公开(公告)号：US09865452B2

公开(公告)日：2018-01-09

申请号：US15084789

申请日：2016-03-30

Applicant: Tokyo Electron Limited

Inventor： Kotaro Oishi ,  Keisuke Egashira ,  Kouzou Tachibana ,  Hideaki Udou

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02057 ,  H01L21/67017 ,  H01L21/67028

Abstract: Disclosed is a substrate processing method that includes a water-repellency step, a rinse step, and a dry step. In the water-repellency step, a water-repellent agent which is heated to a first predetermined temperature and then reaches a second predetermined temperature lower than the first predetermined temperature, is supplied to a substrate. In the rinse step, a rinse liquid is supplied to the substrate after the water-repellency step. In the dry step, the rinse liquid on the substrate after the rinse step is removed.

公开(公告)号：US09687873B2

公开(公告)日：2017-06-27

申请号：US14722191

申请日：2015-05-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kouzou Tachibana

IPC: B05C11/02 ,  H01L21/67 ,  H01L21/687 ,  G03F7/16 ,  F26B21/02

CPC classification number: B05C11/023 ,  F26B21/028 ,  G03F7/162 ,  H01L21/6715 ,  H01L21/68721 ,  H01L21/68742

Abstract: A coating film forming apparatus includes a substrate holding unit, a ring-shaped member annularly installed along a circumferential direction of the substrate so as to cover an upper side of a peripheral edge portion of the substrate, and a control unit that outputs a control signal so as to perform: positioning the ring-shaped member at a processing position where an air flow flowing above the peripheral edge portion of the substrate is straightened; rotating the substrate at a first revolution number such that a coating liquid supplied to a central portion of the substrate is diffused toward the peripheral edge portion by a centrifugal force; bringing the ring-shaped member to a retreated position where an air flow flowing near a front surface of the substrate is prevented from becoming turbulent; and reducing the revolution number of the substrate to a second revolution number lower than the first revolution number.

公开(公告)号：US09217922B2

公开(公告)日：2015-12-22

申请号：US13949733

申请日：2013-07-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Minoru Kubota ,  Kousuke Yoshihara ,  Kouzou Tachibana

IPC: G03F7/16 ,  B05C5/02 ,  H01L21/67 ,  B05C11/10 ,  B05C11/08 ,  B08B3/10 ,  B08B3/08

CPC classification number: G03F7/16 ,  B05C5/0258 ,  B05C11/08 ,  B05C11/1002 ,  B08B3/08 ,  B08B3/10 ,  G03F7/162 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67178

Abstract: A liquid processing apparatus includes a substrate holding unit arranged within a processing cup and configured to horizontally hold a substrate, a rotating mechanism configured to rotate the substrate holding unit about a vertical axis, a processing liquid supply unit configured to supply a processing liquid onto a surface of the substrate, and an exhaust mechanism configured to discharge an atmospheric gas around the substrate. The exhaust mechanism includes an exhaust flow path connected to an exhaust port formed at the processing cup, a circulation flow path branched from the exhaust flow path and configured to communicate with the processing cup, a gas liquid separator, a first regulator valve installed at one end of the exhaust flow path, and a second regulator valve installed at the other end of the exhaust flow path.

Abstract translation: 液体处理装置包括布置在处理杯内并被配置为水平地保持基板的基板保持单元，被配置为使基板保持单元围绕垂直轴旋转的旋转机构，配置成将处理液供给到 基板的表面，以及构造成将基板周围的大气气体排出的排气机构。 排气机构包括连接到形成在处理杯处的排气口的排气流路，从排气流路分支配置成与处理杯连通​​的循环流路，气液分离器，安装在处理杯一侧的第一调节阀 排气流路的端部，以及安装在排气流路的另一端的第二调节阀。