公开(公告)号：US20240014045A1

公开(公告)日：2024-01-11

申请号：US18019942

申请日：2021-08-06

Applicant: TOKUYAMA CORPORATION

Inventor： Takafumi SHIMODA ,  Yuki KIKKAWA ,  Tomoaki SATO ,  Takayuki NEGISHI

IPC: H01L21/3213

CPC classification number: H01L21/32134

Abstract: Provided is a treatment liquid for treating a semiconductor wafer in a semiconductor forming process, the treatment liquid containing (A) a hypobromite ion, (B) a pH buffer, and (C) an onium ion represented by formula (1):




(wherein R1, R2, R3, and R4 each independently denote an alkyl group having carbon number from 1 to 25,)

公开(公告)号：US20230126771A1

公开(公告)日：2023-04-27

申请号：US17915697

申请日：2021-03-31

Applicant: TOKUYAMA CORPORATION

Inventor： Yuki KIKKAWA ,  Tomoaki SATO ,  Takafumi SHIMODA ,  Takayuki NEGISHI

IPC: C09K13/00 ,  H01L21/3213

Abstract: A treatment liquid for a semiconductor containing a group 6 metal, the treatment liquid containing hypobromite ions. Also provided is a treatment liquid for a semiconductor containing a group 6 metal, the treatment liquid characterized by being formed by adding and mixing at least a bromine-containing compound, an oxidizing agent, a base compound, and water, wherein relative to a total mass, an added amount of the bromine-containing compound is 0.008 mass % or more and less than 10 mass % as an amount of bromine element, and an added amount of the oxidizing agent is 0.1 mass ppm or more and 20 mass % or less; and pH at 25° C. is 8 or higher and 14 or lower. Further provided is a method for producing the treatment liquid for a semiconductor.

公开(公告)号：US20210388508A1

公开(公告)日：2021-12-16

申请号：US17261387

申请日：2020-07-08

Applicant: TOKUYAMA CORPORATION

Inventor： Tomoaki SATO ,  Yuki KIKKAWA ,  Takafumi SHIMODA ,  Takayuki NEGISHI

IPC: C23F1/40 ,  H01L21/306

Abstract: Provided is a treatment liquid for a semiconductor with ruthenium, containing a hypobromite ion. Also provided is a treatment liquid for a semiconductor with ruthenium, containing at least a bromine-containing compound, an oxidizing agent, a basic compound, and water which are added and mixed, wherein the liquid has the bromine-containing compound added in an amount of 0.01 mass % or more and less than 2 mass % as a bromine element content with respect to the total mass of the liquid, has the oxidizing agent added in an amount of 0.1 mass % or more and 10 mass % or less with respect to the total mass, and has a pH of 8 or more and 14 or less. Further provided is a method of producing a treatment liquid for a semiconductor with ruthenium, including a step of mixing a bromine-containing compound with a solution containing a hypochlorous acid compound and a basic compound.

公开(公告)号：US20250084309A1

公开(公告)日：2025-03-13

申请号：US18707255

申请日：2023-10-02

Applicant: TOKUYAMA CORPORATION

Inventor： Yuzan SUZUKI ,  Yuki KIKKAWA ,  Tomoaki SATO

IPC: C09K13/04 ,  H01L21/3213

Abstract: Provided is a treatment liquid for a semiconductor to be used for removing a transition metal-containing substance on a substrate, the treatment liquid for a semiconductor containing a specific halogen oxyacid ion, at least one ion selected from the group consisting of a bromide ion, a bromite ion, a bromate ion, a chloride ion, a chlorate ion, an iodate ion, an iodide ion, and a triiodide ion, and at least one metal selected from the group consisting of Ca, Na, K, Cr, Ni, and Al, wherein a concentration of any one metal of Ca, Na, K, Cr, Ni, or Al is 0.1 ppt or more and 200 ppt or less.

公开(公告)号：US20230207329A1

公开(公告)日：2023-06-29

申请号：US17801964

申请日：2021-02-25

Applicant: TOKUYAMA CORPORATION

Inventor： Tomoaki SATO ,  Yuki KIKKAWA ,  Takafumi SHIMODA ,  Takayuki NEGISHI

IPC: H01L21/3213

CPC classification number: H01L21/32134

Abstract: Provided is a treatment liquid for a semiconductor with ruthenium including a ligand which coordinates to ruthenium, the treatment liquid is a treatment liquid for inhibiting a ruthenium-containing gas generated when contacting a semiconductor wafer including ruthenium with the treatment liquid in a semiconductor forming process. Also provided is an inhibitor for the generation of a ruthenium-containing gas, including a compound having a carbonyl group or a heterocyclic compound. Further provided is a treatment agent for a ruthenium-containing waste liquid, including a compound having a carbonyl group or a heterocyclic compound.

公开(公告)号：US20220411937A1

公开(公告)日：2022-12-29

申请号：US17642059

申请日：2021-11-25

Applicant: TOKUYAMA CORPORATION

Inventor： Tomoaki SATO ,  Yuki KIKKAWA ,  Takafumi SHIMODA ,  Takayuki NEGISHI

IPC: C23F1/40 ,  H01L21/3213

Abstract: The present invention provides a semiconductor wafer treatment liquid, the treatment liquid including at least one hypohalite ion, and at least one anion species selected from halate ion, halite ion and halide ion, wherein at least one of the anion species has a content of 0.30 mol/L or more and 6.00 mol/L or less relative to the treatment liquid.

公开(公告)号：US20220328320A1

公开(公告)日：2022-10-13

申请号：US17708596

申请日：2022-03-30

Applicant: TOKUYAMA CORPORATION

Inventor： Yuki KIKKAWA ,  Tomoaki SATO ,  Takayuki NEGISHI

IPC: H01L21/306

Abstract: Provided are: a semiconductor treatment liquid containing a hypobromite ion, in which the concentration of the hypobromite ion is 0.1 μmol/L or more and less than 0.001 mol/L; a RuO4 gas generation inhibitor containing an onium salt composed of an onium ion and a bromine-containing ion, in which the hypobromite ion concentration is 0.1 μmol/L or more and less than 0.001 mol/L; and a method of producing a halogen oxyacid, the method including allowing a bromine salt, an organic alkali, and a halogen to react with each other to obtain the halogen oxyacid.

公开(公告)号：US20220298416A1

公开(公告)日：2022-09-22

申请号：US17636539

申请日：2021-08-06

Applicant: TOKUYAMA CORPORATION

Inventor： Yuki KIKKAWA ,  Tomoaki SATO ,  Takafumi SHIMODA ,  Takayuki NEGISHI

IPC: C09K13/00 ,  H01L21/3213

Abstract: Provided is a treatment liquid for etching a transition metal on a semiconductor wafer, the treatment liquid comprising: (A) a hypohalite ion or periodate ion; and (B) an alkylammonium salt represented by the following Formula (1). (wherein a is an integer from 6 to 20, R1, R2, and R3 are independently a hydrogen atom or an alkyl group having carbon number from 1 to 20, and X− is a bromine-containing ion), and a method of etching a transition metal by bringing the treatment liquid for semiconductor wafers into contact with the transition metal used in a semiconductor formation process.