公开(公告)号：US20080179734A1

公开(公告)日：2008-07-31

申请号：US12018743

申请日：2008-01-23

申请人： Yong-Chai KWON ,  Dong-Ho LEE ,  Sun-Won KANG

发明人： Yong-Chai KWON ,  Dong-Ho LEE ,  Sun-Won KANG

IPC分类号： H01L23/538 ,  H01L21/52

CPC分类号： H01L25/18 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A stacked package includes a printed circuit board (PCB), a plurality of semiconductor chips, plugs and a controller. The semiconductor chips are sequentially stacked on the PCB. The plugs electrically connect each of the semiconductor chips to the PCB. The controller is disposed in any one of the semiconductor chips. The controller is electrically coupled to the plugs. Thus, the controller may be built in the semiconductor chip by a separate process so that a mechanical impact generated in a process for bonding the controller is not applied to the semiconductor chips. Further, a mechanical impact applied to the controller, which is generated in a process for forming a protection member, may be reduced.

摘要翻译： 堆叠式封装包括印刷电路板（PCB），多个半导体芯片，插头和控制器。 半导体芯片依次堆叠在PCB上。 插头将每个半导体芯片电连接到PCB。 控制器设置在任何一个半导体芯片中。 控制器电耦合到插头。 因此，可以通过单独的处理将控制器内置在半导体芯片中，使得在用于接合控制器的处理中产生的机械冲击不应用于半导体芯片。 此外，可以减少在形成保护构件的过程中产生的对控制器的机械冲击。

公开(公告)号：US20070126114A1

公开(公告)日：2007-06-07

申请号：US11562894

申请日：2006-11-22

申请人： Hee-Jin LEE ,  Sun-Won KANG ,  Hae-Hyung LEE

发明人： Hee-Jin LEE ,  Sun-Won KANG ,  Hae-Hyung LEE

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/367 ,  H01L23/3677 ,  H01L2224/16 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079

摘要： In one embodiment, a heat-dissipating member includes a heat-dissipating body, a heat-transferring body and an attaching member. The heat-dissipating body externally dissipates heat originating in a heat source. The heat-transferring member is interposable between the heat-dissipating body and the heat source. The attaching member is placed on a surface of the heat-dissipating body and corresponds to the heat-transferring body so as to couple the heat-transferring member to the heat-dissipating body. Thus, heat generated from the heat source, such as a semiconductor element, rapidly dissipates through the heat-transferring member and externally through the heat-dissipating body.

摘要翻译： 在一个实施例中，散热构件包括散热体，传热体和连接构件。 散热体外部散发源自热源的热量。 传热部件与散热体和热源之间可以相互嵌合。 安装构件放置在散热体的表面上并对应于传热体，以将传热构件耦合到散热体。 因此，从诸如半导体元件的热源产生的热量通过传热构件快速耗散并且在外部通过散热体散发。

公开(公告)号：US20070252257A1

公开(公告)日：2007-11-01

申请号：US11741623

申请日：2007-04-27

申请人： Joong-Hyun BAEK ,  Hee-Jin LEE ,  Hae-Hyung LEE ,  Sun-Won KANG

发明人： Joong-Hyun BAEK ,  Hee-Jin LEE ,  Hae-Hyung LEE ,  Sun-Won KANG

IPC分类号： H01L23/02

CPC分类号： H01L23/3675 ,  H01L23/36 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05085 ,  H01L2224/05548 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01052 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In one embodiment, a semiconductor package structure includes a heat dissipative element connected to an internal circuit. The semiconductor package includes a semiconductor chip, an interconnection substrate, and a heat dissipative element. The semiconductor chip includes an internal circuit and inner pads that connect the internal circuit. The interconnection substrate is disposed below the semiconductor chip and includes input/output terminals. At least one of the inner pads is electrically connected to at least one of the input/output terminals. The heat dissipative element is disposed on the semiconductor chip and is electrically connected to at least one of the inner pads.

摘要翻译： 在一个实施例中，半导体封装结构包括连接到内部电路的散热元件。 半导体封装包括半导体芯片，互连衬底和散热元件。 半导体芯片包括连接内部电路的内部电路和内部焊盘。 互连基板设置在半导体芯片的下方并且包括输入/​​输出端子。 内部焊盘中的至少一个电连接到至少一个输入/输出端子。 散热元件设置在半导体芯片上并与至少一个内部焊盘电连接。