公开(公告)号：US09076881B2

公开(公告)日：2015-07-07

申请号：US14171048

申请日：2014-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun-Hyeok Im ,  Jong-Yeon Kim ,  Tae-Je Cho ,  Un-Byoung Kang

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L24/81 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/06181 ,  H01L2224/11001 ,  H01L2224/13025 ,  H01L2224/13075 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00

Abstract: Provided are a bump structure includes a first bump and a second bump, a semiconductor package including the same, and a method of manufacturing the same. The bump structure includes: first bump provided on a connection pad of a substrate, the first bump including a plurality of nano-wires extending from the connection pad and a body connecting end portions of the plurality of nano-wires; and a second bump provided on the body of the first bump.

Abstract translation: 提供一种凸块结构，包括第一凸块和第二凸块，包括该凸块的半导体封装及其制造方法。 凸块结构包括：设置在基板的连接焊盘上的第一凸块，所述第一凸块包括从所述连接焊盘延伸的多个纳米线和连接所述多个纳米线的端部的主体; 以及设置在第一凸块的主体上的第二凸块。

公开(公告)号：US11782466B2

公开(公告)日：2023-10-10

申请号：US17471378

申请日：2021-09-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun-Hyeok Im ,  Myung-Kyoon Yim ,  Wook Kim ,  Kyoung-Min Lee ,  Kyung-Soo Lee

IPC: G05D23/19 ,  H05K7/20 ,  G01K13/00 ,  G06F1/20

CPC classification number: G05D23/1931 ,  G01K13/00 ,  G06F1/206 ,  H05K7/20

Abstract: To dynamically manage a temperature of an electronic device, a local temperature is provided by measuring a temperature of a local spot in the electronic device and a reference temperature is provided by measuring a temperature of a reference spot in the electronic device where the reference spot and the local spot are thermally coupled. A target temperature corresponding to a limit value of the reference temperature is adjusted based on the local temperature and a power level of the electronic device is controlled based on the same target temperature. The target temperature may be set to a relatively high value to secure performance of the electronic device when the local temperature is relatively low. Alternatively, the target temperature may be set to a relatively low value to pursue stability of the electronic device when the local temperature is relatively high.

公开(公告)号：US20140254092A1

公开(公告)日：2014-09-11

申请号：US14104435

申请日：2013-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun-Hyeok Im ,  Kyol Park ,  Hee-Jung Hwang

IPC: H01L23/34

CPC classification number: H01L23/34 ,  H01L23/145 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49827 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor package and an electronic system including the same include a package board having an electric circuit pattern. A semiconductor chip is mounted on the package board and electrically connected with the circuit pattern of the package board. A non-contact temperature detector is provided with the semiconductor package and detects a temperature of an external heat source without making contact with the external heat source. A temperature controller controls the semiconductor chip according to the temperature of the external heat source that is detected by the non-contact temperature detector.

Abstract translation: 包括该半导体封装的电子系统包括具有电路图案的封装板。 半导体芯片安装在封装板上并与封装板的电路图形电连接。 非接触式温度检测器设置有半导体封装，并且在不与外部热源接触的情况下检测外部热源的温度。 温度控制器根据由非接触式温度检测器检测到的外部热源的温度来控制半导体芯片。

公开(公告)号：US20210405670A1

公开(公告)日：2021-12-30

申请号：US17471378

申请日：2021-09-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun-Hyeok Im ,  Myung-Kyoon Yim ,  Wook Kim ,  Kyoung-Min Lee ,  Kyung-Soo Lee

IPC: G05D23/19 ,  H05K7/20 ,  G01K13/00 ,  G06F1/20

Abstract: To dynamically manage a temperature of an electronic device, a local temperature is provided by measuring a temperature of a local spot in the electronic device and a reference temperature is provided by measuring a temperature of a reference spot in the electronic device where the reference spot and the local spot are thermally coupled. A target temperature corresponding to a limit value of the reference temperature is adjusted based on the local temperature and a power level of the electronic device is controlled based on the same target temperature. The target temperature may be set to a relatively high value to secure performance of the electronic device when the local temperature is relatively low. Alternatively, the target temperature may be set to a relatively low value to pursue stability of the electronic device when the local temperature is relatively high.

公开(公告)号：US20180259985A1

公开(公告)日：2018-09-13

申请号：US15841734

申请日：2017-12-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun-Hyeok Im ,  Myung-Kyoon Yim ,  Wook Kim ,  Kyoung-Min Lee ,  Kyung-Soo Lee

IPC: G05D23/19 ,  G01K13/00 ,  H05K7/20

CPC classification number: G05D23/1931 ,  G01K13/00 ,  G06F1/206 ,  H05K7/20

Abstract: To dynamically manage a temperature of an electronic device, a local temperature is provided by measuring a temperature of a local spot in the electronic device and a reference temperature is provided by measuring a temperature of a reference spot in the electronic device where the reference spot and the local spot are thermally coupled. A target temperature corresponding to a limit value of the reference temperature is adjusted based on the local temperature and a power level of the electronic device is controlled based on the same target temperature. The target temperature may be set to a relatively high value to secure performance of the electronic device when the local temperature is relatively low. Alternatively, the target temperature may be set to a relatively low value to pursue stability of the electronic device when the local temperature is relatively high.

公开(公告)号：US08921990B2

公开(公告)日：2014-12-30

申请号：US14088482

申请日：2013-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyol Park ,  Yun-Hyeok Im

IPC: H05K1/02

CPC classification number: H01L23/3675 ,  H01L21/561 ,  H01L23/367 ,  H01L23/3677 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/8385 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0209 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/0215 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern, at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads, a mold on the circuit board, the mold fixing the IC device to the circuit board, and a surface profile modifier on a surface of the IC device and a surface of the mold, and the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat.

Abstract translation: 半导体封装包括具有内部电路图案和连接到内部电路图案的多个接触焊盘的电路板，电路板上的至少一个集成电路（IC）装置并与接触焊盘接触，模具在 电路板，将IC器件固定到电路板上的模具，以及IC器件表面和模具表面上的表面轮廓改性剂，以及将IC器件和模具的表面积扩大的表面轮廓修改器 散热

公开(公告)号：US11119517B2

公开(公告)日：2021-09-14

申请号：US15841734

申请日：2017-12-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun-Hyeok Im ,  Myung-Kyoon Yim ,  Wook Kim ,  Kyoung-Min Lee ,  Kyung-Soo Lee

IPC: G05D23/19 ,  H05K7/20 ,  G01K13/00 ,  G06F1/20

Abstract: To dynamically manage a temperature of an electronic device, a local temperature is provided by measuring a temperature of a local spot in the electronic device and a reference temperature is provided by measuring a temperature of a reference spot in the electronic device where the reference spot and the local spot are thermally coupled. A target temperature corresponding to a limit value of the reference temperature is adjusted based on the local temperature and a power level of the electronic device is controlled based on the same target temperature. The target temperature may be set to a relatively high value to secure performance of the electronic device when the local temperature is relatively low. Alternatively, the target temperature may be set to a relatively low value to pursue stability of the electronic device when the local temperature is relatively high.

公开(公告)号：US09666503B2

公开(公告)日：2017-05-30

申请号：US14104435

申请日：2013-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun-Hyeok Im ,  Kyol Park ,  Hee-Jung Hwang

IPC: G01J5/00 ,  G01K1/00 ,  G01K7/00 ,  H01L23/34 ,  H01L23/36 ,  H01L23/498 ,  H01L25/10 ,  H01L25/18 ,  H01L23/14

CPC classification number: H01L23/34 ,  H01L23/145 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49827 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor package and an electronic system including the same include a package board having an electric circuit pattern. A semiconductor chip is mounted on the package board and electrically connected with the circuit pattern of the package board. A non-contact temperature detector is provided with the semiconductor package and detects a temperature of an external heat source without making contact with the external heat source. A temperature controller controls the semiconductor chip according to the temperature of the external heat source that is detected by the non-contact temperature detector.

公开(公告)号：US09293389B2

公开(公告)日：2016-03-22

申请号：US14577490

申请日：2014-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyol Park ,  Yun-Hyeok Im

IPC: H01L23/22 ,  H01L23/367 ,  H01L25/065 ,  H01L25/10 ,  H01L21/56 ,  H01L23/00 ,  H05K3/30 ,  H05K1/02 ,  H05K3/28

CPC classification number: H01L23/3675 ,  H01L21/561 ,  H01L23/367 ,  H01L23/3677 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/8385 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0209 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/0215 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern, at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads, a mold on the circuit board, the mold fixing the IC device to the circuit board, and a surface profile modifier on a surface of the IC device and a surface of the mold, and the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat.

Abstract translation: 半导体封装包括具有内部电路图案和连接到内部电路图案的多个接触焊盘的电路板，电路板上的至少一个集成电路（IC）装置并与接触焊盘接触，模具在 电路板，将IC器件固定到电路板上的模具，以及IC器件表面和模具表面上的表面轮廓改性剂，以及将IC器件和模具的表面积扩大的表面轮廓修改器 散热