公开(公告)号：US07621969B2

公开(公告)日：2009-11-24

申请号：US11887212

申请日：2006-03-13

申请人： Mutsumi Masumoto ,  Katsumi Terada

发明人： Mutsumi Masumoto ,  Katsumi Terada

IPC分类号： H01L21/00

CPC分类号： H01L21/67109 ,  H01L21/563 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/75 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/15788 ,  Y10T29/41 ,  H01L2924/00

摘要： A mounting system is provided with a substrate loader section, a chip mounting section, and a substrate unloader section for sequentially taking out substrates whereupon chips are mounted. The mounting system is characterized in that the substrate loader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates, a stage heater for heating/heat insulating a substrate is provided, respectively, at a substrate conveying portion from a substrate waiting stage for the chip mounting section to the chip mounting section, at the chip mounting section, and at a substrate conveying portion from the chip mounting section to the substrate unloader section, and the substrate unloader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates whereupon chips are mounted. The substrate can be sustained at a desirable temperature over the substantially entire mounting process having a series of steps, and in particular, occurrence of problems ascribed to moisture absorption can be suppressed or prevented.

摘要翻译： 安装系统设置有基板装载部分，芯片安装部分和基板卸载部分，用于顺序取出安装芯片的基板。 安装系统的特征在于，基板装载部分设置有能够将基板与能够容纳多个基板的基板隔套一起隔热的烘箱，分别设置用于加热/隔热基板的台加热器， 在从芯片安装部的基板等待台到芯片安装部，芯片安装部以及从芯片安装部到基板卸载部的基板输送部的基板输送部，基板卸载部是 提供了能够将基板与能够容纳多个基板并因此安装芯片的基板隔套一起烘烤的炉。 可以在具有一系列步骤的基本上整个安装过程中将基材维持在期望的温度，并且特别地，可以抑制或防止归因于吸湿的问题的发生。

公开(公告)号：US07207679B2

公开(公告)日：2007-04-24

申请号：US10878356

申请日：2004-06-29

申请人： Takahiro Totani ,  Katsumi Terada ,  Hiroki Koba ,  Kazunobu Oketani

发明人： Takahiro Totani ,  Katsumi Terada ,  Hiroki Koba ,  Kazunobu Oketani

IPC分类号： G03B21/14 ,  G03B21/20 ,  F21V17/02 ,  G02F1/1335 ,  H04N9/31

CPC分类号： G03B21/2053

摘要： A video signal processing circuit inputs a video signal to perform processing such as frequency conversion as well as processing for generating data representing the APL (Average Picture Level) of a frame video for each frame period. A microcomputer functions as a dimmer arithmetic block to perform processing for generating dimmer data upon receipt of APL data, and functions as a lamp driver control block to perform processing for sending out a dimmer command to a lamp driver. The lamp driver receives the dimmer command, to control an amount of light emitted from a light source (a lamp).

摘要翻译： 视频信号处理电路输入视频信号以执行诸如频率转换的处理，以及用于在每个帧周期中产生表示帧视频的APL（平均画面电平）的数据的处理。 微计算机用作调光算术块，以在接收到APL数据时执行用于产生调光器数据的处理，并且用作灯驱动器控制块，以执行向灯驱动器发送调光器命令的处理。 灯驱动器接收调光器命令，以控制从光源（灯）发出的光量。

公开(公告)号：US07753253B2

公开(公告)日：2010-07-13

申请号：US11594766

申请日：2006-11-09

申请人： Katsumi Terada ,  Takashi Takei

发明人： Katsumi Terada ,  Takashi Takei

IPC分类号： B29C31/00 ,  H01L23/29 ,  B23K1/012

CPC分类号： H01L21/563 ,  H01L24/28 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01082

摘要： A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser (73) provided in the chamber (52) and discharging underfill agent introduced from the storing means (66, 67) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means (46) for reducing the pressure in the chamber (52) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser (73). The dispensing device (4) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device (4) is also provided by the invention.

摘要翻译： 用于将底部填充剂填充到基板（K）和芯片（C）之间的间隙中的分配装置（4）包括用于存储底部填充剂（66,67）的装置，用于容纳基板（K）的室（52） 装有底部填充剂并且能够打开/关闭;设置在室（52）中的分配器（73），并将从存储装置（66,67）引入的底部填充剂排放到基板（K）和 以及用于在由分配器（73）排出底部填充剂之前以预定的真空压力减小腔室（52）中的压力的​​第一减压装置（46）。 分配装置（4）可以向衬底（K）提供没有气泡的底部填充剂。 本发明还提供使用该分配装置（4）的安装系统。

公开(公告)号：US07506986B2

公开(公告)日：2009-03-24

申请号：US11050787

申请日：2005-01-27

申请人： Hiroki Koba ,  Shinichi Shiotsu ,  Motoshi Tahara ,  Katsumi Terada ,  Hideki Yamamoto

发明人： Hiroki Koba ,  Shinichi Shiotsu ,  Motoshi Tahara ,  Katsumi Terada ,  Hideki Yamamoto

IPC分类号： G03B21/14 ,  G03B21/22 ,  G03B21/20 ,  F21V7/00

CPC分类号： H04N9/3141 ,  F21V7/22 ,  G03B21/2026

摘要： A light source comprises a lamp such as an ultra-high pressure mercury lamp or a metal halide lamp and its irradiated light is emitted after being parallelized by a parabolic reflector. The parabolic reflector is made by pressing metal such as stainless and its light exit side aperture is covered with a transparent plate made of glass, etc. The transparent plate prevents fragments of glass of the lamp and the like from scattering when the lamp bursts. The parabolic reflector does not have an aperture (cut-out) for ventilation, but heat radiation fins are formed on the outer surface of it.

摘要翻译： 光源包括诸如超高压汞灯或金属卤化物灯的灯，并且其辐射光在被抛物面反射器平行化之后被发射。 抛物面反射体是通过压入诸如不锈钢的金属制成的，其光出射侧孔被玻璃制的透明板等覆盖。当灯突然熄灭时，透明板可防止灯泡等碎片散落。 抛物面反射器不具有用于通风的孔（切口），但是散热片在其外表面上形成。

公开(公告)号：US20090011538A1

公开(公告)日：2009-01-08

申请号：US11887212

申请日：2006-03-13

申请人： Mutsumi Masumoto ,  Katsumi Terada

发明人： Mutsumi Masumoto ,  Katsumi Terada

IPC分类号： H01L21/00

CPC分类号： H01L21/67109 ,  H01L21/563 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/75 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/15788 ,  Y10T29/41 ,  H01L2924/00

摘要： A mounting system is provided with a substrate loader section, a chip mounting section, and a substrate unloader section for sequentially taking out substrates whereupon chips are mounted. The mounting system is characterized in that the substrate loader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates, a stage heater for heating/heat insulating a substrate is provided, respectively, at a substrate conveying portion from a substrate waiting stage for the chip mounting section to the chip mounting section, at the chip mounting section, and at a substrate conveying portion from the chip mounting section to the substrate unloader section, and the substrate unloader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates whereupon chips are mounted. The substrate can be sustained at a desirable temperature over the substantially entire mounting process having a series of steps, and in particular, occurrence of problems ascribed to moisture absorption can be suppressed or prevented.

摘要翻译： 安装系统设置有基板装载部分，芯片安装部分和基板卸载部分，用于顺序取出安装芯片的基板。 安装系统的特征在于，基板装载部分设置有能够将基板与能够容纳多个基板的基板隔套一起隔热的烘箱，分别设置用于加热/隔热基板的台加热器， 在从芯片安装部的基板等待台到芯片安装部，芯片安装部以及从芯片安装部到基板卸载部的基板输送部的基板输送部，基板卸载部是 提供了能够将基板与能够容纳多个基板并因此安装芯片的基板隔套一起烘烤的炉。 可以在具有一系列步骤的基本上整个安装过程中将基材维持在期望的温度，并且特别地，可以抑制或防止归因于吸湿的问题的发生。

公开(公告)号：US07279358B2

公开(公告)日：2007-10-09

申请号：US10511986

申请日：2003-04-22

申请人： Akira Yamauchi ,  Katsumi Terada ,  Satoru Naraba ,  Takashi Hare

发明人： Akira Yamauchi ,  Katsumi Terada ,  Satoru Naraba ,  Takashi Hare

IPC分类号： H01L21/00

CPC分类号： H01L24/81 ,  H01L21/67092 ,  H01L24/75 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A mounting method includes the steps of, after positioning objects being bonded relative to each other, moving a movable wall positioned there around until coming into contact with one object holding means to form a local chamber having a local enclosed space, enclosing both objects in the chamber, reducing the pressure in the chamber, moving the object holding means in a direction for reducing the volume of the chamber and moving the movable wall following the movement of the object holding means, and bonding both objects to each other by pressing. Since the bonding part and the vicinity of the bonding part can be locally and efficiently enclosed from the surroundings, and the local chamber can vary the shape of the enclosed space with the bonding operation while maintaining the enclosed state even at the time of bonding.

摘要翻译： 安装方法包括以下步骤：在定位被相对于彼此粘合的物体之后，移动位于其周围的可动壁直到与一个物体保持装置接触以形成具有局部封闭空间的局部室， 室，减小了室中的压力，使物体保持装置沿着减小室的体积的方向移动，并且随着物体保持装置的移动而移动可移动壁，并且通过按压将两个物体彼此粘合。 由于接合部分和接合部分附近可以局部地且有效地从周围环绕，所以局部室也可以在接合时保持封闭状态的同时通过接合操作改变封闭空间的形状。

公开(公告)号：US06462160B1

公开(公告)日：2002-10-08

申请号：US09763849

申请日：2001-02-27

申请人： Masanori Ogawa ,  Katsumi Terada ,  Kuninori Ito

发明人： Masanori Ogawa ,  Katsumi Terada ,  Kuninori Ito

IPC分类号： C08F11208

CPC分类号： B05B12/20 ,  B05B12/26

摘要： A masking member is provided that can be used repeatedly even for surface treatments at a high temperature. The masking member includes a plastic produced by polymerization using a metallocene compound as a catalyst or a polymer alloy containing such a plastic.

摘要翻译： 提供了能够在高温下进行表面处理而重复使用的掩模构件。 掩模构件包括通过使用茂金属化合物作为催化剂进行聚合制备的塑料或含有这种塑料的聚合物合金。

公开(公告)号：US4894531A

公开(公告)日：1990-01-16

申请号：US106847

申请日：1987-10-13

申请人： Katsumi Terada ,  Tetsuya Enomoto

发明人： Katsumi Terada ,  Tetsuya Enomoto

IPC分类号： G02B27/00 ,  H01J29/34 ,  H01J29/89 ,  H04N9/24

CPC分类号： H04N9/24 ,  H01J29/89

摘要： A photodetector including a planar light guide of a polygonal shape in which organic phosphor is dispersed in a transparent support material, and a pair of photoelectric conversion elements such that light having a wavelength range for exciting the organic phosphor is introduced into the light guide and light generated from the organic phosphor upon the excitation is guided to the photoelectric conversion elements sensitive to a wavelength of the light generated from the organic phosphor. The light guide is formed, at opposite end portions of its one side, with a pair of light emitting surfaces and the photoelectric conversion elements are, respectively, provided at the light emitting end surfaces such that a light receiving surface of each of the photoelectric conversion elements confronts each of the light emitting end surfaces.

摘要翻译： 一种光电检测器，包括多边形形状的平面光导，其中有机荧光体分散在透明支撑材料中，以及一对光电转换元件，使得具有用于激发有机磷光体的波长范围的光被引入光导和光 在激发时从有机荧光体产生的光被导入对从有机荧光体产生的光的波长敏感的光电转换元件。 光导在其一侧的相对端部形成有一对发光面，并且光电转换元件分别设置在发光端面，使得光电转换中的每一个的光接收表面 元件面对每个发光端面。

公开(公告)号：US20130201457A1

公开(公告)日：2013-08-08

申请号：US13877283

申请日：2011-09-22

申请人： Toshiyuki Watanabe ,  Hiroaki Yoshida ,  Hideki Yamamoto ,  Katsumi Terada ,  Toru Kirimura ,  Yoshiyuki Noda ,  Yasumasa Suita ,  Tsutomu Kashima ,  Masahiro Haraguchi

发明人： Toshiyuki Watanabe ,  Hiroaki Yoshida ,  Hideki Yamamoto ,  Katsumi Terada ,  Toru Kirimura ,  Yoshiyuki Noda ,  Yasumasa Suita ,  Tsutomu Kashima ,  Masahiro Haraguchi

IPC分类号： G03B21/14

CPC分类号： G03B21/147 ,  G03B21/142 ,  G03B21/26 ,  G03B21/53 ,  G09G3/001 ,  G09G2320/0693 ,  G09G2360/145 ,  H04N9/317 ,  H04N9/3185 ,  H04N9/3194

摘要： A projection display device includes an optical modulation element configured to modulate light outputting from a light source, and a projection unit configured to project light modulated by the optical modulation element on a projection screen. The projection display device includes an element control unit that controls the optical modulation element to display a test pattern image, an acquiring unit that acquires an image obtained by capturing the test pattern image from an image capture element that captures the test pattern image projected on the projection screen, and an adjusting unit that adjusts an image projected on the projection screen on the basis of the capture image acquired by the acquiring unit. The element control unit controls the optical modulation element such that a guidance image that guides focus adjustment of the image projected on the projection screen is displayed.

摘要翻译： 投影型显示装置具备配置成调制从光源输出的光的光调制元件，以及投影单元，其配置为将由所述光调制元件调制的光投射在投影屏上。 该投影型显示装置具有：控制上述光调制元件显示测试图案图像的元件控制单元;获取单元，其获取从拍摄上述测试图案图像的图像捕获元件捕获测试图案图像所获得的图像; 投影屏幕和调整单元，其基于由获取单元获取的捕获图像来调整投影在投影屏幕上的图像。 元件控制单元控制光调制元件，使得引导投影在投影屏幕上的图像的焦点调整的引导图像被显示。

公开(公告)号：US20070111400A1

公开(公告)日：2007-05-17

申请号：US11594766

申请日：2006-11-09

申请人： Katsumi Terada ,  Takashi Takei

发明人： Katsumi Terada ,  Takashi Takei

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L24/28 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01082

摘要： A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser (73) provided in the chamber (52) and discharging underfill agent introduced from the storing means (66, 67) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means (46) for reducing the pressure in the chamber (52) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser (73). The dispensing device (4) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device (4) is also provided by the invention.

摘要翻译： 用于将底部填充剂填充到基板（K）和芯片（C）之间的间隙中的分配装置（4）包括用于存储底部填充剂（66,67）的装置，用于容纳基板（K）的室（52） 装有底部填充剂并且能够打开/关闭;设置在室（52）中的分配器（73），并将从存储装置（66,67）引入的底部填充剂排放到基板（K）和 以及用于在由分配器（73）排出底部填充剂之前以预定的真空压力减小腔室（52）中的压力的​​第一减压装置（46）。 分配装置（4）可以向衬底（K）提供没有气泡的底部填充剂。 本发明还提供使用该分配装置（4）的安装系统。