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    Communication method and apparatus using multiple channels in unlicensed band
    11.
    发明授权
    Communication method and apparatus using multiple channels in unlicensed band 有权

    公开(公告)号：US11051337B2

    公开(公告)日：2021-06-29

    申请号：US16565305

    申请日：2019-09-09

    Applicant: Samsung Electronics Co., Ltd. ,  Seoul National University R&DB Foundation

    Inventor： Byounghoon Jung ,  Jihoon Kim ,  Sunghyun Choi ,  Kangjin Yoon ,  Jaehong Yi

    IPC: H04W74/08 ,  H04W16/14

    Abstract: A communication method using a plurality of channels in a wireless communication system supporting an unlicensed band. The communication method includes: performing listen-before-talk (LBT) for transmitting a random access preamble on each of a plurality of control channels supported by a user equipment (UE), from among a plurality of control channels supported by a base station; transmitting a random access preamble through a control channel where the LBT succeeded from among the plurality of control channels where the LBT for transmitting the random access preamble is performed; and receiving a random access response (RAR) through a control channel determined according to a result of the LBT performed by the base station, from among the plurality of control channels supported by the UE, wherein a control channel is a channel through which a control signal and a data signal are transmitted and received.

    Contact structure for coupling with external electronic device and electronic device including same
    13.
    发明授权
    Contact structure for coupling with external electronic device and electronic device including same 有权

    公开(公告)号：US12265422B2

    公开(公告)日：2025-04-01

    申请号：US18168279

    申请日：2023-02-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jinho Lim ,  Heecheul Moon ,  Jihoon Kim ,  Byounguk Yoon

    IPC: G06F1/16

    Abstract: A cover device of an electronic device is provided. The cover device includes a cover housing configured to cover at least a portion of the electronic device in a first state in which the electronic device is electrically coupled to the cover device, and a bracket including a first surface on which a terminal part is disposed and a second surface which faces the cover housing, wherein the bracket includes at least one first magnet disposed adjacent to the first surface and at least one second magnet disposed adjacent to the second surface, the cover housing includes at least one third magnet, and the at least one third magnet is disposed to align with the at least one second magnet in a second state in which the electronic device is electrically isolated from the cover device.

    Display device for performing a charge sharing operation
    14.
    发明授权
    Display device for performing a charge sharing operation 有权

    公开(公告)号：US11810503B2

    公开(公告)日：2023-11-07

    申请号：US17591001

    申请日：2022-02-02

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Taeksu Kwon ,  Jihoon Kim

    IPC: G09G3/3208

    CPC classification number: G09G3/3208 ,  G09G2300/0452 ,  G09G2310/0291 ,  G09G2310/0297 ,  G09G2330/021

    Abstract: A display device including: a display panel including first and second data lines, a first and second pixels connected to first and second data lines in first pixel row, third and fourth pixels connected to the second data line in a second pixel row; and a display driver configured to receive image data including first, second, third and fourth pixel data for the first, second, third and fourth pixels, and provide first, second, third and fourth data voltages corresponding to the first, second, third and fourth pixel data to the first, second, third and fourth pixels through the first and second data lines, the display driver further configured to: calculate average data of the first and second pixel data; and selectively perform a charge sharing operation between the first and second data lines according to whether a first increase/decrease condition and a second increase/decrease condition are satisfied.

    Storage device and system of controlling operation through flow control monitoring
    15.
    发明授权
    Storage device and system of controlling operation through flow control monitoring 有权

    公开(公告)号：US11733872B2

    公开(公告)日：2023-08-22

    申请号：US17706137

    申请日：2022-03-28

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jaehwan Lim ,  Walter Jun ,  Jaeeun Kim ,  Jihoon Kim ,  Kihyeon Myung ,  Hyunjung Yoo ,  Jungwoo Lee

    IPC: G06F3/06 ,  G06F13/42

    CPC classification number: G06F3/0613 ,  G06F3/0656 ,  G06F3/0673 ,  G06F13/4221 ,  G06F2213/0026

    Abstract: A system includes a transmission device and a reception device that are connected through a link. The reception device includes a reception buffer configured to receive and store transaction layer packets and a reception flow controller configured to generate flow control packets by monitoring an occupation state of the reception buffer. The transmission device includes a transmission buffer, a transmission flow controller and a dynamic frequency controller. The transmission buffer stores pending transaction layer packets to be transferred to the reception device. The transmission flow controller controls a flow of transaction layer packets to be transferred to the reception device based on the flow control packets received from the reception device. The dynamic frequency controller controls a frequency of an internal clock signal of the transmission device by monitoring a state of the transmission buffer and a state of the transmission flow controller.

    Unmanned aerial vehicle and method for operating same, and automated guided vehicle for controlling movement of unmanned aerial vehicle
    16.
    发明授权
    Unmanned aerial vehicle and method for operating same, and automated guided vehicle for controlling movement of unmanned aerial vehicle 有权

    公开(公告)号：US11720105B2

    公开(公告)日：2023-08-08

    申请号：US16760168

    申请日：2018-12-17

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Junho Park ,  Sunggu Kwon ,  Jihoon Kim ,  Kyungshik Roh ,  Minsu Lee

    IPC: G05D1/02 ,  B64C39/02 ,  B64D47/08 ,  B64U101/30

    CPC classification number: G05D1/0202 ,  B64C39/02 ,  B64D47/08 ,  B64U2101/30

    Abstract: Various embodiments of the present invention relate to an unmanned aerial vehicle (UAV) and method for operating the same, and an automated guided vehicle (AGV) for controlling movements of the unmanned aerial vehicle. The unmanned aerial vehicle according to various embodiments of the present invention may comprise: a wireless communication circuit; at least one sensor; a processor operatively connected to the wireless communication circuit and the at least one sensor; and a memory operatively connected to the processor, wherein the memory stores instructions that, when executed, cause the processor to: receive a movement command for a movement with respect to the current location of the unmanned aerial vehicle, from an automated guided vehicle located within a predetermined distance from the unmanned aerial vehicle, by using the wireless communication circuit; acquire location-independent sensing information by using the at least one sensor, while the unmanned aerial vehicle moves according to the movement command; and transmit the location-independent sensing information to the automated guided vehicle so as to allow the automated guided vehicle to determine the location of the unmanned aerial vehicle by using the location-independent sensing information.

    Semiconductor package having stacked semiconductor chips
    18.
    发明授权
    Semiconductor package having stacked semiconductor chips 有权

    公开(公告)号：US11244927B2

    公开(公告)日：2022-02-08

    申请号：US16833761

    申请日：2020-03-30

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hyuekjae Lee ,  Jihoon Kim ,  Jihwan Suh ,  Soyoun Lee ,  Jiseok Hong ,  Taehun Kim ,  Jihwan Hwang

    IPC: H01L23/16 ,  H01L25/065 ,  H01L23/00 ,  H01L23/538 ,  H01L23/31

    Abstract: Provided is a semiconductor package including a semiconductor stack including a first lower chip, a second lower chip, a gap filler disposed between the first lower chip and the second lower chip, and a first upper chip disposed on an upper surface of the first lower chip, an upper surface of the second lower chip, and an upper surface of the gap filler, the first lower chip includes first upper surface pads and a first upper surface dielectric layer, the second lower chip includes second upper surface pads and a second upper surface dielectric layer, the first upper chip includes lower surface pads and a lower surface dielectric layer, and an area of an upper surface of each of the second upper surface pads is greater than an area of a lower surface of each of the lower surface pads.

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