公开(公告)号：US20230221504A1

公开(公告)日：2023-07-13

申请号：US18122166

申请日：2023-03-16

Applicant: Samtec, Inc.

Inventor： Jignesh H. SHAH ,  William J. KOZLOVSKY ,  David A. LANGSAM ,  Raymond J. LEE ,  R. Brad BETTMAN ,  Eric Jean ZBINDEN

IPC: G02B6/42

CPC classification number: G02B6/4246

Abstract: An optical block includes a first surface that receives light entering the optical block, a second surface through which the light exits the optical block, and a reflector that reflects light from the first surface towards the second surface. The reflector includes a textured surface that scatters or absorbs some of the light received from the first surface to attenuate the light exiting the optical block through the second surface.

公开(公告)号：US20230178917A1

公开(公告)日：2023-06-08

申请号：US18096605

申请日：2023-01-13

Applicant: Samtec, Inc.

Inventor： John A. MONGOLD ,  Jonathan E. BUCK ,  Jignesh H. SHAH ,  Chadrick P. FAITH ,  Randall E. MUSSER ,  Jean Karlo WILLIAMS BARNET ,  Norman S. MCMORROW

IPC: H01R12/79 ,  H01R13/518

CPC classification number: H01R12/79 ,  H01R13/518

Abstract: A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.

公开(公告)号：US20210265785A1

公开(公告)日：2021-08-26

申请号：US17256763

申请日：2019-07-11

Applicant: Samtec, Inc.

Inventor： John A. MONGOLD ,  Jonathan E. BUCK ,  Jignesh H. SHAH ,  Chadrick P. FAITH ,  Randall E. MUSSER ,  Jean Karlo WILLIAMS BARNET ,  Norman S. MCMORROW

IPC: H01R13/6587 ,  H01R12/59 ,  H01R12/79 ,  H01R13/11

Abstract: A cable connector includes a cable including a center conductor and a housing supporting a portion of the center conductor. An imaginary line divides a cross-section of the center conductor into two semicircles, and when the cable connector is mated with a mating connector, only one of the two semicircles is directly connected with a corresponding contact of the mating connector.

公开(公告)号：US20210257785A1

公开(公告)日：2021-08-19

申请号：US17265845

申请日：2019-10-24

Applicant: Samtec, Inc.

Inventor： Jignesh H. SHAH ,  Jean Karlo WILLIAMS BARNET

IPC: H01R13/6474 ,  H01R12/72

Abstract: A connector includes a housing; a cage surrounding the housing; first contacts that are located in the housing and that transmit high-speed signals; second contacts that are located in the housing, that transmit low-speed signals, and that each include a portion that extends from a top surface of the housing; first cables connected to the first contacts; and second cables connected to the second contacts.

公开(公告)号：US20210194164A1

公开(公告)日：2021-06-24

申请号：US17273364

申请日：2019-09-04

Applicant: SAMTEC, INC.

Inventor： Marc EPITAUX ,  Eric J. ZBINDEN ,  John CORONATI ,  Jignesh H. SHAH ,  Brandon Thomas GORE

IPC: H01R12/73 ,  H01L23/498 ,  H01R13/506 ,  H01R13/631 ,  H05K1/18 ,  H05K1/11 ,  G02B6/42

Abstract: This present disclosure increases the interconnect density by using a different technology approach than the industry is currently using (stamping and molding). By using a MEMS-based technology approach, better geometry and impedance control can be carried out to reduce impedance discontinuities and feature size. Additional concepts include low connector insertion force, no contact wiping, and a precise alignment mechanism between the connector contacts and those on the mating substrate.

公开(公告)号：US20200280145A1

公开(公告)日：2020-09-03

申请号：US16764142

申请日：2018-11-14

Applicant: SAMTEC, INC.

Inventor： Eric ZBINDEN ,  Jignesh H. SHAH

IPC: H01R12/71 ,  H01R12/72 ,  H01R13/187

Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.