METHOD FOR FABRICATING SECONDARY BATTERY
    13.
    发明公开

    公开(公告)号:US20230261265A1

    公开(公告)日:2023-08-17

    申请号:US18004749

    申请日:2021-07-13

    CPC classification number: H01M10/0585

    Abstract: One embodiment of the present invention achieves a fabrication method that can automate fabrication of a secondary battery. In addition, a fabrication method that can fabricate a secondary battery efficiently in a short time is achieved. Furthermore, a fabrication method that can fabricate a secondary battery with high yield is achieved. Alternatively, a method for fabricating a large secondary battery with a relatively large size is achieved. An electrolyte is dripped on one or more of a positive electrode, a separator, and a negative electrode; the one or more of the positive electrode, the separator, and the negative electrode are impregnated with the electrolyte; pressure is then reduced; and a stack of the positive electrode, the separator, and the negative electrode is sealed with an exterior film. A plurality of stacks may be arranged on an exterior film; a plurality of drops of an electrolyte may be dripped on the stacks; sealing may be performed under reduced pressure; and then the exterior film may be divided into separate secondary batteries.

    MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20230051739A1

    公开(公告)日:2023-02-16

    申请号:US17783088

    申请日:2020-12-15

    Abstract: To provide a highly reliable memory device. A first insulator is formed over a substrate; a second insulator is formed over the first insulator; a third insulator is formed over the second insulator; an opening penetrating the first insulator, the second insulator, and the third insulator is formed; a fourth insulator is formed on the inner side of a side surface of the first insulator, a side surface of the second insulator, and a side surface of the third insulator, in the opening; an oxide semiconductor is formed on the inner side of the fourth insulator; the second insulator is removed; and a conductor is formed between the first insulator and the third insulator; and the fourth insulator is formed by performing, a plurality of times, a cycle including a first step of supplying a gas containing silicon and an oxidizing gas into a chamber where the substrate is placed, a second step of stopping the supply of the gas containing silicon into the chamber; and a third step of generating plasma containing the oxidizing gas in the chamber.

    Semiconductor Device and Manufacturing Method of the Semiconductor Device

    公开(公告)号:US20220293764A1

    公开(公告)日:2022-09-15

    申请号:US17624934

    申请日:2020-07-08

    Abstract: A transistor with a high on-state current and a semiconductor device with high productivity are provided. A first insulator; a second insulator over the first insulator; a third insulator and a first conductor over the second insulator; a fourth insulator over the third insulator and the first conductor; a fifth insulator over the fourth insulator; a first oxide over the fifth insulator; a second oxide over the first oxide; a third oxide and a fourth oxide over the second oxide; a second conductor over the third oxide; a third conductor over the fourth oxide; a sixth insulator over the second conductor; a seventh insulator over the third conductor; an eighth insulator over the fifth insulator to the seventh insulator; a fifth oxide over the second oxide and positioned between the second conductor and the third conductor; a ninth insulator over the fifth oxide; and a fourth conductor over the ninth insulator are included. Hydrogen concentration of the first conductor is lower than hydrogen concentration of the fourth conductor.

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20210399134A1

    公开(公告)日:2021-12-23

    申请号:US17285401

    申请日:2019-10-17

    Abstract: A semiconductor device having favorable electrical characteristics is provided. The semiconductor device includes a first oxide; a first conductor and a second conductor over the first oxide; a first insulator over the first conductor; a second insulator over the second conductor; a third insulator over the first insulator and the second insulator; a second oxide positioned over the first oxide and between the first conductor and the second conductor; a fourth insulator over the second oxide; a third conductor over the fourth insulator; a fifth insulator in contact with a top surface of the third insulator, a top surface of the second oxide, a top surface of the fourth insulator, and a top surface of the third conductor; a fourth conductor embedded in an opening formed in the first insulator, the third insulator, and the fifth insulator and in contact with the first conductor; and a fifth conductor embedded in an opening formed in the second insulator, the third insulator, and the fifth insulator and in contact with the second conductor. The third insulator includes, in the vicinity of an interface with the fourth conductor and in the vicinity of an interface with the fifth conductor, a region having a higher nitrogen concentration than a different region of the third insulator.

    SOI SUBSTRATE AND MANUFACTURING METHOD THEREOF
    18.
    发明申请
    SOI SUBSTRATE AND MANUFACTURING METHOD THEREOF 有权
    SOI衬底及其制造方法

    公开(公告)号:US20140103409A1

    公开(公告)日:2014-04-17

    申请号:US14134047

    申请日:2013-12-19

    Abstract: An object is to provide an SOI substrate provided with a semiconductor layer which can be used practically even when a glass substrate is used as a base substrate. Another object is to provide a semiconductor device having high reliability using such an SOI substrate. An altered layer is formed on at least one surface of a glass substrate used as a base substrate of an SOI substrate to form the SOI substrate. The altered layer is formed on at least the one surface of the glass substrate by cleaning the glass substrate with solution including hydrochloric acid, sulfuric acid or nitric acid. The altered layer has a higher proportion of silicon oxide in its composition and a lower density than the glass substrate.

    Abstract translation: 本发明的目的是提供一种具有半导体层的SOI衬底,即使在使用玻璃衬底作为基底衬底时也可以实际使用。 另一个目的是提供一种使用这种SOI衬底具有高可靠性的半导体器件。 在用作SOI衬底的基底衬底的玻璃衬底的至少一个表面上形成改变的层,以形成SOI衬底。 通过用包括盐酸,硫酸或硝酸的溶液清洗玻璃基板,在玻璃基板的至少一个表面上形成改变的层。 改变的层在其组成中具有较高比例的氧化硅,并且具有比玻璃基底更低的密度。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20240429319A1

    公开(公告)日:2024-12-26

    申请号:US18817534

    申请日:2024-08-28

    Abstract: A semiconductor device having favorable electrical characteristics is provided. The semiconductor device includes a first oxide; a first conductor and a second conductor over the first oxide; a first insulator over the first conductor; a second insulator over the second conductor; a third insulator over the first insulator and the second insulator; a second oxide positioned over the first oxide and between the first conductor and the second conductor; a fourth insulator over the second oxide; a third conductor over the fourth insulator; a fifth insulator in contact with a top surface of the third insulator, a top surface of the second oxide, a top surface of the fourth insulator, and a top surface of the third conductor; a fourth conductor embedded in an opening formed in the first insulator, the third insulator, and the fifth insulator and in contact with the first conductor; and a fifth conductor embedded in an opening formed in the second insulator, the third insulator, and the fifth insulator and in contact with the second conductor. The third insulator includes, in the vicinity of an interface with the fourth conductor and in the vicinity of an interface with the fifth conductor, a region having a higher nitrogen concentration than a different region of the third insulator.

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