公开(公告)号：US20180235086A1

公开(公告)日：2018-08-16

申请号：US15892722

申请日：2018-02-09

Applicant: TDK CORPORATION

Inventor： Mitsuhiro TOMIKAWA ,  Koichi TSUNODA ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/38

Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface; an electronic component that is embedded in the substrate and has at least one first terminal, at least one second terminal, and a capacity part; at least one via conductor that are formed in the insulating layer and electrically connected to the second terminal; and an adhesion layer that is in contact with the second terminal on an end face of the second terminal which are close to the second principal surface. The electronic component is laminated with the insulating layer, and adhesion strength between the adhesion layer and the insulating layer is higher than that between the second terminal and the insulating layer.

公开(公告)号：US20180233553A1

公开(公告)日：2018-08-16

申请号：US15891637

申请日：2018-02-08

Applicant: TDK CORPORATION

Inventor： Mitsuhiro TOMIKAWA ,  Koichi TSUNODA ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

IPC: H01L49/02 ,  H01G4/30 ,  H01G4/33 ,  H01G4/228

Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface on the opposite side of the first principal surface; and an electronic component that is embedded in the substrate and has a plurality of first terminals provided close to the first principal surface, a plurality of second terminals provided close to the second principal surface, and a capacity part provided between the plurality of first terminals and the plurality of second terminals. The electronic component is configured such that at least a part of the second terminals is embedded in the insulating layer. An insulating member is provided between the neighboring second terminals to be in contact with both of the neighboring second terminals. The insulating member and the insulating layer are formed of materials whose thermal expansion coefficients are different from each other.

公开(公告)号：US20210057296A1

公开(公告)日：2021-02-25

申请号：US16754395

申请日：2018-10-25

Applicant: TDK CORPORATION

Inventor： Takaaki MORITA ,  Kenichi YOSHIDA ,  Mitsuhiro TOMIKAWA

IPC: H01L23/12 ,  H01L23/498 ,  H01L23/00

Abstract: In an electric component embedded structure, a first electrode terminal provided on a first main surface includes an intra-area terminal, and the intra-area terminal is electrically connected to an overlap portion of an overlap wiring in a formation area of an electric component. Accordingly, a decrease in mounting area of the electric component embedded structure is achieved. The intra-area terminal can be electrically connected to a second electrode terminal provided on a second main surface via a first via-conductor, the overlap wiring, and a second via-conductor. The intra-area terminal is connected to a wiring (an overlap wiring) of a first insulating layer without additionally providing a rewiring layer causing an increase in thickness, and the increase in thickness is curbed, whereby a decrease in size of the electric component embedded structure is achieved.

公开(公告)号：US20200258690A1

公开(公告)日：2020-08-13

申请号：US16617106

申请日：2018-05-16

Applicant: TDK Corporation

Inventor： Koichi TSUNODA ,  Kazuhiro YOSHIKAWA ,  Mitsuhiro TOMIKAWA ,  Kenichi YOSHIDA

IPC: H01G4/33 ,  H01G4/01 ,  H01G4/232

Abstract: A thin-film capacitor includes an insulating base member, and a capacitance portion that is laminated on the insulating base member has a plurality of internal electrode layers which are laminated on the insulating base member and are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers. A relative dielectric constant of the dielectric layers is 100 or higher.

公开(公告)号：US20200043751A1

公开(公告)日：2020-02-06

申请号：US16499501

申请日：2018-03-16

Applicant: TDK CORPORATION

Inventor： Mitsuhiro TOMIKAWA ,  Kazuhiro YOSHIKAWA ,  Koichi TSUNODA ,  Kenichi YOSHIDA

IPC: H01L21/48 ,  H05K1/16 ,  H05K3/40 ,  H05K3/46

Abstract: A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.

公开(公告)号：US20200013554A1

公开(公告)日：2020-01-09

申请号：US16483516

申请日：2018-02-13

Applicant: TDK Corporation

Inventor： Koichi TSUNODA ,  Mitsuhiro TOMIKAWA ,  Kazuhiro YOSHIKAWA ,  Kenichi YOSHIDA

IPC: H01G4/33 ,  H01G4/30 ,  H01G4/012 ,  H01G4/252

Abstract: In a thin-film capacitor, an electrode terminal layer and an electrode layer of a capacitor portion are connected to electrode terminals by via conductors that is formed to penetrate an insulating layer in a thickness direction thereof, and a short circuit wiring in the thickness direction is realized by the via conductors. In the thin-film capacitor, an increase in the number of terminals in the plurality of electrode terminals is achieved, a decrease in length of a circuit wiring is achieved, and thus a thin-film capacitor with low-ESL has been achieved.

公开(公告)号：US20190394915A1

公开(公告)日：2019-12-26

申请号：US16436161

申请日：2019-06-10

Applicant: TDK Corporation

Inventor： Mitsuhiro TOMIKAWA ,  Hironori SATO

IPC: H05K13/02 ,  B65D73/02 ,  H05K13/04 ,  H05K13/00 ,  B32B7/12 ,  C09J7/20

Abstract: Disclosed herein is an electronic component housing package that includes a carrier tape having a through hole for housing an electronic component, a base film stuck to the carrier tape and having a lower degree of rigidity than the carrier tape, and a release layer formed on a predetermined area of the base film so as to be exposed to the through hole of the carrier tape.