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11.发明授权公开(公告)号：US09806114B2
公开(公告)日：2017-10-31
申请号：US15294425
申请日：2016-10-14
Applicant: Sony Corporation
Inventor： Tomoharu Ogita , Atsushi Yamamoto , Keiji Tatani , Yoichi Ootsuka , Kiyotaka Tabuchi
IPC: H04L27/14 , H04N9/04 , H04N5/378 , H01L27/146
CPC classification number: H01L27/1462 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/1464 , H01L27/14645 , H01L27/14685 , H01L27/14868 , H04N5/378 , H04N9/045
Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
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12.发明授权Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus 有权固态成像装置，制造固态成像装置的方法和电子装置公开(公告)号：US09253456B2
公开(公告)日：2016-02-02
申请号：US14277383
申请日：2014-05-14
Applicant: Sony Corporation
Inventor： Tomoharu Ogita , Atsushi Yamamoto , Keiji Tatani , Yoichi Ootsuka , Kiyotaka Tabuchi
IPC: H01L27/146 , H04N9/04
CPC classification number: H01L27/1462 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/1464 , H01L27/14645 , H01L27/14685 , H01L27/14868 , H04N5/378 , H04N9/045
Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
Abstract translation: 固态成像装置包括各自具有用于将入射光转换为电信号的光电转换元件的像素，与像素相关联的滤色器和具有多个滤色器组件的微透镜，将入射光通过滤色器会聚到光电 转换元件，设置在滤色器的滤色器组件之间的遮光膜和设置在滤色器和遮光膜之间的非平面化粘合剂膜。
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13.发明申请公开(公告)号：US20190312074A1
公开(公告)日：2019-10-10
申请号：US16440684
申请日：2019-06-13
Applicant: Sony Corporation
Inventor： Yoichi Ootsuka , Tomoyuki Yamashita , Kiyotaka Tabuchi , Yoshinori Toumiya , Akiko Ogino
IPC: H01L27/146 , H04N5/335
Abstract: A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.
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公开(公告)号：US09941321B2
公开(公告)日：2018-04-10
申请号：US15273495
申请日：2016-09-22
Applicant: Sony Corporation
Inventor： Hiroyasu Matsugai , Kiyotaka Tabuchi
IPC: H01L27/146 , H01L21/66 , H01L21/768 , H01L23/00 , H01L25/065 , H01L25/00 , H01L27/06
CPC classification number: H01L27/14634 , H01L21/76898 , H01L22/12 , H01L22/20 , H01L23/562 , H01L25/0657 , H01L25/50 , H01L27/0688 , H01L27/14636 , H01L27/1469 , H01L2224/08145 , H01L2224/16 , H01L2224/24147 , H01L2224/80896 , H01L2224/8203 , H01L2224/92 , H01L2225/06541 , H01L2924/13091 , H01L2924/00 , H01L2224/80001 , H01L2224/82
Abstract: A semiconductor device includes a first semiconductor substrate, a second semiconductor substrate, a first main surface side of the first semiconductor substrate and a first main surface side of the second semiconductor substrate being bonded to each other; and a warpage correction layer which is formed on at least one or more selected from the first main surface side of the first semiconductor substrate, the first main surface side of the second semiconductor substrate, a second main surface side of the first semiconductor substrate, and a second main surface side of the second semiconductor substrate.
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15.发明申请公开(公告)号：US20170317128A1
公开(公告)日：2017-11-02
申请号：US15653819
申请日：2017-07-19
Applicant: Sony Corporation
Inventor： Yoichi Ootsuka , Tomoyuki Yamashita , Kiyotaka Tabuchi , Yoshinori Toumiya , Akiko Ogino
IPC: H01L27/146 , H04N5/335
CPC classification number: H01L27/14627 , H01L27/14612 , H01L27/14621 , H01L27/14685 , H04N5/335
Abstract: A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.
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Patent Agency Ranking
公开(公告)号：US09741757B2
公开(公告)日：2017-08-22
申请号：US14861175
申请日：2015-09-22
Applicant: SONY CORPORATION
Inventor： Yoichi Ootsuka , Tomoyuki Yamashita , Kiyotaka Tabuchi , Yoshinori Toumiya , Akiko Ogino
IPC: H01L27/146 , H04N5/335
CPC classification number: H01L27/14627 , H01L27/14612 , H01L27/14621 , H01L27/14685 , H04N5/335
Abstract: A solid-state imaging device includes: a first lens layer; and a second lens layer, wherein the second lens layer is formed at least at a periphery of each first microlens formed based on the first lens layer, and the second lens layer present at a central portion of each of the first microlenses is thinner than the second lens layer present at the periphery of the first microlens or no second lens layer is present at the central portion of each of the first microlenses.
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17.发明申请公开(公告)号：US20170154907A1
公开(公告)日：2017-06-01
申请号：US15431899
申请日：2017-02-14
Applicant: Sony Corporation
Inventor： Tomoharu Ogita , Atsushi Yamamoto , Keiji Tatani , Yoichi Ootsuka , Kiyotaka Tabuchi
IPC: H01L27/146 , H04N9/04 , H04N5/378
CPC classification number: H01L27/1462 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/1464 , H01L27/14645 , H01L27/14685 , H01L27/14868 , H04N5/378 , H04N9/045
Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
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18.发明申请SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS 审中-公开固态成像装置，制造固态成像装置的方法和电子装置公开(公告)号：US20160204141A1
公开(公告)日：2016-07-14
申请号：US15078146
申请日：2016-03-23
Applicant: Sony Corporation
Inventor： Tomoharu Ogita , Atsushi Yamamoto , Keiji Tatani , Yoichi Ootsuka , Kiyotaka Tabuchi
IPC: H01L27/146 , H04N9/04 , H04N5/378 , H01L27/148
CPC classification number: H01L27/1462 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/1464 , H01L27/14645 , H01L27/14685 , H01L27/14868 , H04N5/378 , H04N9/045
Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
Abstract translation: 固态成像装置包括各自具有用于将入射光转换为电信号的光电转换元件的像素，与像素相关联的滤色器和具有多个滤色器组件的微透镜，将入射光通过滤色器会聚到光电 转换元件，设置在滤色器的滤色器组件之间的遮光膜和设置在滤色器和遮光膜之间的非平面化粘合剂膜。
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19.发明授权公开(公告)号：US10418397B2
公开(公告)日：2019-09-17
申请号：US15719015
申请日：2017-09-28
Applicant: Sony Corporation
Inventor： Tomoharu Ogita , Atsushi Yamamoto , Keiji Tatani , Yoichi Ootsuka , Kiyotaka Tabuchi
IPC: H01L27/146 , H01L27/148 , H04N5/378 , H04N9/04
Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
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20.发明申请SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS 审中-公开固态成像装置，制造固态成像装置的方法和电子装置公开(公告)号：US20170033140A1
公开(公告)日：2017-02-02
申请号：US15294425
申请日：2016-10-14
Applicant: Sony Corporation
Inventor： Tomoharu Ogita , Atsushi Yamamoto , Keiji Tatani , Yoichi Ootsuka , Kiyotaka Tabuchi
IPC: H01L27/146 , H04N5/378 , H04N9/04
CPC classification number: H01L27/1462 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/1464 , H01L27/14645 , H01L27/14685 , H01L27/14868 , H04N5/378 , H04N9/045
Abstract: A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.
Abstract translation: 固态成像装置包括各自具有用于将入射光转换为电信号的光电转换元件的像素，与像素相关联的滤色器和具有多个滤色器组件的微透镜，将入射光通过滤色器会聚到光电 转换元件，设置在滤色器的滤色器组件之间的遮光膜和设置在滤色器和遮光膜之间的非平面化粘合剂膜。
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