公开(公告)号：US07614293B2

公开(公告)日：2009-11-10

申请号：US10571683

申请日：2005-03-03

申请人： Takaki Kuno ,  Keiji Maeda ,  Yoshinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima ,  Seiichi Suda ,  Masato Yoshiya ,  Norio Yamaguchi

发明人： Takaki Kuno ,  Keiji Maeda ,  Yoshinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima ,  Seiichi Suda ,  Masato Yoshiya ,  Norio Yamaguchi

IPC分类号： G01N19/04

CPC分类号： B29C33/38 ,  B29C33/56 ,  G01N19/04 ,  H01L2224/48091 ,  Y10T428/2839 ,  H01L2924/00014

摘要： A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface, releasability between the cured resin and the mold surface is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface is established. With this evaluation method, a material with high releasability can readily be provided. Further, if the material with high releasability is used for the mold surface of the upper mold, a mold for molding a resin having excellent releasability can be obtained.

摘要翻译： 流体树脂与其接触的上模的模具表面具有氧化物。 氧化物含有金属阳离子和离子。 场强基于金属阳离子的价数和离子的离子半径计算。 基于在强度值和固化树脂与模具表面之间的粘合强度之间建立的预定关系，评估固化树脂和模具表面之间的脱模性。 由此，建立了评价固化树脂与模具表面之间的剥离性的方法。 通过该评价方法，可以容易地提供具有高脱模性的材料。 此外，如果将具有高脱模性的材料用于上模的模具表面，则可以获得具有优异的脱模性的树脂模制用模具。

公开(公告)号：US20060286346A1

公开(公告)日：2006-12-21

申请号：US10557003

申请日：2005-01-25

申请人： Takaki Kuno ,  Keiji Maeda ,  Yoshinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima

发明人： Takaki Kuno ,  Keiji Maeda ,  Yoshinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima

IPC分类号： B32B3/10

CPC分类号： B29C43/18 ,  B29C33/10 ,  B29C33/3814 ,  B29C43/10 ,  B29C45/14639 ,  B29C45/345 ,  B29C2043/3222 ,  C04B38/02 ,  C04B2111/00267 ,  C04B2111/00293 ,  H01L2224/48091 ,  H01L2924/181 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/249953 ,  Y10T428/249956 ,  Y10T428/249957 ,  Y10T428/249969 ,  Y10T428/249986 ,  C04B35/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A conductive porous material includes a matrix having a sintered compact of an oxide, a communicating opening formed in the matrix, having a small diameter and being permeable to gas and impermeable to substance other than gas, and a conductive layer provided on an internal wall of the communicating opening and receiving a current to generate heat. As conductive material is used, an organic substance adheres on the internal wall of communicating opening. To address this, conductive layer is caused to generate heat to decompose and thus remove the organic substance and thus prevent the communicating opening from clogging.

摘要翻译： 导电性多孔材料包括具有氧化物烧结体的基体，在基体中形成的连通孔，具有小直径并且可透气并且不可渗透气体以外的物质，导电层设置在内壁上 连通开口并接收电流以产生热量。 作为导电材料，有机物粘附在连通孔的内壁上。 为了解决这个问题，导电层产生热分解，从而除去有机物质，从而防止连通开口堵塞。

公开(公告)号：US20060093693A1

公开(公告)日：2006-05-04

申请号：US11262897

申请日：2005-11-01

申请人： Takaki Kuno ,  Yoshinori Noguchi ,  Keiji Maeda ,  Seiichi Suda ,  Satoshi Kitaoka ,  Naoki Kawashima ,  Masato Yoshiya

发明人： Takaki Kuno ,  Yoshinori Noguchi ,  Keiji Maeda ,  Seiichi Suda ,  Satoshi Kitaoka ,  Naoki Kawashima ,  Masato Yoshiya

IPC分类号： B29C70/44

CPC分类号： B29C33/60 ,  B29C33/56 ,  B29C45/02 ,  B29C45/37 ,  B29C70/72 ,  Y10T428/12549 ,  Y10T428/1259

摘要： A low-adhesion material containing a rare-earth element is formed as a layer or a film on a mold surface of a mold for molding a resin. A main component of the low-adhesion material is a rare-earth compound, and Y2O3 is used as an example. A content of the rare-earth compound in the low-adhesion material is not less than 40 percent by volume. Thereby, a mold for molding a resin having excellent releasability can be obtained.

摘要翻译： 将含有稀土元素的低粘合材料作为层或膜形成在用于模制树脂的模具的模具表面上。 低附着材料的主要成分是稀土类化合物，作为实例使用Y 2 O 3 O 3。 低粘合性材料中的稀土类化合物的含量为40体积％以上。 由此，能够得到脱模性优异的树脂成形用模具。

公开(公告)号：US20050154113A1

公开(公告)日：2005-07-14

申请号：US11024484

申请日：2004-12-30

申请人： Takaki Kuno ,  Keiji Maeda ,  Yosinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima

发明人： Takaki Kuno ,  Keiji Maeda ,  Yosinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima

IPC分类号： B29C33/38 ,  B29C33/40 ,  B29C45/02 ,  B29C45/14 ,  B29C45/37 ,  C08J5/00 ,  C08K3/22

CPC分类号： C08J5/00 ,  B29C33/40 ,  B29C33/56 ,  B29C45/02 ,  B29C45/14639 ,  B29C45/37

摘要： The present invention relates to a composite material used for a resin mold for forming hardened resin by hardening fluid resin. The composite material comprises a first material having excellent wear resistance against the fluid resin and a second material having excellent unwettability against the fluid resin. The resin mold comprises a substrate of the first material, a large number of pores each provided to form an opening on a surface of the substrate opposite to the fluid resin and a film of the second material formed along the inner wall surface of each pore at least around the opening. Each of the large number of pores is a communicating hole connecting the surface opposite to the fluid resin and the remaining surface with each other. Therefore, releasability between a mold surface and the hardened resin and wear resistance of the composite material against the fluid resin can be improved.

摘要翻译： 本发明涉及一种用于通过硬化流体树脂形成硬化树脂的树脂模具的复合材料。 复合材料包括对流体树脂具有优异的耐磨性的第一材料和对流体树脂具有优异不耐性的第二材料。 树脂模具包括第一材料的基材，大量的孔各自设置成在基体的与流体树脂相对的表面上形成开口，并且沿着每个孔的内壁表面形成第二材料的膜 至少在开幕周围。 大量的孔中的每一个都是将与流体树脂相对的表面和剩余的表面彼此连接的连通孔。 因此，可以提高模具表面与硬化树脂之间的脱模性和复合材料相对于流体树脂的耐磨性。

公开(公告)号：US07407146B2

公开(公告)日：2008-08-05

申请号：US11024484

申请日：2004-12-30

申请人： Takaki Kuno ,  Keiji Maeda ,  Yosinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima

发明人： Takaki Kuno ,  Keiji Maeda ,  Yosinori Noguchi ,  Satoshi Kitaoka ,  Naoki Kawashima

IPC分类号： B29C33/40

CPC分类号： C08J5/00 ,  B29C33/40 ,  B29C33/56 ,  B29C45/02 ,  B29C45/14639 ,  B29C45/37

摘要： A composite material used for a resin mold for forming hardened resin by hardening fluid resin is provided. The composite material comprises a first material having excellent wear resistance against the fluid resin and a second material having excellent unwettability against the fluid resin. The resin mold comprises a substrate of the first material, a large number of pores each provided to form an opening on a surface of the substrate opposite to the fluid resin and a film of the second material formed along the inner wall surface of each pore at least around the opening. Each of the large number of pores is a communicating hole connecting the surface opposite to the fluid resin and the remaining surface with each other. Therefore, releasability between a mold surface and the hardened resin and wear resistance of the composite material against the fluid resin can be improved.

摘要翻译： 提供了一种用于通过硬化流体树脂形成硬化树脂的树脂模具的复合材料。 复合材料包括对流体树脂具有优异的耐磨性的第一材料和对流体树脂具有优异不耐性的第二材料。 树脂模具包括第一材料的基材，大量的孔各自设置成在基体的与流体树脂相对的表面上形成开口，并且沿着每个孔的内壁表面形成第二材料的膜 至少在开幕周围。 大量的孔中的每一个都是将与流体树脂相对的表面和剩余的表面彼此连接的连通孔。 因此，可以提高模具表面与硬化树脂之间的脱模性和复合材料相对于流体树脂的耐磨性。

公开(公告)号：US20060131780A1

公开(公告)日：2006-06-22

申请号：US11290559

申请日：2005-12-01

申请人： Takaki Kuno ,  Keiji Maeda

发明人： Takaki Kuno ,  Keiji Maeda

IPC分类号： B29C41/42

CPC分类号： B29C41/42 ,  B29C39/36 ,  B29C43/18 ,  B29C45/14639 ,  B29C45/40 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00

摘要： A resin casting mold used for manufacturing a casting product including a cured resin produced by curing a fluid resin filling a cavity includes: a block providing the bottom surface of the cavity; and a driver mechanism for applying a force to the block to move the block in a direction that lies along the bottom surface. The driver mechanism moves the block when the cured resin has been formed to separate the cured resin from the bottom surface. This arrangement allows a thinner casting product with a larger major surface to be properly separated from the cavity surface without damaging the casting product and with high driving efficiencies and without equipment including a resin casting mold with a complicated structure or a large size.

摘要翻译： 一种用于制造包括通过固化填充空腔的流体树脂制备的固化树脂的铸造产品的树脂浇注模具包括：提供空腔底表面的块; 以及用于向所述块施加力以沿着所述底表面的方向移动所述块的驱动器机构。 当已经形成固化树脂以将固化的树脂与底表面分离时，驱动机构移动块。 这种布置允许具有较大主表面的较薄的铸造产品能够与空腔表面适当地分离，而不损坏铸造产品并具有高的驱动效率，并且不包括具有复杂结构或大尺寸的树脂浇注模具的设备。

公开(公告)号：US07486690B2

公开(公告)日：2009-02-03

申请号：US11114229

申请日：2005-04-26

申请人： Keiji Maeda

发明人： Keiji Maeda

IPC分类号： H04L12/56 ,  H04L12/28

CPC分类号： H04L12/4608 ,  H04L12/462

摘要： A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.

摘要翻译： 传输源网桥将根据IEEE1394标准连接到串行总线的节点发送的数据包按照要发送的顺序收集到一个数据包中，然后将其发送到ATM网络上，从而传输目的地网桥接收该数据包， 将其分成多个较小的分组，并按照它们发送的顺序将它们按照IEEE1394标准传输到连接到串行总线的节点。

公开(公告)号：US07957416B2

公开(公告)日：2011-06-07

申请号：US12796348

申请日：2010-06-08

申请人： Keiji Maeda

发明人： Keiji Maeda

IPC分类号： H04L12/56 ,  H04J1/16

CPC分类号： H04L12/4608 ,  H04L12/462

摘要： A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.

摘要翻译： 传输源网桥将根据IEEE1394标准连接到串行总线的节点发送的数据包按照要发送的顺序收集到一个数据包中，然后将其发送到ATM网络上，从而传输目的地网桥接收该数据包， 将其分成多个较小的分组，并按照它们发送的顺序将它们按照IEEE1394标准传输到连接到串行总线的节点。

公开(公告)号：US20100238947A1

公开(公告)日：2010-09-23

申请号：US12796348

申请日：2010-06-08

申请人： Keiji Maeda

发明人： Keiji Maeda

IPC分类号： H04L12/56

CPC分类号： H04L12/4608 ,  H04L12/462

摘要： A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.

摘要翻译： 传输源网桥将根据IEEE1394标准连接到串行总线的节点发送的数据包按照要发送的顺序收集到一个数据包中，然后将其发送到ATM网络上，从而传输目的地网桥接收该数据包， 将其分成多个较小的分组，并按照它们发送的顺序将它们按照IEEE1394标准传输到连接到串行总线的节点。

公开(公告)号：US07399574B2

公开(公告)日：2008-07-15

申请号：US10255353

申请日：2002-09-26

申请人： Shinji Hayashi ,  Shunsuke Sega ,  Hiromu Taguchi ,  Mitsutaka Hasegawa ,  Eiichi Okazaki ,  Keiji Maeda

发明人： Shinji Hayashi ,  Shunsuke Sega ,  Hiromu Taguchi ,  Mitsutaka Hasegawa ,  Eiichi Okazaki ,  Keiji Maeda

IPC分类号： G03C1/73 ,  G03F7/027

CPC分类号： G03F7/0388 ,  G02F1/133514 ,  G02F1/13394 ,  G03F7/0007 ,  G03F7/033 ,  Y10T428/1036 ,  Y10T428/1059

摘要： Provided are a curable resin and a curable resin composition which have alkali-solubility and curability that can freely be adjusted and a high sensitivity, a liquid crystal panel substrate which can maintain an even cell gap, and a liquid crystal panel using the liquid crystal panel substrate to exhibit a superior display quality. A curable resin composition comprising an imide-containing copolymer having a molecular structure wherein a constitutional unit at least the following units are connected: a constitutional unit having a cyclic imide group represented by the formula (1), a constitutional unit having an acid functional group such as a carboxyl group; and a constitutional unit having a photopolymerizing functional group. In a liquid crystal panel substrate (color filter 103), plural spacers (column-shaped spacers 12) are disposed in a non-display region on a substrate 5.

摘要翻译： 提供一种可以自由调节和高灵敏度的碱溶性和固化性的可固化树脂和固化性树脂组合物，能够保持均匀单元间隙的液晶面板基板和使用液晶面板的液晶面板 底物显示出优异的显示质量。 一种包含具有分子结构的含酰亚胺共聚物的固化性树脂组合物，其中至少具有以下单元的结构单元连接：具有式（1）表示的环状酰亚胺基的结构单元，具有酸官能团的结构单元 如羧基; 和具有光聚合官能团的结构单元。 在液晶面板基板（彩色滤光片103）中，在基板5的非显示区域配置多个间隔物（柱状间隔物12）。