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公开(公告)号：US11317220B2
公开(公告)日：2022-04-26
申请号：US16719941
申请日：2019-12-18
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Cheng-Wei Tsai , Chien-Hsing Lee
Abstract: In an embodiment, the invention provides a structure of MEMS microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, having a dielectric opening. A diaphragm is within the dielectric opening and held by the dielectric layer at a peripheral region, wherein the diaphragm has a diaphragm opening. A back-plate is disposed on the dielectric layer, over the diaphragm. A protruding structure is disposed on the back-plate, protruding toward the diaphragm. At least one air valve plate is affixed on an end of the protruding structure within the diaphragm opening of the diaphragm. The air valve plate is activated when suffering an air flow with a pressure.
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12.发明授权公开(公告)号：US11312616B1
公开(公告)日：2022-04-26
申请号：US17081995
申请日：2020-10-27
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Cheng-Wei Tsai
Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone includes a substrate, having a first opening. A dielectric layer is disposed on the substrate, wherein the dielectric layer has a second opening aligned to the first opening. A membrane is disposed within the second opening of the dielectric layer. A peripheral region of the membrane is embedded into the dielectric layer at sidewall of the second opening. A backplate layer is disposed on the dielectric layer. The backplate layer includes a protection layer, having a peripheral region disposed on the dielectric layer and a central region with venting holes over the second opening. The central region of the protection layer further has anti-sticky structures at a side of the protection layer toward the membrane. An electrode layer is disposed on the side of the protection layer, surrounding the anti-sticky structures.
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Patent Agency Ranking
13.发明授权公开(公告)号：US11172287B2
公开(公告)日：2021-11-09
申请号：US16673962
申请日：2019-11-05
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Cheng-Wei Tsai , Chien-Hsing Lee
Abstract: A structure of micro-electro-mechanical-system microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, the dielectric layer has a second opening, corresponding to the first opening. A diaphragm is located within the second opening, having an embedded part held by the dielectric layer and an exposed part exposed by the second opening. The exposed part has a junction peripheral region, a buffer peripheral region and a central region. The junction region has an elastic structure with slits, the buffer peripheral region includes a plurality of holes and is disposed between the junction peripheral region and the central region. A backplate is disposed on the dielectric layer above the second opening, wherein the backplate includes venting holes distributed at a region corresponding to the central part of the diaphragm.
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14.发明申请公开(公告)号：US20210136483A1
公开(公告)日：2021-05-06
申请号：US16673962
申请日：2019-11-05
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Cheng-Wei Tsai , Chien-Hsing Lee
Abstract: A structure of micro-electro-mechanical-system microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, the dielectric layer has a second opening, corresponding to the first opening. A diaphragm is located within the second opening, having an embedded part held by the dielectric layer and an exposed part exposed by the second opening. The exposed part has a junction peripheral region, a buffer peripheral region and a central region. The junction region has an elastic structure with slits, the buffer peripheral region includes a plurality of holes and is disposed between the junction peripheral region and the central region. A backplate is disposed on the dielectric layer above the second opening, wherein the backplate includes venting holes distributed at a region corresponding to the central part of the diaphragm.
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公开(公告)号：US10390145B1
公开(公告)日：2019-08-20
申请号：US15943637
申请日：2018-04-02
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Cheng-Wei Tsai , Chien-Hsing Lee
Abstract: A micro electro mechanical system (MEMS) microphone includes a substrate, having a substrate opening. A supporting dielectric layer is disposed on the substrate surrounding the substrate opening. A diaphragm is supported by the supporting dielectric layer above the substrate opening, wherein the diaphragm has a bowl-like structure being convex toward the substrate opening when the diaphragm is at an operation off state. A backplate is disposed on the supporting dielectric layer over the diaphragm, wherein the backplate includes a plurality of venting holes at a region corresponding to the substrate opening.
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公开(公告)号：US20180115836A1
公开(公告)日：2018-04-26
申请号：US15335420
申请日：2016-10-26
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Cheng-Wei Tsai
CPC classification number: H04R19/04 , B81B3/001 , B81B2201/0257 , B81C1/00984 , H04R31/003 , H04R2201/003
Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
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公开(公告)号：US09955268B2
公开(公告)日：2018-04-24
申请号：US14328727
申请日：2014-07-11
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Cheng-Wei Tsai , Jhyy-Cheng Liou
CPC classification number: H04R19/005 , B81B7/0006 , B81B7/0058 , B81B2201/0257 , H04R23/006 , H04R2201/003 , H04R2460/11
Abstract: A micro-electrical-mechanical system (MEMS) microphone includes a MEMS structure, having a substrate, a diaphragm, and a backplate, wherein the substrate has a cavity and the backplate is between the cavity and the diaphragm. The backplate has multiple venting holes, which are connected to the cavity and allows the cavity to extend to the diaphragm. Further, an adhesive layer is disposed on the substrate, surrounding the cavity. A cover plate is adhered on the adhesive layer, wherein the cover plate has an acoustic hole, dislocated from the cavity without direct connection.
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