公开(公告)号：US20160005695A1

公开(公告)日：2016-01-07

申请号：US14471505

申请日：2014-08-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Rui-Feng Tai ,  Hsiao-Chun Huang ,  Chun-Hung Lu ,  Hsi-Chang Hsu ,  Shih-Ching Chen

IPC: H01L23/544 ,  H01L21/52

CPC classification number: H01L23/544 ,  H01L21/561 ,  H01L21/568 ,  H01L21/682 ,  H01L23/15 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/54486 ,  H01L2224/02331 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05022 ,  H01L2224/05025 ,  H01L2224/05073 ,  H01L2224/05563 ,  H01L2224/05567 ,  H01L2224/05569 ,  H01L2224/05573 ,  H01L2224/12105

Abstract: A method for fabricating a package structure is provided, which includes the steps of: providing a base portion having at least an electronic element embedded therein and at least a positioning unit formed around a periphery of the electronic element, wherein the positioning unit protrudes from or is flush with a surface of the base portion; and forming at least a circuit layer on the surface of the base portion and the electronic element. The circuit layer is aligned and connected to the electronic element through the positioning unit.

Abstract translation: 提供一种制造封装结构的方法，其包括以下步骤：提供至少具有嵌入其中的电子元件的基部和至少围绕电子元件的周边形成的定位单元，其中定位单元从或 与基部的表面齐平; 以及在所述基部和所述电子元件的表面上形成至少电路层。 电路层通过定位单元对准并连接到电子元件。