中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

19 records (took 0.021 seconds)

    PACKAGE STRUCTURE
    12.
    发明申请
    PACKAGE STRUCTURE 审中-公开

    公开(公告)号：US20200067173A1

    公开(公告)日：2020-02-27

    申请号：US16671182

    申请日：2019-11-01

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Nan-Chin Chuang ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chao-Wen Shih ,  Shou-Zen Chang

    IPC: H01Q1/22 ,  H01L23/31 ,  H01Q21/24 ,  H01Q21/00 ,  H01L23/552 ,  H01L23/00 ,  H01L23/66 ,  H01Q1/52 ,  H01Q19/30

    Abstract: A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.

    Package structure
    13.
    发明授权
    Package structure 有权

    公开(公告)号：US10483617B2

    公开(公告)日：2019-11-19

    申请号：US15879456

    申请日：2018-01-25

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Nan-Chin Chuang ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Chao-Wen Shih ,  Shou-Zen Chang

    IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  H01L23/552 ,  H01Q21/00 ,  H01Q21/24 ,  H01Q1/52 ,  H01Q19/30 ,  H01Q15/14 ,  H01Q21/28

    Abstract: A package structure including an insulating encapsulation, at least one semiconductor die, at least one first antenna and at least one second antenna is provided. The insulating encapsulation includes a first portion, a second portion and a third portion, wherein the second portion is located between the first portion and the third portion. The at least one semiconductor die is encapsulated in the first portion of the insulating encapsulation, and the second portion and the third portion are stacked on the at least one semiconductor die. The at least one first antenna is electrically connected to the at least one semiconductor die and encapsulated in the third portion of the insulating encapsulation. The at least one second antenna is electrically connected to the at least one semiconductor die and encapsulated in the second portion of the insulating encapsulation.

    Semiconductor package structure
    14.
    发明授权
    Semiconductor package structure 有权

    公开(公告)号：US11004810B2

    公开(公告)日：2021-05-11

    申请号：US16714768

    申请日：2019-12-15

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Kai-Chiang Wu ,  Chun-Lin Lu ,  Chao-Wen Shih ,  Han-Ping Pu ,  Nan-Chin Chuang

    IPC: H01L23/66 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01Q21/06 ,  H01Q1/22 ,  H01L23/31 ,  H01L21/683 ,  H01Q21/28 ,  H01Q1/40

    Abstract: A semiconductor package structure including an encapsulation body, an RFIC chip, a first antenna structure, and a second antenna structure is provided. The RFIC chip may be embedded in the encapsulation body. The first antenna structure may be disposed at a lateral side of the RFIC chip, electrically connected to the RFIC chip, and include a first conductor layer and a plurality of first patches opposite to the first conductor layer. The second antenna structure may be stacked on the RFIC chip, electrically connected to the RFIC chip, and include a second conductor layer and a plurality of second patches opposite to the second conductor layer. The first patches and the second patches are located at a surface of the encapsulation body. A first distance between the first conductor layer and the first patches is different from a second distance between the second conductor layer and the second patches.

    Semiconductor package structure
    16.
    发明授权
    Semiconductor package structure 有权

    公开(公告)号：US10510693B2

    公开(公告)日：2019-12-17

    申请号：US15717940

    申请日：2017-09-28

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Kai-Chiang Wu ,  Chun-Lin Lu ,  Chao-Wen Shih ,  Han-Ping Pu ,  Nan-Chin Chuang

    IPC: H01L23/66 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01Q21/06 ,  H01Q1/22 ,  H01L23/31

    Abstract: A semiconductor package structure including an encapsulation body, an RFIC chip, a first antenna structure, and a second antenna structure is provided. The RFIC chip may be embedded in the encapsulation body. The first antenna structure may be disposed at a lateral side of the RFIC chip, electrically connected to the RFIC chip, and include a first conductor layer and a plurality of first patches opposite to the first conductor layer. The second antenna structure may be stacked on the RFIC chip, electrically connected to the RFIC chip, and include a second conductor layer and a plurality of second patches opposite to the second conductor layer. The first patches and the second patches are located at a surface of the encapsulation body. A first distance between the first conductor layer and the first patches is different from a second distance between the second conductor layer and the second patches.

Patent Agency Ranking