公开(公告)号：US10290314B1

公开(公告)日：2019-05-14

申请号：US16002581

申请日：2018-06-07

Applicant: Seagate Technology LLC

Inventor： Jeff R. O'Konski ,  Andrew David Habermas ,  Andrew J. Sherve

IPC: G11B5/31 ,  G11B5/48 ,  G11B5/39 ,  G11B5/60

Abstract: The present disclosure involves a row bar that includes a plurality of slider bodies to be lapped. At least one slider body includes at least a first row of a plurality of electrical contact pads; and a second row of a plurality of electrical contact pads. The first row of electrical contact pads extends along the cross-track direction at a first position in a lapping direction. The second row of electrical contact pads extends along the cross-track direction at a second position in the lapping direction. The second row of electrical contact pads are electrically isolated from ground. The present disclosure also involves related methods of locating electrical contact pads on a slider body.

公开(公告)号：US08767351B1

公开(公告)日：2014-07-01

申请号：US13755175

申请日：2013-01-31

Applicant: Seagate Technology LLC

Inventor： Leping Li ,  Saravuth Keo ,  Kara L. Maytag ,  Pramit P. Parikh ,  Jeff R. O'Konski ,  Mark A. Herendeen ,  Joel W. Hoehn ,  Roger L. Hipwell ,  Joe J. Schobel ,  John L. Ibele ,  Ralph Marquart ,  Edward Knutson

IPC: G11B5/48

CPC classification number: G11B5/102 ,  G11B5/3169 ,  G11B5/3173 ,  G11B5/4826 ,  G11B2005/0021 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/48644 ,  H01L2224/85012 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2924/12042 ,  H01L2924/20751 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/20306 ,  H01L2924/20307 ,  H01L2924/20308 ,  H01L2924/20309 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The presently disclosed technology describes systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad. The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.

Abstract translation: 目前公开的技术描述了使用超过千分之一英寸直径的金线使用超声波接合能量并且不加热下面的焊盘来获得球接合的系统和方法。 球接合允许使用特别接近相邻微电子结构的特别小的接合焊盘，其限制了具有浅起飞角的其它接合技术的使用。

公开(公告)号：US10672423B2

公开(公告)日：2020-06-02

申请号：US15949192

申请日：2018-04-10

Applicant: Seagate Technology LLC

Inventor： Jeff R. O'Konski ,  Andrew David Habermas ,  Charles J. Mann ,  Greg A. Schmitz

IPC: G11B5/455 ,  G11B5/39

Abstract: The present disclosure involves electronic test structures, and related methods, for use with one or more magnetoresistive elements at least at the wafer stage of slider manufacturing.

公开(公告)号：US20190311733A1

公开(公告)日：2019-10-10

申请号：US15949192

申请日：2018-04-10

Applicant: Seagate Technology LLC

Inventor： Jeff R. O'Konski ,  Andrew David Habermas ,  Charles J. Mann ,  Greg A. Schmitz

IPC: G11B5/455

Abstract: The present disclosure involves electronic test structures, and related methods, for use with one or more magnetoresistive elements at least at the wafer stage of slider manufacturing.