Yeong Seok Kim ,  Kyoung-Min Lee

    IPC: H01L23/34 ,  H01L25/10 ,  H01L23/367 ,  H01L23/538 ,  H01L23/498

    Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.

    METHOD OF DYNAMIC THERMAL MANAGEMENT OF ELECTRONIC DEVICE
    14.
    发明申请
    METHOD OF DYNAMIC THERMAL MANAGEMENT OF ELECTRONIC DEVICE 有权

    公开(公告)号：US20210405670A1

    公开(公告)日：2021-12-30

    申请号：US17471378

    申请日：2021-09-10

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yun-Hyeok Im ,  Myung-Kyoon Yim ,  Wook Kim ,  Kyoung-Min Lee ,  Kyung-Soo Lee

    IPC: G05D23/19 ,  H05K7/20 ,  G01K13/00 ,  G06F1/20

    Abstract: To dynamically manage a temperature of an electronic device, a local temperature is provided by measuring a temperature of a local spot in the electronic device and a reference temperature is provided by measuring a temperature of a reference spot in the electronic device where the reference spot and the local spot are thermally coupled. A target temperature corresponding to a limit value of the reference temperature is adjusted based on the local temperature and a power level of the electronic device is controlled based on the same target temperature. The target temperature may be set to a relatively high value to secure performance of the electronic device when the local temperature is relatively low. Alternatively, the target temperature may be set to a relatively low value to pursue stability of the electronic device when the local temperature is relatively high.

    Semiconductor package
    15.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US11171128B2

    公开(公告)日：2021-11-09

    申请号：US16827936

    申请日：2020-03-24

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yun Hyeok Im ,  Hee Seok Lee ,  Tae Woo Kang ,  Yeong Seok Kim ,  Kyoung-Min Lee

    IPC: H01L23/34 ,  H01L25/10 ,  H01L23/367 ,  H01L23/538 ,  H01L23/498

    Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.

    METHOD OF DYNAMIC THERMAL MANAGEMENT OF ELECTRONIC DEVICE
    17.
    发明申请
    METHOD OF DYNAMIC THERMAL MANAGEMENT OF ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20180259985A1

    公开(公告)日：2018-09-13

    申请号：US15841734

    申请日：2017-12-14

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yun-Hyeok Im ,  Myung-Kyoon Yim ,  Wook Kim ,  Kyoung-Min Lee ,  Kyung-Soo Lee

    IPC: G05D23/19 ,  G01K13/00 ,  H05K7/20

    CPC classification number: G05D23/1931 ,  G01K13/00 ,  G06F1/206 ,  H05K7/20

    Abstract: To dynamically manage a temperature of an electronic device, a local temperature is provided by measuring a temperature of a local spot in the electronic device and a reference temperature is provided by measuring a temperature of a reference spot in the electronic device where the reference spot and the local spot are thermally coupled. A target temperature corresponding to a limit value of the reference temperature is adjusted based on the local temperature and a power level of the electronic device is controlled based on the same target temperature. The target temperature may be set to a relatively high value to secure performance of the electronic device when the local temperature is relatively low. Alternatively, the target temperature may be set to a relatively low value to pursue stability of the electronic device when the local temperature is relatively high.

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