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11.发明授权Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof 有权微电子机械系统（MEMS）麦克风封装器件及其MEMS封装方法公开(公告)号：US09271087B1
公开(公告)日：2016-02-23
申请号：US14505495
申请日：2014-10-02
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Chih-Hsien Chung , Yong-Wei Chen , Jhyy-Cheng Liou
CPC classification number: H04R23/006 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2201/003
Abstract: A MEMS microphone package device includes a MEMS microphone chip as an integrated circuit chip. An acoustic sensing structure is embedded in the integrated circuit chip. An adhesive structure adheres on outer sidewall of the microphone chip. A bottom portion of the adhesive structure protrudes out from first surface of the microphone chip and adheres on a surface of a substrate, having interconnection structure, to form a first seal ring. A space between the acoustic sensing structure and the substrate and sealed by the first seal ring forms a second chamber. A cover adheres to top portion of the adhesive structure, covering over the cavity on the second surface of the microphone chip. The top portion of the adhesive structure forms as a second seal ring. A space between the cover and the second surface of the microphone chip and sealed by the second seal ring forms a first chamber.
Abstract translation: MEMS麦克风封装器件包括作为集成电路芯片的MEMS麦克风芯片。 声学感测结构嵌入在集成电路芯片中。 粘合剂结构粘附在麦克风芯片的外侧壁上。 粘合剂结构的底部从麦克风芯片的第一表面突出出来并粘附在具有互连结构的基板的表面上，以形成第一密封环。 在声学检测结构和衬底之间并由第一密封环密封的空间形成第二腔室。 盖子粘附到粘合剂结构的顶部，覆盖在麦克风芯片的第二表面上的空腔上。 粘合剂结构的顶部形成为第二密封环。 所述盖和麦克风芯片的第二表面之间的空间被第二密封环密封形成第一腔室。
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公开(公告)号：US20150315013A1
公开(公告)日：2015-11-05
申请号：US14328727
申请日：2014-07-11
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Cheng-Wei Tsai , Jhyy-Cheng Liou
CPC classification number: H04R19/005 , B81B7/0006 , B81B7/0058 , B81B2201/0257 , H04R23/006 , H04R2201/003 , H04R2460/11
Abstract: A micro-electrical-mechanical system (MEMS) microphone includes a MEMS structure, having a substrate, a diaphragm, and a backplate, wherein the substrate has a cavity and the backplate is between the cavity and the diaphragm. The backplate has multiple venting holes, which are connected to the cavity and allows the cavity to extend to the diaphragm. Further, an adhesive layer is disposed on the substrate, surrounding the cavity. A cover plate is adhered on the adhesive layer, wherein the cover plate has an acoustic hole, dislocated from the cavity without direct connection.
Abstract translation: 微电气机械系统（MEMS）麦克风包括具有基板，隔膜和背板的MEMS结构，其中基板具有空腔，并且背板位于空腔和隔膜之间。 背板具有多个通气孔，其连接到空腔并允许空腔延伸到隔膜。 此外，粘合层设置在基板上，围绕空腔。 盖板粘附在粘合剂层上，其中盖板具有声孔，从空腔脱位而没有直接连接。
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13.发明授权公开(公告)号：US11498830B2
公开(公告)日：2022-11-15
申请号：US16812395
申请日：2020-03-09
Applicant: Solid State System Co., Ltd.
Inventor： Cheng-Wei Tsai , Tsung-Min Hsieh , Chien-Hsing Lee
Abstract: The invention provides a MEMS microphone. The MEMS microphone includes a substrate, having a first opening. A dielectric layer is disposed on the substrate, wherein the dielectric layer has a second opening aligned to the first opening. A diaphragm is disposed within the second opening of the dielectric layer, wherein a peripheral region of the diaphragm is embedded into the dielectric layer at sidewall of the second opening. A backplate layer is disposed on the dielectric layer and covering over the second opening. The backplate layer includes a plurality of acoustic holes arranged into a regular array pattern. The regular array pattern comprises a pattern unit, the pattern unit comprises one of the acoustic holes as a center hole, and peripheral holes of the acoustic holes surrounding the center hole with a same pitch to the center hole.
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公开(公告)号：US10798493B2
公开(公告)日：2020-10-06
申请号：US16223124
申请日：2018-12-18
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Cheng-Wei Tsai
Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
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15.发明授权Micro electro-mechanical system (MEMS) microphone device with multi-sensitivity outputs and circuit with the MEMS device 有权微机电系统（MEMS）麦克风设备具有多路灵敏度输出和电路与MEMS器件公开(公告)号：US08934649B1
公开(公告)日：2015-01-13
申请号：US14013049
申请日：2013-08-29
Applicant: Solid State System Co., Ltd.
Inventor： Chien-Hsing Lee , Tsung-Min Hsieh , Jhyy-Cheng Liou
CPC classification number: H04R19/04 , H04R19/005 , H04R31/006
Abstract: A MEMS device includes substrate having a cavity. A dielectric layer is disposed on a second side of substrate at periphery of the cavity. A backplate structure is formed with the dielectric layer on a first side of the substrate and exposed by the cavity. The backplate structure includes at least a first backplate and a second backplate. The first backplate and the second backplate are electric disconnected and have venting holes to connect the cavity and the chamber. A diaphragm is disposed above the backplate structure by a distance, so as to form a chamber between the backplate structure and the diaphragm. A periphery of the diaphragm is embedded in the dielectric layer. The diaphragm serves as a common electrode. The first backplate and the second backplate respectively serve as a first electrode unit and a second electrode unit in conjugation with the diaphragm to form separate two capacitors.
Abstract translation: MEMS器件包括具有空腔的衬底。 电介质层设置在空腔周边的衬底的第二面上。 背板结构形成有介电层在基板的第一面上并被空腔暴露。 背板结构至少包括第一背板和第二背板。 第一个背板和第二个背板是电气断开的，并具有连接空腔和腔室的排气孔。 隔膜设置在背板结构上方一段距离，以便在背板结构和隔膜之间形成一个室。 隔膜的周边嵌入在电介质层中。 隔膜用作公共电极。 第一背板和第二背板分别用作与隔膜共轭的第一电极单元和第二电极单元，以形成分开的两个电容器。
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Patent Agency Ranking
16.发明申请公开(公告)号：US20130260504A1
公开(公告)日：2013-10-03
申请号：US13906340
申请日：2013-05-31
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Jhyy-Cheng Liou
IPC: B81C1/00
CPC classification number: B81C1/00698 , B81C1/00682 , H01G5/18 , H04R19/005 , H04R19/04
Abstract: Method is to fabricate a MEMS device with a substrate. The substrate has through holes in the substrate within a diaphragm region and optionally an indent space from the second surface at the diaphragm region. A first dielectric structural layer is then disposed over the substrate from the first surface, wherein the first dielectric structural layer has a plurality of openings corresponding to the through holes, wherein each of the through holes remains exposed by the first dielectric structural layer. A second dielectric structural layer with a chamber is disposed over the first dielectric structural layer, wherein the chamber exposes the openings of the first dielectric structural layer and the through holes of the substrate to connect to the indent space. A MEMS diaphragm is embedded in the second dielectric structural layer above the chamber, wherein an air gap is formed between the substrate and the MEMS diaphragm.
Abstract translation: 方法是制造具有衬底的MEMS器件。 衬底在膜片区域内的衬底中具有通孔，并且可选地在隔膜区域处具有与第二表面相邻的凹陷空间。 然后，第一介电结构层从第一表面设置在衬底上，其中第一介电结构层具有对应于通孔的多个开口，其中每个通孔保持被第一介电结构层暴露。 具有腔室的第二电介质结构层设置在第一介电结构层上，其中腔室暴露第一介电结构层的开口和衬底的通孔以连接到凹陷空间。 MEMS隔膜嵌入在腔室上方的第二电介质结构层中，其中在衬底和MEMS隔膜之间形成气隙。
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17.发明申请公开(公告)号：US20220127134A1
公开(公告)日：2022-04-28
申请号：US17081995
申请日：2020-10-27
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Cheng-Wei Tsai
Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone includes a substrate, having a first opening. A dielectric layer is disposed on the substrate, wherein the dielectric layer has a second opening aligned to the first opening. A membrane is disposed within the second opening of the dielectric layer. A peripheral region of the membrane is embedded into the dielectric layer at sidewall of the second opening. A backplate layer is disposed on the dielectric layer. The backplate layer includes a protection layer, having a peripheral region disposed on the dielectric layer and a central region with venting holes over the second opening. The central region of the protection layer further has anti-sticky structures at a side of the protection layer toward the membrane. An electrode layer is disposed on the side of the protection layer, surrounding the anti-sticky structures.
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公开(公告)号：US11317220B2
公开(公告)日：2022-04-26
申请号：US16719941
申请日：2019-12-18
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Cheng-Wei Tsai , Chien-Hsing Lee
Abstract: In an embodiment, the invention provides a structure of MEMS microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, having a dielectric opening. A diaphragm is within the dielectric opening and held by the dielectric layer at a peripheral region, wherein the diaphragm has a diaphragm opening. A back-plate is disposed on the dielectric layer, over the diaphragm. A protruding structure is disposed on the back-plate, protruding toward the diaphragm. At least one air valve plate is affixed on an end of the protruding structure within the diaphragm opening of the diaphragm. The air valve plate is activated when suffering an air flow with a pressure.
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19.发明授权公开(公告)号：US11312616B1
公开(公告)日：2022-04-26
申请号：US17081995
申请日：2020-10-27
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Chien-Hsing Lee , Cheng-Wei Tsai
Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone includes a substrate, having a first opening. A dielectric layer is disposed on the substrate, wherein the dielectric layer has a second opening aligned to the first opening. A membrane is disposed within the second opening of the dielectric layer. A peripheral region of the membrane is embedded into the dielectric layer at sidewall of the second opening. A backplate layer is disposed on the dielectric layer. The backplate layer includes a protection layer, having a peripheral region disposed on the dielectric layer and a central region with venting holes over the second opening. The central region of the protection layer further has anti-sticky structures at a side of the protection layer toward the membrane. An electrode layer is disposed on the side of the protection layer, surrounding the anti-sticky structures.
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20.发明授权公开(公告)号：US11172287B2
公开(公告)日：2021-11-09
申请号：US16673962
申请日：2019-11-05
Applicant: Solid State System Co., Ltd.
Inventor： Tsung-Min Hsieh , Cheng-Wei Tsai , Chien-Hsing Lee
Abstract: A structure of micro-electro-mechanical-system microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, the dielectric layer has a second opening, corresponding to the first opening. A diaphragm is located within the second opening, having an embedded part held by the dielectric layer and an exposed part exposed by the second opening. The exposed part has a junction peripheral region, a buffer peripheral region and a central region. The junction region has an elastic structure with slits, the buffer peripheral region includes a plurality of holes and is disposed between the junction peripheral region and the central region. A backplate is disposed on the dielectric layer above the second opening, wherein the backplate includes venting holes distributed at a region corresponding to the central part of the diaphragm.
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