公开(公告)号：US12243809B2

公开(公告)日：2025-03-04

申请号：US18306808

申请日：2023-04-25

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Tianyi Luo ,  Jonathan Almeria Noquil ,  Osvaldo Jorge Lopez

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/07

Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.

公开(公告)号：US20230268253A1

公开(公告)日：2023-08-24

申请号：US18306808

申请日：2023-04-25

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Tianyi Luo ,  Jonathan Almeria Noquil ,  Osvaldo Jorge Lopez

IPC: H01L23/495 ,  H01L25/07 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00 ,  H01L25/00 ,  H01L21/56

CPC classification number: H01L23/49513 ,  H01L25/074 ,  H01L23/49537 ,  H01L23/49575 ,  H01L23/3121 ,  H01L23/49586 ,  H01L23/49562 ,  H01L21/4828 ,  H01L24/27 ,  H01L24/83 ,  H01L25/50 ,  H01L21/565 ,  H01L24/32 ,  H01L24/29 ,  H01L23/49548 ,  H01L2924/13091 ,  H01L2224/83815 ,  H01L2224/83192 ,  H01L2224/32245 ,  H01L2224/2919 ,  H01L2224/2731 ,  H01L2924/0665

Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.

公开(公告)号：US20220208692A1

公开(公告)日：2022-06-30

申请号：US17138981

申请日：2020-12-31

Applicant: Texas Instruments Incorporated

Inventor： Tianyi Luo ,  Jonathan Almeria Noquil ,  Satyendra Singh Chauhan ,  Osvaldo Jorge Lopez ,  Lance Cole Wright

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56

Abstract: A packaged electronic device includes a semiconductor die, a conductive plate coupled to a lead, a solder structure and a package structure. The semiconductor die has opposite first and second sides and a terminal exposed along the second side. The conductive plate has opposite first and second sides and an indent that extends into the first side, the conductive plate, and the solder structure extends between the second side of the semiconductor die and the first side of the conductive plate to electrically couple the conductive plate to the terminal, and the solder structure extends into the indent. The package structure encloses the semiconductor die, the conductive plate and a portion of the lead.

公开(公告)号：US11024564B2

公开(公告)日：2021-06-01

申请号：US16445836

申请日：2019-06-19

Applicant: Texas Instruments Incorporated

Inventor： Tianyi Luo ,  Jonathan Almeria Noquil ,  Osvaldo Jorge Lopez

IPC: H01L23/495 ,  H01L25/07 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00 ,  H01L25/00 ,  H01L21/56

Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.