摘要:
Provided is an apparatus for detection timeout of each channel, which is a socket connection, in a Transmission Control Protocol (TCP) Offload Engine (TOE) using TCP accelerating hardware, and a method thereof. The timer managing apparatus of the TOE using the TCP accelerating hardware, including: a command register for receiving a command for a retransmission timer or a delayed ACK timer from an embedded processor of the TOE; a finite state machine (FSM) for storing information of a timer in operation by analyzing the command for the retransmission timer or the delayed ACK timer stored in the command register and controlling an entire operation of the timer managing apparatus; and a timeout checker for checking timeout of a timer in operation by using the stored timer information and notifying the timeout to the FSM.
摘要:
A power semiconductor device having an breakdown voltage improving structure and a manufacturing method thereof are provided. A collector region and a base region create a pn junction between them. At least one accelerating region of the same conductivity type as the collector region is formed spaced from the pn junction and at a dose higher than that of the collector region. A field plate overlaps the pn junction and the accelerating region. The field plate has an edge portion that extends past the accelerating region. When a voltage of a reverse direction is applied to the pn junction, an electric field becomes concentrated on the accelerating region as well as on the pn junction and on the edge portion of the field plate. This increases an electric field distribution area and thus also increases the breakdown voltage.
摘要:
A method for manufacturing a power semiconductor device including a semi-insulating polycrystalline silicon (SIPOS) film is provided. According to this method, first, a conductive collector region is formed in a semiconductor substrate. Then, a first insulating film, which exposes a portion of the semiconductor substrate in which a base region is to be formed, is formed on said semiconductor substrate in which the collector region is formed. A conductive base region is formed in the collector region. A second insulating film is formed over the entire surface of the semiconductor substrate. After exposing a portion of the semiconductor substrate in which an emitter region and a channel stop region are to be formed, impurities for the emitter region are implanted into the base region. Simultaneously, a third insulating film is formed over the entire surface of the semiconductor substrate, while a conductive emitter region is formed by diffusing the impurities. At least one of the first to third insulating films is left only in a field region between the base region and the channel stop region. Parts of the base region, the emitter region, and the channel stop region are exposed after forming a semi-insulating polycrystalline silicon (SIPOS) film on the entire surface of the resultant structure. A base electrode, an emitter electrode, and an equipotential metal ring are then formed, respectively contacting the base region, the emitter region, and the channel stop region.