公开(公告)号：US20230315293A1

公开(公告)日：2023-10-05

申请号：US18206068

申请日：2023-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Manu AWASTHI ,  Robert BRENNAN

IPC: G06F3/06

CPC classification number: G06F3/061 ,  G06F3/0631 ,  G06F3/0685

Abstract: According to one general aspect, a memory management unit (MMU) may be configured to interface with a heterogeneous memory system that comprises a plurality of types of storage mediums. Each type of storage medium may be based upon a respective memory technology and may be associated with performance characteristic(s). The MMU may receive a data access for the heterogeneous memory system. The MMU may also determine at least one of the storage mediums of the heterogeneous memory system to service the data access. The target storage medium may be selected based upon at least one performance characteristic associated with the target storage medium and a quality of service tag that is associated with the virtual machine and that indicates one or more performance characteristics. The MMU may route the data access by the virtual machine to the at least one of the storage mediums.

公开(公告)号：US20210311637A1

公开(公告)日：2021-10-07

申请号：US17347550

申请日：2021-06-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Siamack HAGHIGHI ,  Robert BRENNAN

IPC: G06F3/06 ,  G06F12/06

Abstract: According to one general aspect, an apparatus may include a processor, a heterogeneous memory system, and a memory interconnect. The processor may be configured to perform a data access on data stored in a memory system. The heterogeneous memory system may include a plurality of types of storage mediums. Each type of storage medium may be based upon a respective memory technology and may be associated with one or more performance characteristics. The heterogeneous memory system may include both volatile and non-volatile storage mediums. The memory interconnect may be configured to route the data access from the processor to at least one of the storage mediums based, at least in part, upon the one or more performance characteristic associated with the respective memory technologies of the storage media.

公开(公告)号：US20150185814A1

公开(公告)日：2015-07-02

申请号：US14292785

申请日：2014-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Zhan PING ,  Robert BRENNAN ,  Jason MARTINEAU

IPC: G06F1/32 ,  G06F1/26

CPC classification number: G06F1/329 ,  G06F1/206 ,  Y02D10/16 ,  Y02D10/24

Abstract: Embodiments of the present inventive concept relate to systems and methods for dynamically allocating and/or redistributing thermal budget to each processor from a total processor thermal budget based on the workload of each processor. In this manner, the processor(s) having a higher workload can receive a higher thermal budget. The allocation can be dynamically adjusted over time. The individual and overall processor performance increases while efficiently allocating the total thermal budget. By dynamically sharing the total thermal budget of the system, the performance of the system as a whole is increased, thereby lowering, for example, the total cost of ownership (TCO) of datacenters.

Abstract translation: 本发明构思的实施例涉及用于基于每个处理器的工作负荷从总处理器热预算动态地分配和/或再分配热预算到每个处理器的系统和方法。 以这种方式，具有较高工作负载的处理器可以接收更高的热预算。 分配可以随时间动态调整。 个体和整体处理器性能提高，同时有效分配总体热预算。 通过动态共享系统的总体热预算，整个系统的性能提高，从而降低了数据中心的总拥有成本（TCO）。