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    IMPROVED CONTACT ELEMENT FOR A PROBE HEAD FOR TESTING HIGH-FREQUENCY ELECTRONIC DEVICES AND RELATING PROBE HEAD
    11.
    发明公开
    IMPROVED CONTACT ELEMENT FOR A PROBE HEAD FOR TESTING HIGH-FREQUENCY ELECTRONIC DEVICES AND RELATING PROBE HEAD 审中-公开

    公开(公告)号：US20240012025A1

    公开(公告)日：2024-01-11

    申请号：US18252141

    申请日：2021-11-10

    Applicant: TECHNOPROBE S.P.A.

    Inventor： Roberto CRIPPA

    IPC: G01R1/067 ,  G01R1/073

    CPC classification number: G01R1/06772 ,  G01R1/06727 ,  G01R1/06722 ,  G01R1/07314

    Abstract: A contact element for a probe head for an electronic device test apparatus is disclosed, having a body extending along a longitudinal axis between a first and a second opposite contact end, each made of electrically conductive material. The body includes a first section which extends over a distance less than 1000 μm along the longitudinal axis starting from the first contact end towards the second contact end, a second section which extends along the longitudinal axis starting from the second contact end towards the first contact end, and a third section, interposed between the first and second sections, made of an electrically insulating material. The sections follow each other along the longitudinal axis so that the first contact end is included only in the first section, the second contact end is included only in the second section, and the third section electrically insulates the first section from the second section.

    PROBE HEAD FOR TESTING ELECTRONIC DEVICES COMPRISING INTEGRATED OPTICAL ELEMENTS
    12.
    发明公开
    PROBE HEAD FOR TESTING ELECTRONIC DEVICES COMPRISING INTEGRATED OPTICAL ELEMENTS 审中-公开

    公开(公告)号：US20230305054A1

    公开(公告)日：2023-09-28

    申请号：US18042159

    申请日：2021-08-23

    Applicant: TECHNOPROBE S.P.A.

    Inventor： Riccardo VETTORI ,  Roberto CRIPPA

    IPC: G01R31/28

    CPC classification number: G01R31/2887 ,  G01R31/2891

    Abstract: A probe head for a testing apparatus of electronic devices is disclosed having a plurality of contact probes, a guide provided with a plurality of guide holes for slidingly housing the contact probes, and a containment element which is adapted to support the guide. The containment element includes a first portion and a second portion which is movable with respect to the first portion, movement means adapted to move the second portion of the containment element with respect to the first portion, and a test optical signal distribution element configured to transmit a test optical signal to the device under test. The test optical signal distribution element is associated with the second portion of the containment element and is arranged to be moved integrally therewith. The movement means is configured to allow the alignment of the test optical signal distribution element.

    A TESTING HEAD WITH AN IMPROVED CONTACT BETWEEN CONTACT PROBES AND GUIDE HOLES
    13.
    发明申请
    A TESTING HEAD WITH AN IMPROVED CONTACT BETWEEN CONTACT PROBES AND GUIDE HOLES 有权

    公开(公告)号：US20230029150A1

    公开(公告)日：2023-01-26

    申请号：US17783452

    申请日：2020-12-18

    Applicant: TECHNOPROBE S.P.A.

    Inventor： Roberto CRIPPA

    IPC: G01R1/073

    Abstract: A testing head for testing the functionality of an electronic device is disclosed having a plurality of contact probes including a probe body extended between respective end portions adapted to contact respective contact pads, a lower guide provided with guide holes for housing the contact probes, and a conductive portion in the lower guide. The conductive portion includes a group of the guide holes and is adapted to contact and short-circuit a corresponding group of contact probes housed in the group of holes. The contact probes housed in the group of holes include a deformable portion adapted to be partially inserted into the guide holes of the group. The deformable portion, when housed in the guide holes, is in a configuration in which it is deformed by the contact with a wall of the guide holes and exerts on the wall a reaction force ensuring a sliding contact during testing of the electronic device.

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