公开(公告)号：US11387123B2

公开(公告)日：2022-07-12

申请号：US16857446

申请日：2020-04-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Powen Huang ,  Yao-Yuan Shang ,  Kuo-Shu Tseng ,  Yen-Yu Chen ,  Chun-Chih Lin ,  Yi-Ming Dai

IPC: G05B19/418 ,  H01L21/67 ,  H01L21/677 ,  H01L21/673 ,  H01L21/02 ,  G01D7/00 ,  G01D5/00 ,  B08B3/04

Abstract: A method for fault detection in a fabrication facility is provided. The method includes moving a wafer carrier along a predetermined path multiple times using a transportation apparatus. The method also includes collecting data associated with an environmental condition within the wafer carrier or around the wafer carrier using a metrology tool on the predetermined path in a previous movement of the transportation apparatus. The method further includes measuring the environmental condition within the wafer carrier or around the wafer carrier using the metrology tool during the movement of the wafer carrier. In addition, the method includes issuing a warning when the measured environmental condition is outside a range of acceptable values. The range of acceptable values is derived from the data collected in the previous movement of the transportation apparatus.

公开(公告)号：US09570334B2

公开(公告)日：2017-02-14

申请号：US14674120

申请日：2015-03-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yao-Yuan Shang ,  Kuo-Shu Tseng ,  Chune-Te Yang ,  Chi-Hsin Chan ,  Chung-Jhieh Chen

IPC: H01L21/68 ,  G06T7/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  H01L21/027 ,  H01L21/66 ,  H01L21/677

CPC classification number: H01L21/681 ,  G03F7/162 ,  G03F7/168 ,  G06T7/74 ,  G06T2207/30148 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/68707

Abstract: A method for positioning a wafer in semiconductor fabrication is provided. The method includes sending a wafer into a processing chamber by a transferring module. The method further includes producing a video image in relation to an edge of the wafer by a monitoring module. The method also includes performing an image analysis on the video image to determine if the edge of the wafer is in a correct position. If the edge of the wafer is not in a correct position a shifting value is calculated and the wafer is moved according to the shifting value.

Abstract translation: 提供了一种用于在半导体制造中定位晶片的方法。 该方法包括通过转移模块将晶片送入处理室。 该方法还包括通过监视模块产生相对于晶片边缘的视频图像。 该方法还包括对视频图像执行图像分析以确定晶片的边缘是否处于正确的位置。 如果晶片的边缘不在正确位置，则计算偏移值，并根据移动值移动晶片。

公开(公告)号：US20140231671A1

公开(公告)日：2014-08-21

申请号：US13771112

申请日：2013-02-20

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Yu-Ying LU ,  Sung-Po Yang ,  Ding-I Liu ,  Kuo-Shu Tseng ,  Chung-Wen Chang

IPC: B05D3/06

CPC classification number: B05D3/067 ,  H01L21/67115 ,  H01L21/6776

Abstract: A UV curing system includes an enclosure defining an interior, a UV radiation source disposed within the interior of the enclosure, and a first window disposed within the interior of the enclosure. The first window creates a barrier that separates the UV radiation source and a processing chamber. A second window is disposed within the interior of the enclosure at a distance from the first window to define a gas channel. The second window defines a plurality of openings such that the gas channel is in fluid communication with the processing chamber. A gas inlet conduit is in fluid communication with the gas channel and is configured to introduce a cooling gas into the gas channel. A gas outlet is in fluid communication with the processing chamber and is configured to remove gas from the processing chamber.

Abstract translation: UV固化系统包括限定内部的外壳，设置在外壳内部的UV辐射源以及设置在外壳内部的第一窗口。 第一个窗口创建一个隔离UV辐射源和一个处理室的屏障。 第二窗口设置在与第一窗口相距一定距离的外壳的内部，以限定气体通道。 第二窗口限定多个开口，使得气体通道与处理室流体连通。 气体入口导管与气体通道流体连通，并且构造成将冷却气体引入气体通道。 气体出口与处理室流体连通并且被配置为从处理室去除气体。