公开(公告)号：US20210268625A1

公开(公告)日：2021-09-02

申请号：US17320571

申请日：2021-05-14

Applicant: Seagate Technology LLC

Inventor： Mihaela Ruxandra Baurceanu ,  Chea Phann ,  Kevin Lamber Mayer ,  Ricky Ray Anderson ,  Andrew David Habermas

IPC: B24B53/017 ,  B24B37/20 ,  B24B27/00 ,  B24B37/12 ,  B24B53/12

Abstract: The present disclosure includes one or more resilient members for use in an apparatus used to form lapping plates. The resilient members can permit processing members such as charging elements and shaving blades to conform to irregularities in surface topography of lapping plate platens.

公开(公告)号：US10654146B2

公开(公告)日：2020-05-19

申请号：US15877615

申请日：2018-01-23

Applicant: Seagate Technology LLC

Inventor： Mihaela Ruxandra Baurceanu ,  Ricky Ray Anderson ,  Andrew David Habermas ,  Chea Phann

IPC: B24B37/04 ,  B24B49/00 ,  B24B37/14 ,  B24B37/16 ,  B24B53/017 ,  B24B57/02 ,  B24B37/02 ,  B24B37/10

Abstract: The present disclosure includes charging members for charging abrasive particles into the surface of a lapping plate. The charging members include one or more channels to permit abrasive slurry to flow through when the charging member is in contact with the lapping plate.

公开(公告)号：US10105813B2

公开(公告)日：2018-10-23

申请号：US15133572

申请日：2016-04-20

Applicant: Seagate Technology LLC

Inventor： Raymond Leroy Moudry ,  Mihaela Ruxandra Baurceanu ,  Joel William Hoehn ,  Andrew David Habermas

IPC: B24D18/00 ,  B24B37/14 ,  B24B37/16

Abstract: The present disclosure involves a method of making a lapping plate by electrostatically coating a platen with solid resin powder and abrasive particles followed by curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

公开(公告)号：US10010996B2

公开(公告)日：2018-07-03

申请号：US15133415

申请日：2016-04-20

Applicant: Seagate Technology LLC

Inventor： Raymond Leroy Moudry ,  Mihaela Ruxandra Baurceanu ,  Joel William Hoehn ,  Andrew David Habermas

IPC: B24D3/28 ,  B24B37/14 ,  B24B37/16 ,  B24D18/00

CPC classification number: B24B37/14 ,  B24B37/16 ,  B24D3/28 ,  B24D18/00 ,  B24D2203/00

Abstract: The present disclosure involves a method of making a lapping plate by coating a platen with solid resin powder, abrasive particles, and an aqueous carrier followed by evaporating the aqueous carrier and curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

公开(公告)号：US20170304989A1

公开(公告)日：2017-10-26

申请号：US15133572

申请日：2016-04-20

Applicant: Seagate Technology LLC

Inventor： Raymond Leroy Moudry ,  Mihaela Ruxandra Baurceanu ,  Joel William Hoehn ,  Andrew David Habermas

IPC: B24B37/14 ,  B24D18/00 ,  B24B37/16

CPC classification number: B24B37/14 ,  B24B37/16 ,  B24D18/00

Abstract: The present disclosure involves a method of making a lapping plate by electrostatically coating a platen with solid resin powder and abrasive particles followed by curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

公开(公告)号：US11826881B2

公开(公告)日：2023-11-28

申请号：US17320571

申请日：2021-05-14

Applicant: Seagate Technology LLC

Inventor： Mihaela Ruxandra Baurceanu ,  Chea Phann ,  Kevin Lamber Mayer ,  Ricky Ray Anderson ,  Andrew David Habermas

IPC: B24B53/017 ,  B24B53/12 ,  B24B37/12 ,  B24B37/20 ,  B24B27/00

CPC classification number: B24B53/017 ,  B24B27/0076 ,  B24B37/12 ,  B24B37/20 ,  B24B53/12

Abstract: The present disclosure includes one or more resilient members for use in an apparatus used to form lapping plates. The resilient members can permit processing members such as charging elements and shaving blades to conform to irregularities in surface topography of lapping plate platens.

公开(公告)号：US11020838B2

公开(公告)日：2021-06-01

申请号：US15693837

申请日：2017-09-01

Applicant: Seagate Technology LLC

Inventor： Mihaela Ruxandra Baurceanu ,  Chea Phann ,  Kevin Lamber Mayer ,  Ricky Ray Anderson ,  Andrew David Habermas

IPC: B24B53/017 ,  B24B53/12 ,  B24B37/12 ,  B24B37/20 ,  B24B27/00

Abstract: The present disclosure includes one or more resilient members for use in an apparatus used to form lapping plates. The resilient members can permit processing members such as charging elements and shaving blades to conform to irregularities in surface topography of lapping plate platens.

公开(公告)号：US10792786B2

公开(公告)日：2020-10-06

申请号：US15894081

申请日：2018-02-12

Applicant: Seagate Technology LLC

Inventor： Yuhong Xiong ,  Andrew David Habermas ,  Kok Yen Goh ,  PengKoon Hew

IPC: B24B37/30 ,  B24B37/04 ,  B24B37/005 ,  G11B5/31

Abstract: Embodiments of the present disclosure demonstrate a lapping carrier system for a bar to be lapped. The lapping carrier system may be configured with a single piece insert whose bridge is separated from a plurality of joints of the carrier insert by a varying distance. The varying distance can be greater at a medial portion of the bridge than at an end portion of the bridge to collectively form a parabolic shape. In some embodiments, a lapping insert can include a bridge with its length longer than the bar. In some embodiments in a lapping insert, the centerline between the end joint edge and the end finger edge extends beyond the edge of bar.

公开(公告)号：US20190224806A1

公开(公告)日：2019-07-25

申请号：US15877615

申请日：2018-01-23

Applicant: Seagate Technology LLC

Inventor： Mihaela Ruxandra Baurceanu ,  Ricky Ray Anderson ,  Andrew David Habermas ,  Chea Phann

IPC: B24B37/04 ,  B24B49/00 ,  B24B37/14 ,  B24B37/02 ,  B24B37/16 ,  B24B53/017 ,  B24B57/02

Abstract: The present disclosure includes charging members for charging abrasive particles into the surface of a lapping plate. The charging members include one or more channels to permit abrasive slurry to flow through when the charging member is in contact with the lapping plate.

公开(公告)号：US10290314B1

公开(公告)日：2019-05-14

申请号：US16002581

申请日：2018-06-07

Applicant: Seagate Technology LLC

Inventor： Jeff R. O'Konski ,  Andrew David Habermas ,  Andrew J. Sherve

IPC: G11B5/31 ,  G11B5/48 ,  G11B5/39 ,  G11B5/60

Abstract: The present disclosure involves a row bar that includes a plurality of slider bodies to be lapped. At least one slider body includes at least a first row of a plurality of electrical contact pads; and a second row of a plurality of electrical contact pads. The first row of electrical contact pads extends along the cross-track direction at a first position in a lapping direction. The second row of electrical contact pads extends along the cross-track direction at a second position in the lapping direction. The second row of electrical contact pads are electrically isolated from ground. The present disclosure also involves related methods of locating electrical contact pads on a slider body.