公开(公告)号：US20180148371A1

公开(公告)日：2018-05-31

申请号：US15842118

申请日：2017-12-14

申请人： Vitro S.A.B. de C.V.

发明人： Adam D. Polcyn ,  Andrew V. Wagner ,  Harry Buhay ,  Abhinav Bhandari ,  James J. Finley ,  Paul R. Ohodnicki ,  Dennis J. O'Shaughnessy ,  Jeffrey A. Benigni ,  Paul A. Medwick ,  James P. Thiel

IPC分类号： C03C17/36

CPC分类号： C03C17/36 ,  C03C17/3618 ,  C03C17/3639 ,  C03C17/366 ,  C03C2217/42 ,  Y10T428/12542 ,  Y10T428/12549 ,  Y10T428/24851 ,  Y10T428/24917

摘要： An architectural transparency includes a substrate, a first dielectric layer formed over at least a portion of the substrate, a subcritical metallic layer formed over at least a portion of the first dielectric layer, a primer layer formed over the subcritical metallic layer and, a second dielectric layer formed over at least a portion of the primer layer. The primer layer contains an oxygen-capturing material that can be sacrificed during a deposition process or heating process to prevent degradation of the subcritical metallic layer.

公开(公告)号：US09981284B2

公开(公告)日：2018-05-29

申请号：US13728262

申请日：2012-12-27

申请人： Qiang Guo ,  Guoliang Pan ,  Lianxiang Wang ,  Xiaoye Liu

发明人： Qiang Guo ,  Guoliang Pan ,  Lianxiang Wang ,  Xiaoye Liu

IPC分类号： B05D1/06 ,  B05D3/00 ,  C23C4/00 ,  F16C33/00 ,  B05D5/08 ,  F16C33/20 ,  B05D7/00 ,  B05D3/02

CPC分类号： B05D1/06 ,  B05D3/0218 ,  B05D5/083 ,  B05D7/54 ,  B05D2202/00 ,  B05D2350/65 ,  B05D2451/00 ,  F16C33/206 ,  F16C33/208 ,  F16C2202/10 ,  F16C2208/32 ,  F16C2208/36 ,  F16C2223/42 ,  F16C2223/80 ,  F16C2240/48 ,  F16C2240/54 ,  F16C2240/60 ,  Y10T428/12049 ,  Y10T428/12472 ,  Y10T428/12549 ,  B05D2401/32

摘要： A bearing article can include a metal substrate having a bronze layer; a PEEK layer; a PTFE composition layer overlying and penetrating the PEEK layer. A method for preparing a bearing article can include providing a metal substrate with a sintered bronze layer, electrostatic spraying a non-fluorinated polymer onto the metal substrate followed by spraying a fluorinated polymer onto the non-fluorinated polymer and heat rolling to form a laminate.

公开(公告)号：US09863027B2

公开(公告)日：2018-01-09

申请号：US14395521

申请日：2012-06-29

申请人： Tadashi Nakano ,  Masaya Yamamoto ,  Hirofumi Taketsu

发明人： Tadashi Nakano ,  Masaya Yamamoto ,  Hirofumi Taketsu

IPC分类号： B32B15/08 ,  C23C2/06 ,  B32B15/095 ,  C23C8/00 ,  C23C8/16 ,  C22C18/04 ,  C23C28/00 ,  C23C22/73 ,  C23C22/83

CPC分类号： C23C2/06 ,  B32B15/095 ,  B32B2250/03 ,  C22C18/04 ,  C23C8/00 ,  C23C8/16 ,  C23C22/73 ,  C23C22/83 ,  C23C28/00 ,  Y10T428/12535 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12583 ,  Y10T428/1259 ,  Y10T428/12611 ,  Y10T428/12667

摘要： A black-plated steel sheet has a Zn-plating layer containing molten Al and Mg, containing Al in the amount of 1.0-22.0 mass %, containing Mg in the amount of 1.3-10.0 mass %, and having a Zn black oxide distributed in a lamella pattern in the plating layer. The Zn black oxide is a Zn oxide derived from a Zn2Mg phase. The brightness of the surface of the Zn-plating layer containing the molten Al and Mg has an L* value of 60 or less.

公开(公告)号：US09751801B2

公开(公告)日：2017-09-05

申请号：US13738163

申请日：2013-01-10

申请人： Guardian Industries Corp.

发明人： Marcus Frank ,  Anton Dietrich ,  Greg Miller ,  Richard Blacker ,  Muhammad Imran ,  Jean-Marc Lemmer

IPC分类号： C03C17/06 ,  C03C17/36

CPC分类号： C03C17/3626 ,  C03C17/06 ,  C03C17/36 ,  C03C17/3639 ,  C03C17/3652 ,  C03C17/366 ,  Y10T156/10 ,  Y10T428/12549 ,  Y10T428/12597

摘要： Certain example embodiments relate to a coated article including at least one infrared (IR) reflecting layer of a material such as silver or the like in a low-E coating, and methods of making the same. In certain cases, at least one layer of the coating is of or includes nickel and/or titanium (e.g., NixTiyOz). The provision of a layer including nickel titanium and/or an oxide thereof may permit a layer to be used that has good adhesion to the IR reflecting layer, and reduced absorption of visible light (resulting in a coated article with a higher visible transmission). When a layer including nickel titanium oxide is provided directly over and/or under the IR reflecting layer (e.g., as a barrier layer), this may result in improved chemical and mechanical durability. Thus, visible transmission may be improved if desired, without compromising durability; or, durability may simply be increased.

公开(公告)号：US09638842B2

公开(公告)日：2017-05-02

申请号：US13790099

申请日：2013-03-08

申请人： SkyFuel, Inc.

发明人： Gary Jorgensen ,  Randall C. Gee ,  David White

IPC分类号： F24J2/10 ,  G02B5/08 ,  H02S40/22

CPC分类号： G02B5/0808 ,  F24S23/82 ,  H02S40/22 ,  Y02E10/46 ,  Y02E10/52 ,  Y10T428/12549 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/269 ,  Y10T428/2804 ,  Y10T428/31678

摘要： Provided are reflective thin film constructions including a reduced number of layers, which provides for increased solar-weighted hemispherical reflectance and durability. Reflective films include those comprising an ultraviolet absorbing abrasion resistant coating over a metal layer. Also provided are ultraviolet absorbing abrasion resistant coatings and methods for optimizing the ultraviolet absorption of an abrasion resistant coating. Reflective films disclosed herein are useful for solar reflecting, solar collecting, and solar concentrating applications, such as for the generation of electrical power.

公开(公告)号：US09578741B2

公开(公告)日：2017-02-21

申请号：US14388381

申请日：2013-03-26

申请人： JX Nippon Mining & Metals Corporation

发明人： Tomota Nagaura ,  Michiya Kohiki ,  Terumasa Moriyama

IPC分类号： H05K3/38 ,  H05K3/18 ,  H05K3/02 ,  H05K3/06 ,  H05K1/03 ,  H05K1/09 ,  B32B15/20 ,  B32B3/30 ,  B32B15/01 ,  C22C9/00 ,  B32B15/08

CPC分类号： H05K1/09 ,  B32B3/30 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2457/08 ,  C22C9/00 ,  C25D1/04 ,  C25D3/12 ,  C25D3/38 ,  C25D5/12 ,  C25D9/08 ,  H05K1/0313 ,  H05K3/022 ,  H05K3/025 ,  H05K3/06 ,  H05K3/181 ,  H05K3/188 ,  H05K3/381 ,  H05K3/383 ,  H05K3/388 ,  H05K2201/09009 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/12847 ,  Y10T428/12903 ,  Y10T428/1291

摘要： Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 μm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.

摘要翻译： 提供一种用于印刷电路板的铜箔，其在其至少一个表面上包括粗糙层。 在粗糙层中，粒子底部的平均粒径D1与粒子的底部相隔10％的粒子长度为0.2〜1.0μm，粒子长度L1与平均直径D1的比L1 / D1 在颗粒底部为15或更小。 在印刷电路板用铜箔中，当将具有粗糙层的印刷布线用铜箔层压到树脂上，然后通过蚀刻除去铜层时，占据具有凹凸的树脂粗糙面的孔面积之和为 20％以上。 本发明涉及开发用于半导体封装基板的铜箔，其可以避免电路侵蚀而不会导致铜箔的其它性能的劣化。 特别地，本发明的目的是提供一种用于印刷线路板的铜箔和铜箔的制造方法，其中可以通过改善粗糙层来提高铜箔和树脂之间的粘附强度 的铜箔。

公开(公告)号：US09434643B2

公开(公告)日：2016-09-06

申请号：US14794897

申请日：2015-07-09

申请人： Guardian Industries Corp.

发明人： Muhammad Imran ,  Bernd Disteldorf ,  Marcus Frank ,  Richard Blacker

IPC分类号： B32B17/06 ,  B32B15/04 ,  C03C17/36 ,  E06B3/673 ,  E06B3/66 ,  G02B5/08

CPC分类号： C03C17/3642 ,  C03C17/36 ,  C03C17/3618 ,  C03C17/3626 ,  C03C17/3639 ,  C03C17/3644 ,  C03C17/3649 ,  C03C17/3652 ,  C03C17/366 ,  C03C17/3681 ,  C03C2217/22 ,  C03C2217/256 ,  C03C2217/261 ,  C03C2217/281 ,  C03C2217/73 ,  C03C2218/154 ,  C22C19/055 ,  C22C19/056 ,  C22C19/057 ,  E06B3/66 ,  E06B3/6612 ,  E06B3/663 ,  E06B3/67 ,  E06B3/673 ,  E06B9/24 ,  E06B2009/2417 ,  G02B5/0808 ,  G02B5/208 ,  Y10T29/49826 ,  Y10T428/12549

摘要： Certain example embodiments relate to Ni-inclusive ternary alloy being provided as a barrier layer for protecting an IR reflecting layer comprising silver or the like. The provision of a barrier layer comprising nickel, chromium, and/or molybdenum and/or oxides thereof may improve corrosion resistance, as well as chemical and mechanical durability. In certain examples, more than one barrier layer may be used on at least one side of the layer comprising silver. In still further examples, a NixCryMoz-based layer may be used as the functional layer, rather than or in addition to as a barrier layer, in a coating.

公开(公告)号：US20150359095A1

公开(公告)日：2015-12-10

申请号：US14762783

申请日：2014-01-21

申请人： DIC CORPORATION

发明人： Akira MURAKAWA ,  Jun SHIRAKAMI ,  Wataru FUJIKAWA ,  Yukie SAITOU

IPC分类号： H05K1/09 ,  H05K3/24 ,  H05K3/46

CPC分类号： H05K1/092 ,  C08J7/045 ,  C08J2379/08 ,  C08J2475/04 ,  C08J2475/14 ,  C09D5/00 ,  H05K1/0393 ,  H05K3/246 ,  H05K3/386 ,  H05K3/4664 ,  Y10T428/12549

摘要： The present invention provides a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

摘要翻译： 本发明提供一种叠层体，其中层叠至少一层包括载体，底漆层，第一导电层，绝缘层和第二导电层的层，其中绝缘层通过涂覆至少一部分 或整个第一导电层的表面与树脂组合物并干燥树脂组合物; 并且第二导电层包括通过用含有导电物质的流体涂覆绝缘层的表面的一部分或整体而形成的第二电镀种子层，以及形成在第二镀覆种子层的表面上的第二镀层。 该层压板在层间具有高粘合性，并且即使在暴露于高温高湿环境下也能够保持高粘合性。

公开(公告)号：US09206078B2

公开(公告)日：2015-12-08

申请号：US13801635

申请日：2013-03-13

申请人： Intermolecular Inc.

发明人： Guizhen Zhang ,  Jeremy Cheng ,  Guowen Ding ,  Minh Huu Le ,  Daniel Schweigert ,  Yu Wang

IPC分类号： B32B15/04 ,  B32B17/06 ,  C03C17/36 ,  C23C14/14 ,  C23C14/00 ,  C23C14/04

CPC分类号： C23C14/22 ,  C03C17/36 ,  C03C17/3605 ,  C03C17/3618 ,  C03C17/3644 ,  C03C17/3652 ,  C03C17/366 ,  C03C17/3681 ,  C23C14/0036 ,  C23C14/042 ,  C23C14/14 ,  C23C14/34 ,  G02B1/12 ,  G02B1/14 ,  Y10T428/12542 ,  Y10T428/12549 ,  Y10T428/12611 ,  Y10T428/12778 ,  Y10T428/31678

摘要： Provided is High Productivity Combinatorial (HPC) testing methodology of semiconductor substrates, each including multiple site isolated regions. The site isolated regions are used for testing different compositions and/or structures of barrier layers disposed over silver reflectors. The tested barrier layers may include all or at least two of nickel, chromium, titanium, and aluminum. In some embodiments, the barrier layers include oxygen. This combination allows using relative thin barrier layers (e.g., 5-30 Angstroms thick) that have high transparency yet provide sufficient protection to the silver reflector. The amount of nickel in a barrier layer may be 5-10% by weight, chromium—25-30%, titanium and aluminum—30%-35% each. The barrier layer may be co-sputtered in a reactive or inert-environment using one or more targets that include all four metals. An article may include multiple silver reflectors, each having its own barrier layer.

公开(公告)号：US09028972B2

公开(公告)日：2015-05-12

申请号：US13825889

申请日：2011-09-08

申请人： Michiya Kohiki ,  Terumasa Moriyama

发明人： Michiya Kohiki ,  Terumasa Moriyama

IPC分类号： B32B15/20 ,  H05K3/02 ,  H05K3/38 ,  H05K1/09 ,  H05K3/06 ,  C25D1/04 ,  C25D3/38 ,  C25D5/10 ,  C25D5/12 ,  C25D5/16 ,  C25D7/06 ,  C25D11/38 ,  C23C18/16

CPC分类号： H05K3/022 ,  C23C18/1651 ,  C25D1/04 ,  C25D3/38 ,  C25D5/10 ,  C25D5/12 ,  C25D5/16 ,  C25D7/0614 ,  C25D11/38 ,  H05K1/09 ,  H05K3/06 ,  H05K3/38 ,  H05K3/384 ,  H05K3/388 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0307 ,  Y10S428/935 ,  Y10T428/12063 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12549 ,  Y10T428/1291 ,  Y10T428/12993 ,  Y10T428/24355

摘要： A copper foil for a printed wiring board, the copper foil being characterized by having, on at least one surface thereof, a roughed layer of the copper foil in which an average diameter at a particle root (D1) corresponding to a distance of 10% of a particle length from the root, is 0.2 μm to 1.0 μm, and a ratio of the particle length (L1) to the average diameter at the particle root (D1) is 15 or less when L1/D1. A copper foil for a printed wiring board, wherein a sum of area covered by holes on an uneven and roughened surface of a resin is 20% or more at a surface of the resin formed by laminating the resin and a copper foil for a printed wiring having a roughened layer and then removing the copper layer by etching. An object of the present invention is to develop a copper foil for a semiconductor package board in which the aforementioned phenomenon of circuit erosion is avoided without deteriorating other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a producing method thereof, wherein a roughened layer of the copper foil can be improved to enhance the adhesiveness between the copper foil and a resin.

摘要翻译： 1.一种印刷电路板用铜箔，其特征在于，在所述铜箔的至少一面上具有铜箔的粗糙层，所述铜箔的粗糙度平均粒径相当于10％ 的长度为0.2μm〜1.0μm，当L1 / D1为1μm以下时，粒径（D1）的粒径（L1）与平均粒径的比例为15以下。 一种用于印刷线路板的铜箔，其中树脂的不平整和粗糙化表面上由孔覆盖的面积的总和在通过层压树脂形成的树脂和用于印刷布线的铜箔的表面上为20％以上 具有粗糙层，然后通过蚀刻去除铜层。 本发明的目的是开发一种用于半导体封装板的铜箔，其中避免了上述电路侵蚀现象，而不会劣化铜箔的其它性能。 特别地，本发明的目的是提供一种用于印刷线路板的铜箔及其制造方法，其中可以提高铜箔的粗糙层以提高铜箔和树脂之间的粘附性。