公开(公告)号：US11355365B2

公开(公告)日：2022-06-07

申请号：US16761905

申请日：2018-12-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon Lee ,  Byunghoon Lee ,  Min Park ,  Kyungwoon Jang ,  Jeonggen Yoon ,  Hyuntae Jang

IPC: H01L21/67 ,  B65G47/90 ,  H01L25/075

Abstract: Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.

公开(公告)号：US11189675B2

公开(公告)日：2021-11-30

申请号：US16680764

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu Chung ,  Changjoon Lee ,  Kyungwoon Jang ,  Gyun Heo ,  Youngjun Moon ,  Kwangrae Jo ,  Soonmin Hong ,  Daesuck Hwang

IPC: H01L27/32 ,  H01L27/15 ,  H05B33/10 ,  H05B45/20

Abstract: A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.

公开(公告)号：US12205977B2

公开(公告)日：2025-01-21

申请号：US17524421

申请日：2021-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daesuck Hwang ,  Kyungwoon Jang ,  Changkyu Chung ,  Gyun Heo ,  Soonmin Hong

IPC: H01L27/15 ,  G09G3/32 ,  H01L33/00 ,  H01L25/16

Abstract: A display module and a display apparatus including the same are provided. The display module includes a first substrate; a plurality of micro-pixel controllers provided on an upper surface of the first substrate and including a second substrate; a plurality of pixels including a plurality of inorganic light emitting diodes (LEDs) provided on an upper surface of the second substrate; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein each pixel of the plurality of pixels includes at least two inorganic LEDs among the plurality of inorganic LEDs, and wherein each micro-pixel controller of the plurality of micro-pixel controllers is electrically connected to inorganic LEDs of at least two pixels.

公开(公告)号：US20240421279A1

公开(公告)日：2024-12-19

申请号：US18813979

申请日：2024-08-23

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Changjoon LEE ,  Kyungwoon Jang ,  Yangsoo Son ,  Jeongyun Kim ,  Sungyong Min ,  Daesuck Hwang

IPC: H01L33/62 ,  H01L25/16

Abstract: A method for repairing a display module on which light emitting diodes are arranged, includes: removing a defective light emitting diode from among the light emitting diodes from the display module; forming an elastic conductive pad on a panel electrode of the display module that is exposed as the defective light emitting diode is removed; transferring a new light emitting diode to the display module for electrical connection to the elastic conductive pad; covering the new light emitting diode and the elastic conductive pad with a protective layer; and curing the protective layer to maintain an elastic bond between the new light emitting diode and the elastic conductive pad.

公开(公告)号：US12033995B2

公开(公告)日：2024-07-09

申请号：US18134908

申请日：2023-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu Chung ,  Gyun Heo ,  Tackmo Lee ,  Kyungwoon Jang ,  Soonmin Hong ,  Daesuck Hwang

IPC: H01L25/16 ,  G09G3/32 ,  H01L33/62

CPC classification number: H01L25/167 ,  G09G3/32 ,  H01L33/62 ,  G09G2300/026 ,  G09G2300/0426 ,  G09G2300/0452 ,  G09G2300/0842

Abstract: A display module, including a plurality of pixels, includes: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages. Each of the plurality of micro pixel packages includes a second substrate; a plurality of inorganic light emitting devices provided on an upper surface of the second substrate; and a micro pixel controller provided on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices.

公开(公告)号：US11742358B2

公开(公告)日：2023-08-29

申请号：US17383992

申请日：2021-07-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwoon Jang ,  Wonsoon Park ,  Dongmyung Son ,  Sangmin Shin ,  Changjoon Lee ,  Youngki Jung ,  Seongphil Cho ,  Gyun Heo ,  Soonmin Hong

IPC: H01L27/12 ,  H01L25/16

CPC classification number: H01L27/124 ,  H01L25/167

Abstract: A display panel is provided. The display panel according to an embodiment includes a thin film transistor glass substrate, a plurality of micro light emitting diodes (LEDs) arranged on one surface of the thin film transistor glass substrate, and a plurality of side wirings formed at an edge of the thin film transistor glass substrate to electrically connect the one surface of the thin film transistor glass substrate to an opposite surface to the one surface.

公开(公告)号：US11056630B2

公开(公告)日：2021-07-06

申请号：US16786514

申请日：2020-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soonmin Hong ,  Gyuhwa Kim ,  Jeonggen Yoon ,  Tackmo Lee ,  Gyun Heo ,  Youngjun Moon ,  Kyungwoon Jang

IPC: H01L33/62 ,  H01L27/12 ,  H01L25/16

Abstract: A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.