公开(公告)号：US20220085324A1

公开(公告)日：2022-03-17

申请号：US17536301

申请日：2021-11-29

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Toru TAKAYAMA ,  Junya MARUYAMA ,  Yumiko OHNO

IPC: H01L51/52 ,  H01L27/12 ,  H01L27/32 ,  H01L51/56 ,  H01L29/786 ,  H01L51/00

Abstract: To realize a high-performance liquid crystal display device or light-emitting element using a plastic film. A CPU is formed over a first glass substrate and then, separated from the first substrate. A pixel portion having a light-emitting element is formed over a second glass substrate, and then, separated from the second substrate. The both are bonded to each other. Therefore, high integration can be achieved. Further, in this case, the separated layer including the CPU serves also as a sealing layer of the light-emitting element.

公开(公告)号：US20190198803A1

公开(公告)日：2019-06-27

申请号：US16251144

申请日：2019-01-18

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Toru TAKAYAMA ,  Junya MARUYAMA ,  Yumiko OHNO

IPC: H01L51/52 ,  H01L27/12 ,  H01L27/32 ,  H01L29/786 ,  H01L51/56 ,  H01L51/00

CPC classification number: H01L51/5246 ,  H01L27/1214 ,  H01L27/1218 ,  H01L27/1266 ,  H01L27/3244 ,  H01L27/3276 ,  H01L29/78672 ,  H01L51/0097 ,  H01L51/5237 ,  H01L51/5243 ,  H01L51/5253 ,  H01L51/56 ,  H01L2221/68368 ,  H01L2227/326 ,  H01L2251/5323

Abstract: To realize a high-performance liquid crystal display device or light-emitting element using a plastic film. A CPU is formed over a first glass substrate and then, separated from the first substrate. A pixel portion having a light-emitting element is formed over a second glass substrate, and then, separated from the second substrate. The both are bonded to each other. Therefore, high integration can be achieved. Further, in this case, the separated layer including the CPU serves also as a sealing layer of the light-emitting element.

公开(公告)号：US20170125454A1

公开(公告)日：2017-05-04

申请号：US15347967

申请日：2016-11-10

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Toru TAKAYAMA ,  Junya MARUYAMA ,  Yuugo GOTO ,  Hideaki KUWABARA ,  Shunpei YAMAZAKI

IPC: H01L27/12 ,  H01L27/32 ,  H01L21/762 ,  B60R1/00 ,  H01L21/683

CPC classification number: H01L27/1266 ,  B60R1/00 ,  B60R11/0229 ,  B60R11/04 ,  B60R2011/004 ,  B60R2300/202 ,  B60R2300/802 ,  H01L21/6835 ,  H01L21/76251 ,  H01L27/1218 ,  H01L27/3244 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2221/68386 ,  H01L2227/323 ,  H01L2227/326

Abstract: To provide a semiconductor device in which a layer to be peeled is attached to a base having a curved surface, and a method of manufacturing the same, and more particularly, a display having a curved surface, and more specifically a light-emitting device having a light emitting element attached to a base with a curved surface. A layer to be peeled, which contains a light emitting element furnished to a substrate using a laminate of a first material layer which is a metallic layer or nitride layer, and a second material layer which is an oxide layer, is transferred onto a film, and then the film and the layer to be peeled are curved, to thereby produce a display having a curved surface.

公开(公告)号：US20170047359A1

公开(公告)日：2017-02-16

申请号：US15340387

申请日：2016-11-01

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Toru TAKAYAMA ,  Junya MARUYAMA ,  Yumiko OHNO

IPC: H01L27/12

CPC classification number: H01L27/1218 ,  H01L23/291 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/3244 ,  H01L29/66757 ,  H01L29/78603 ,  H01L51/0002 ,  H01L51/0021 ,  H01L51/0024 ,  H01L51/003 ,  H01L2221/68368 ,  H01L2924/0002 ,  Y10S438/928 ,  Y10S438/982 ,  H01L2924/00

Abstract: It is an object of the present invention to provide a peeling method that causes no damage to a layer to be peeled and to allow not only a layer to be peeled with a small surface area but also a layer to be peeled with a large surface area to be peeled entirely. Further, it is also an object of the present invention to bond a layer to be peeled to various base materials to provide a lighter semiconductor device and a manufacturing method thereof. Particularly, it is an object to bond various elements typified by a TFT, (a thin film diode, a photoelectric conversion element comprising a PIN junction of silicon, or a silicon resistance element) to a flexible film to provide a lighter semiconductor device and a manufacturing method thereof.

Abstract translation: 本发明的目的是提供一种不会对被剥离层造成损伤的剥离方法，并且不仅使表面积小的层被剥离，而且还允许具有大表面积的被剥离层 要完全去皮。 此外，本发明的另一个目的是将要剥离的层粘合到各种基材上以提供更轻的半导体器件及其制造方法。 特别地，目的是将由TFT表示的各种元素（薄膜二极管，包含硅的PIN结的光电转换元件或硅电阻元件）粘合到柔性膜上以提供更轻的半导体器件和 其制造方法。

公开(公告)号：US20150194566A1

公开(公告)日：2015-07-09

申请号：US14662551

申请日：2015-03-19

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Toru TAKAYAMA ,  Junya MARUYAMA ,  Yuugo GOTO ,  Yumiko OHNO

IPC: H01L33/00 ,  H01L27/15

CPC classification number: H01L27/1218 ,  H01L21/02175 ,  H01L21/28008 ,  H01L21/324 ,  H01L21/425 ,  H01L21/707 ,  H01L21/823487 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/156 ,  H01L27/3244 ,  H01L29/78603 ,  H01L33/005 ,  H01L33/0054 ,  H01L51/003 ,  H01L51/56 ,  H01L2221/68368 ,  H01L2227/326 ,  H01L2933/0016

Abstract: The present invention provides a simplifying method for a peeling process as well as peeling and transcribing to a large-size substrate uniformly. A feature of the present invention is to peel a first adhesive and to cure a second adhesive at the same time in a peeling process, thereby to simplify a manufacturing process. In addition, the present invention is to devise the timing of transcribing a peel-off layer in which up to an electrode of a semiconductor are formed to a predetermined substrate. In particular, a feature is that peeling is performed by using a pressure difference in the case that peeling is performed with a state in which plural semiconductor elements are formed on a large-size substrate.

Abstract translation: 本发明提供了一种剥离方法的简化方法以及均匀地剥离和转录到大尺寸基板。 本发明的一个特征是剥离第一粘合剂并在剥离过程中同时固化第二粘合剂，从而简化制造过程。 另外，本发明是为了将形成半导体的电极的剥离层转印为规定的基板的时机。 特别地，特征在于，在大尺寸基板上形成有多个半导体元件的状态下进行剥离的情况下，通过使用压差来进行剥离。

公开(公告)号：US20200043381A1

公开(公告)日：2020-02-06

申请号：US16485920

申请日：2018-02-22

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Yosuke TSUKAMOTO ,  Daiki NAKAMURA ,  Daisuke FURUMATSU ,  Kazuhiko FUJITA ,  Kyoichi MUKAO ,  Junya MARUYAMA

IPC: G09F9/30 ,  G09F9/40 ,  H01L51/50 ,  H05B33/06

Abstract: A plurality of display panels having a curved surface are placed in a limited space. Two, or three or more display panels are combined to form one display region having a T-shaped outer edge as one screen, and a driver can curve part of the display panel as appropriate so that the driver can see the screen easily. A first display panel or a second display panel has flexibility and includes a position adjustment function of curving an end portion. That is, by curving part of the display panel, the user can see the display panel easily. The in-car design can also be varied.

公开(公告)号：US20180308867A1

公开(公告)日：2018-10-25

申请号：US16017258

申请日：2018-06-25

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Junya MARUYAMA ,  Toru TAKAYAMA ,  Yumiko OHNO ,  Shunpei YAMAZAKI

IPC: H01L27/12 ,  H01L33/24 ,  H01L33/62 ,  H01L33/56 ,  H01L33/44 ,  H01L21/762 ,  H01L29/786

CPC classification number: H01L27/1218 ,  H01L21/76251 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1266 ,  H01L29/78603 ,  H01L33/24 ,  H01L33/44 ,  H01L33/56 ,  H01L33/62 ,  H01L2221/68368

Abstract: A substrate and a delamination film are separated by a physical means, or a mechanical means in a state where a metal film formed over a substrate, and a delamination layer comprising an oxide film including the metal and a film comprising silicon, which is formed over the metal film, are provided. Specifically, a TFT obtained by forming an oxide layer including the metal over a metal film; crystallizing the oxide layer by heat treatment; and performing delamination in a layer of the oxide layer or at both of the interface of the oxide layer is formed.

公开(公告)号：US20170243895A1

公开(公告)日：2017-08-24

申请号：US15397045

申请日：2017-01-03

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Junya MARUYAMA ,  Toru TAKAYAMA ,  Yumiko OHNO ,  Shunpei YAMAZAKI

IPC: H01L27/12 ,  H01L33/56 ,  H01L33/62 ,  H01L33/24 ,  H01L33/44

CPC classification number: H01L27/1218 ,  H01L21/76251 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1266 ,  H01L29/78603 ,  H01L33/24 ,  H01L33/44 ,  H01L33/56 ,  H01L33/62 ,  H01L2221/68368

Abstract: A substrate and a delamination film are separated by a physical means, or a mechanical means in a state where a metal film formed over a substrate, and a delamination layer comprising an oxide film including the metal and a film comprising silicon, which is formed over the metal film, are provided. Specifically, a TFT obtained by forming an oxide layer including the metal over a metal film; crystallizing the oxide layer by heat treatment; and performing delamination in a layer of the oxide layer or at both of the interface of the oxide layer is formed.

公开(公告)号：US20160133683A1

公开(公告)日：2016-05-12

申请号：US15000710

申请日：2016-01-19

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Toru Takayama ,  Junya MARUYAMA ,  Yumiko OHNO ,  Masakazu MURAKAMI ,  Toshiji HAMATANI ,  Hideaki KUWABARA ,  Shunpei YAMAZAKI

IPC: H01L27/32 ,  H01L27/12 ,  H01L51/52

CPC classification number: H01L27/3276 ,  H01L27/12 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/1266 ,  H01L27/14634 ,  H01L27/14643 ,  H01L27/14683 ,  H01L27/3272 ,  H01L29/66757 ,  H01L29/78603 ,  H01L31/105 ,  H01L51/0024 ,  H01L51/003 ,  H01L51/5212 ,  H01L51/5253 ,  H01L2221/68368

Abstract: (OBJECT) The object is to provide a lightened semiconductor device and a manufacturing method thereof by pasting a layer to be peeled to various base materials.(MEANS FOR SOLVING THE PROBLEM) In the present invention, a layer to be peeled is formed on a substrate, then a seal substrate provided with an etching stopper film is pasted with a binding material on the layer to be peeled, followed by removing only the seal substrate by etching or polishing. The remaining etching stopper film is functioned as a blocking film. In addition, a magnet sheet may be pasted as a pasting member.

Abstract translation: （目的）本发明的目的是提供一种减轻半导体器件及其制造方法，该方法是将待剥离的层粘贴到各种基材上。 （解决问题的手段）在本发明中，在基板上形成被剥离层，然后将具有蚀刻阻挡膜的密封基板上的粘合材料粘贴在被剥离层上，然后仅除去 密封衬底通过蚀刻或抛光。 剩余的蚀刻阻挡膜用作阻挡膜。 此外，可以将磁片作为粘贴部件粘贴。

公开(公告)号：US20220301461A1

公开(公告)日：2022-09-22

申请号：US17830377

申请日：2022-06-02

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Yosuke TSUKAMOTO ,  Daiki NAKAMURA ,  Daisuke FURUMATSU ,  Kazuhiko FUJITA ,  Kyoichi MUKAO ,  Junya MARUYAMA

IPC: G09F9/30 ,  G09F9/40 ,  H01L51/50 ,  H05B33/06

Abstract: A plurality of display panels having a curved surface are placed in a limited space. Two, or three or more display panels are combined to form one display region having a T-shaped outer edge as one screen, and a driver can curve part of the display panel as appropriate so that the driver can see the screen easily. A first display panel or a second display panel has flexibility and includes a position adjustment function of curving an end portion. That is, by curving part of the display panel, the user can see the display panel easily. The in-car design can also be varied.