Handover method and apparatus in wireless communication system supporting eICIC function

    公开(公告)号:US11259226B2

    公开(公告)日:2022-02-22

    申请号:US16486713

    申请日:2018-02-28

    Inventor: Wook Kim

    Abstract: The present invention relates to a handover method and apparatus in a wireless communication system supporting an eICIC function. A communication method of a first base station in a heterogeneous network wireless communication system, which includes the first base station and a second base station and supports a cell range expansion (CRE) function, comprises the steps of: monitoring whether the cell range expansion function is deactivated; when the deactivation of the cell range expansion function is detected, generating a handover request message; and transmitting the handover request message to the second base station.

    Method of dynamic thermal management of electronic device

    公开(公告)号:US11119517B2

    公开(公告)日:2021-09-14

    申请号:US15841734

    申请日:2017-12-14

    Abstract: To dynamically manage a temperature of an electronic device, a local temperature is provided by measuring a temperature of a local spot in the electronic device and a reference temperature is provided by measuring a temperature of a reference spot in the electronic device where the reference spot and the local spot are thermally coupled. A target temperature corresponding to a limit value of the reference temperature is adjusted based on the local temperature and a power level of the electronic device is controlled based on the same target temperature. The target temperature may be set to a relatively high value to secure performance of the electronic device when the local temperature is relatively low. Alternatively, the target temperature may be set to a relatively low value to pursue stability of the electronic device when the local temperature is relatively high.

    Method of dynamic thermal management of electronic device

    公开(公告)号:US11782466B2

    公开(公告)日:2023-10-10

    申请号:US17471378

    申请日:2021-09-10

    CPC classification number: G05D23/1931 G01K13/00 G06F1/206 H05K7/20

    Abstract: To dynamically manage a temperature of an electronic device, a local temperature is provided by measuring a temperature of a local spot in the electronic device and a reference temperature is provided by measuring a temperature of a reference spot in the electronic device where the reference spot and the local spot are thermally coupled. A target temperature corresponding to a limit value of the reference temperature is adjusted based on the local temperature and a power level of the electronic device is controlled based on the same target temperature. The target temperature may be set to a relatively high value to secure performance of the electronic device when the local temperature is relatively low. Alternatively, the target temperature may be set to a relatively low value to pursue stability of the electronic device when the local temperature is relatively high.

    Arithmetic circuit, and neural processing unit and electronic apparatus including the same

    公开(公告)号:US11435981B2

    公开(公告)日:2022-09-06

    申请号:US16847872

    申请日:2020-04-14

    Abstract: An arithmetic circuit includes an input buffer latching each of a plurality of input signals, sequentially input, and sequentially outputting a plurality of first addition signals and a plurality of second addition signals based on the plurality of input signals; a first ripple carry adder (RCA) performing a first part of an accumulation operation on the first addition signals to generate a carry; a flip-flop; a second RCA performing a second part of the accumulation operation on the second addition signals and an output of the flop-flop; the first RCA latching the carry in the flip-flop after the accumulation operation is performed; and an output buffer latching an output signal of the first RCA and an output signal of the second RCA, and outputting a sum signal representing a sum of the plurality of input signals.

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