摘要:
A method of modeling two IC dies using the same software model, although the two dies include physical differences. A first programmable logic device (PLD) die includes first and second portions, and is encoded to render the first portion operational and the second portion non-operational. At a boundary between the two portions, interconnect lines traversing the boundary include a first section in the first portion and a second section in the second portion. The second PLD die includes the first portion of the first PLD die, while omitting the second portion. The interconnect lines extending to the edge of the second die are coupled together in pairs. A software model for both die includes a termination model that omits the pair coupling, adds an RC load compensating for the omitted connection, and (for bidirectional interconnect lines) flags one interconnect line in each pair as being invalid for use by routing software.
摘要:
Methods of manufacturing a family of packaged integrated circuits (ICs) having at least two different logic capacities. A first IC die includes two different portions, of which at least one portion can be deliberately rendered non-operational in some manner (e.g., non-functional, inaccessible, and/or non-programmable) within the package. A first set of the first IC dies are packaged such that both portions of the dies are operational. A second set of the first IC dies are packaged such that only the first portion of each die is operational. Once the first and second sets are packaged and the second set of ICs has been evaluated, a decision is made whether or not to manufacture a second IC die that includes the first portion of the first die, while excluding the second portion.
摘要:
A method of modeling two IC dies using the same software model, although the two dies include physical differences. A first programmable logic device (PLD) die includes first and second portions, and is encoded to render the first portion operational and the second portion non-operational. At a boundary between the two portions, interconnect lines traversing the boundary include a first section in the first portion and a second section in the second portion. The second PLD die includes the first portion of the first PLD die, while omitting the second portion. The interconnect lines extending to the edge of the second die are coupled together in pairs. A software model for both die includes a termination model that omits the pair coupling, adds an RC load compensating for the omitted connection, and (for bidirectional interconnect lines) flags one interconnect line in each pair as being invalid for use by routing software.
摘要:
An input/output interconnect (IOI) circuit is provided for coupling input/output (IO) blocks to an array of configurable logic tiles in a field programmable gate array (FPGA). Each of the tiles includes a configurable logic block and a programmable interconnect structure that includes a plurality of intermediate-length buses. The intermediate-length buses are staggered, such that only a subset of the intermediate-length buses routed by a logic block is connected to the logic block. The IOI circuit includes routing circuits at the perimeter of the array for terminating the intermediate-length buses. In one embodiment, the routing circuits connect various ends of unidirectional intermediate-length buses in a U-turn configuration, thereby making use of all of the intermediate-length buses, and maintaining a regular pattern of intermediate-length buses in the tiles. In another embodiment, various ends of bi-directional intermediate-length buses are terminated to long lines through programmable interconnection points (PIPs). In another embodiment, PIPs are provided to enable horizontal long lines to be connected to horizontal intermediate-length buses, which in turn, can be connected to vertical long lines, thereby providing a low-skew, high fanout routing network.
摘要:
Described is a programmable logic device (PLD) with columns of DSP slices that can be cascaded to create DSP circuits of varying size and complexity. Each slice includes a mode port that receives mode control signals for dynamically altering the function and connectivity of related slices. Such alterations can occur with or without reconfiguring the PLD.
摘要:
According to one aspect of the invention, a circuit for accessing data in a memory is disclosed. The circuit generally comprises a first port having a read logic circuit and a first output which generates data from the memory. A second port has a read logic circuit and a write logic circuit. A second output is coupled to the second port, and also generates data from the memory. Circuits for separately selecting read and write widths for a port of a memory, such as a random access memory, are disclosed. Finally, other embodiments related to implementing a content addressable memory in a programmable logic device are disclosed. Further, a method of accessing data in a memory is disclosed.
摘要:
A clock gating circuit is provided for a logic device that reduces device resource requirements, eliminates the need for users to define their own clock gating circuit, and eliminates undesirable clock signal disturbances, such as glitches and runt pulses. In one embodiment, the clock gating circuit includes an input terminal for receiving an input clock signal; an input terminal for receiving a clock enable signal; a storage latch coupled to receive the input clock signal and the clock enable signal, and in response, provide a clock gate control signal; and a logic gate coupled to receive the input clock signal and the clock gate control signal. The logic gate selectively routes the input clock signal in response to the clock gate control signal, thereby providing an output clock signal.
摘要:
Described is a programmable logic device (PLD) with columns of DSP slices that can be cascaded to create DSP circuits of varying size and complexity. Each DSP slice includes a plurality of operand input ports and a slice output port, all of which are programmably connected to general routing and logic resources. The operand ports receive operands for processing, and a slice output port conveys processed results. Each slice additionally includes a feedback port connected to the respective slice output port, to support accumulate functions in this embodiment, and a cascade input port connected to the output port of an upstream slice to support cascading.
摘要:
Described is a programmable logic device (PLD) with columns of DSP slices that can be combined to create DSP circuits of varying size and complexity. DSP slices in accordance with some embodiments includes programmable operand input registers that can be configured to introduce different amounts of delay, from zero to two clock cycles, for example, to support pipelining. In one such embodiment, each DSP slice includes a partial-product generator having a multiplier port, a multiplicand port, and a product port. The multiplier and multiplicand ports connect to the operand input port via respective first and second operand input registers, each of which is capable of introducing from zero to two clock cycles of delay. In another embodiment, the output of at least one operand input register can connect to the input of an operand input register of a downstream DSP slice so that operands can be transferred among one or more slices.
摘要:
Described are arithmetic circuits divided logically into a product generator and an adder. Multiplexing circuitry logically disposed between the product generator and the adder supports conventional functionality by providing partial products from the product generator to addend terminals of the adder. The multiplexing circuitry can also be controlled to direct a number of external added inputs to the adder. The additional addend inputs can include inputs and outputs cascaded from other arithmetic circuits.