公开(公告)号：US20250081688A1

公开(公告)日：2025-03-06

申请号：US18951127

申请日：2024-11-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mingyu LEE ,  Eunhye KIM ,  Sangmoo PARK ,  Jamyeong KOO ,  Sera KWON ,  Byunghoon LEE ,  Yoonsuk LEE ,  Changkyu CHUNG

IPC: H01L33/56 ,  H01L25/075 ,  H01L33/62

Abstract: A display module includes a plurality of inorganic light-emitting elements, a substrate including a mounting surface on which the plurality of inorganic light-emitting elements are mounted, and a non-conductive film (NCF) disposed on the substrate and configured to bond the plurality of inorganic light-emitting elements to the substrate. The NCF may have a black-based color.

公开(公告)号：US20220069061A1

公开(公告)日：2022-03-03

申请号：US17523281

申请日：2021-11-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye KIM ,  Doyoung KWAG ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

IPC: H01L27/32

Abstract: A display module includes a substrate; light emitting diodes, first connection pads, second connection pads, and side wirings. The light emitting diodes are arranged on one surface of the substrate. The first connection pads are formed on the one surface of the substrate. The second connection pads are formed on an opposite surface of the one surface. The side wirings are formed on each of a first edge of the substrate and a second edge of the substrate that is adjacent to the first edge. The side wirings electrically couple the first connection pads on the one surface of the substrate with respective ones of the second connection pads on the opposite surface.

公开(公告)号：US20200161405A1

公开(公告)日：2020-05-21

申请号：US16681290

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye KIM ,  Doyoung KWAG ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

IPC: H01L27/32

Abstract: A display module and a large format display apparatus incorporating the display module are provided. The display module includes a thin film transistor substrate, light emitting diodes arranged on one surface of the thin film transistor substrate, and side wirings formed on each of a first edge of the thin film transistor substrate and a second edge of the thin film transistor substrate that is adjacent to the first edge, to electrically couple components on the one surface of the thin film transistor substrate with components on an opposite surface of the one surface respectively.

公开(公告)号：US20190304816A1

公开(公告)日：2019-10-03

申请号：US16282581

申请日：2019-02-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Sangmoo PARK ,  Yoonsuk LEE

IPC: H01L21/67 ,  H01L21/687 ,  H01L33/62 ,  H01L25/075

Abstract: A chip transfer device is provided. The chip transfer device according to an embodiment includes a support, a plurality of pick-up modules disposed on the support in a horizontal direction, and movably connected to the support, and a controller configured to control the plurality of pick-up modules, wherein each of the plurality of pick-up modules is movable while collectively picking up a plurality of chips on a corresponding wafer among a plurality of wafers, and wherein the controller moves and adjusts the plurality of pick-up modules in a horizontal direction.

公开(公告)号：US20250096177A1

公开(公告)日：2025-03-20

申请号：US18962923

申请日：2024-11-27

Applicant: SAMSUNG ELECTRONICS CO, LTD

Inventor： Yoonsuk LEE ,  Eunhye KIM ,  Dongyeob LEE ,  Sangmoo PARK

IPC: H01L23/00 ,  H01L25/075 ,  H01L25/16 ,  H01L33/62

Abstract: A display module includes: a plurality of light emitting diodes; a substrate having a plurality of indium-tin oxide (ITO) electrodes disposed thereon, the plurality of ITO electrodes being connected to electrodes of the plurality of light emitting diodes; and an assembly configured to connect the electrodes of the plurality of light emitting diodes and the plurality of ITO, wherein the assembly comprises a silver (Ag) paste to be applied on the plurality of ITO electrodes, and the electrodes of the plurality of light emitting diodes and the plurality of ITO electrodes of the substrate may be bonded by eutectic bonding through the assembly during thermal compression bonding.

公开(公告)号：US20240194840A1

公开(公告)日：2024-06-13

申请号：US18410670

申请日：2024-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunhye KIM ,  Mingyu LEE ,  Yoonsuk LEE ,  Seungryong HAN

IPC: H01L33/58 ,  H01L25/16

CPC classification number: H01L33/58 ,  H01L25/167

Abstract: A display module includes a display substrate, a plurality of light emitting diodes (LEDs) provided on the substrate, an adhesive layer provided on a first surface of the substrate on which the plurality of LEDs are provided, and an optical film connected to the substrate by the adhesive layer and configured to increase luminous intensity by scattering light emitted by the plurality of LEDs.

公开(公告)号：US20230387372A1

公开(公告)日：2023-11-30

申请号：US18205312

申请日：2023-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonsuk LEE ,  Eunhye KIM ,  Sangmoo PARK ,  Jamyeong KOO ,  Sera KWON ,  Byunghoon LEE ,  Changkyu CHUNG

IPC: H01L33/62 ,  H01L25/16 ,  H01L33/58 ,  H01L23/00

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/58 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L2224/30505 ,  H01L2224/30517 ,  H01L2224/3003 ,  H01L2224/3011 ,  H01L2224/32145 ,  H01L2924/12041 ,  H01L2224/2919 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2924/0132

Abstract: Provided is a display assembly including a plurality of light emitting diodes, a plurality of electrodes provided on the plurality of light emitting diodes, a substrate, a plurality of electrode pads provided on the substrate, the plurality of electrode pads being connected to the electrodes provided on the plurality of light emitting diodes, and an adhesive layer fixing the plurality of light emitting diodes to the substrate, wherein the adhesive layer includes a non-conductive polymer resin, a flux agent mixed with the non-conductive polymer resin, and a plurality of conductive particles dispersed in the non-conductive polymer resin and connecting the electrodes of the light emitting diodes and the plurality of electrode pads.

公开(公告)号：US20220173270A1

公开(公告)日：2022-06-02

申请号：US17674520

申请日：2022-02-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonsuk LEE ,  Sangmoo Park ,  Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Minsub Oh ,  Dongyeob Lee

IPC: H01L33/00 ,  H01L33/62

Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.

公开(公告)号：US20210288209A1

公开(公告)日：2021-09-16

申请号：US17258061

申请日：2019-07-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung KWAG ,  Byungchul KIM ,  Minsub OH ,  Sangmoo PARK ,  Eunhye KIM ,  Yoonsuk LEE

IPC: H01L33/00 ,  H01L27/15

Abstract: An electronic device is disclosed. The electronic device comprises: a transfer device capable of moving, to a target substrate, a plurality of LEDs arranged in a transfer substrate, and arranging same; a storage unit in which feature information of each of the plurality of LEDs is stored; and a processor for controlling the transfer device such that each of a plurality of LEDs is arranged in an arrangement location on the target substrate of each of a plurality of LEDs on the basis of the stored feature information.

公开(公告)号：US20200312822A1

公开(公告)日：2020-10-01

申请号：US16808558

申请日：2020-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhye KIM ,  Doyoung KWAG ,  Byungchul KIM ,  Sangmoo PARK ,  Minsub OH ,  Dongyeob LEE ,  Yoonsuk LEE

IPC: H01L25/075 ,  H01L33/62

Abstract: A method of manufacturing a display module is provided. The method may include providing a substrate including a pixel region on which a plurality of electrodes are disposed and a peripheral region that is a region other than the pixel region on the substrate; forming an adhesive layer on the pixel region of the substrate; transferring a plurality of micro light emitting diodes (LEDs) onto the adhesive layer; pre-curing the adhesive layer to shift the adhesive layer on the pixel region to the peripheral region; and bonding the plurality of micro LEDs to the plurality of electrodes.