摘要:
A process for coating a workpiece with a ceramic material comprising the steps of axially advancing a cylindrical ceramic rod of a ceramic material relative to a workpiece while rotating it about its axis in a vacuum, to feed the ceramic rod into an energy beam for evaporation. The rate of feeding of the ceramic rod depends on the rate of deposition of the evaporated ceramic material on the workpiece.
摘要:
A manufacturing apparatus for a three-dimensional image display includes a control unit configured to cause a display panel bonded to a lens plate while being housed in a decompression chamber to display an inspection chart, to cause an image capture to capture images of the inspection chart multiple times along with an increase in a decompression degree inside the decompression chamber while causing a decompressor to decompress the inside of the decompression chamber, to obtain variance of luminance distribution for each of the images captured by the image capture, to obtain change information of the variance that changes depending on a change in the decompression degree inside the decompression chamber, and to obtain the decompression degree at a change point of the variance based on the obtained change information of the variance.
摘要:
A semiconductor device which is capable of avoiding an increase in pattern ratio and allowing wiring dummy patterns to improve global steps developed by CMP upon insertion of the dummy patterns which are different from an actual wiring pattern. The semiconductor device has a configuration wherein a gate wiring pattern is formed on a semiconductor substrate, a plurality of dummy patterns are provided therearound, and a BPSG oxide film which is flattened by CMP is formed on the gate wiring pattern and the dummy patterns as an interlayer insulating film. In the semiconductor device, the dummy patterns are formed so as to include pattern non-forming regions such as slits.
摘要:
There is provided a gas sensor for measuring the concentration of a specific gas component in a gas under measurement, including a gas diffusion rate limiting portion, a measurement chamber communicating with an atmosphere of the gas under measurement through the gas diffusion rate limiting portion, a sensor element having an ion-conductive layer with first and second surfaces, a first electrode disposed in contact with the first surface of the ion-conductive layer within the measurement chamber and a second electrode disposed in contact with the second surface of the ion-conductive layer and communicating exclusively with the atmosphere of the gas under measurement and a cylindrical support member installing therein the sensor element with the first and second surfaces of the ion-conductive layer directed toward front and base end sides of the support member, respectively.
摘要:
A method of making a semiconductor device manufacturing mask, which makes it possible to suppress a semiconductor-device global step and simply manufacture a highly reliable semiconductor device. Square dummy patterns each having one side of, for example, 0.25 μm or less are inserted into an area other than an actual pattern lying within a semiconductor device manufacturing mask to thereby uniformize a pattern density, enable etching processing without changing conditions set for every semiconductor device manufacturing mask an prevent an increase in global step of a post-CMP interlayer insulating film.
摘要:
The cycle time for mounting electronic components supplied from a tray can be shortened. An electronic component feeder (16) for mounting electronic components has a plurality of height levels (L1, L2, and L3) and can move tables (19, 20, 21) horizontally at the respective levels (L1, L2, and L3). A plurality of conveyers (22, 23, 24) are provided for the respective tables to move them to a pickup stage (A) from a standby stage (B). Transfer head (13) includes nozzles (14a, 14b, 14c) for attracting electronic components by suction, and an upward-downward moving mechanism which moves the nozzles in accordance with the height level of each tray on the pickup stage (A). Since the trays are arranged at the different height levels at the pickup stage position, the conveyers can be moved independently and the transfer heads can individually move the nozzles between the position at which each nozzle picks up electronic components and another position at which the nozzle does not interfere with the pickup operation. Movement of a necessary tray from and to the pick up stage position can be performed quickly without being hindered by an other tray and, as a result, the cycle time for mounting electronic components can be shortened.
摘要:
An apparatus and method for mounting electronic components in which mounting positions are determined by observing identification marks A, B, C and D on a substrate with a camera. The electronic components are mounted on the substrate by correcting programmed data according to the result of the determination of the mounting positions. Correction values are obtained for coordinates of the mounting position with reference to each of a plurality of combinations of any three positions (e.g. A, B and C) selected among the at least four positions of the identification marks A, B, C and D based on coordinate data of the three selected positions before and after deformation (one based on the design data and the other based on the data determined during mounting process). A correction of the programmed data for coordinates of the mounting position is made using a positional correction value, which is a mean value of the correction values.
摘要:
An apparatus and method for improving the productivity and accuracy of mounting electronic components on a substrate. The mounting apparatus includes a line-sensor for image recognition, a carriage head 20 having plural nozzles 21a, 21b and 21c aligned along a predetermined axis. The carriage head 20 is transferred along the direction of the aligned nozzles and above the line-sensor 33 of a recognition member 30. The line-sensor 33 takes images in sequence of the electronic components (chip) vacuum chucked by each nozzle 21a, 21b and 21c in order to recognize positions of the chips 12. Then, based on the recognition results, position deviations of the chips 12 with regard to X, Y and .theta. directions are compensated, and the chips 12 are mounted onto specified coordinate spots of substrate 3. The recognition member 30 includes an adjusting means of rotation angle for crossing the longitudinal direction of line-sensor 33 with the transferring direction of nozzles 21a, 21b and 21c at right angles.
摘要:
An apparatus for mounting electronic components on a circuit board, the apparatus being equipped with an X-Y table assembly moveable in a horizontal plane and monitoring device attached to the X-Y table assembly. An electronic component picking and mounting head is attached to the X-Y table assembly so as to be movable in accordance with the movement thereof and also arranged to be moveable vertically with respect to a lower surface of the X-Y table assembly. The head includes a rotating shaft disposed to be substantially parallel to the X-Y table assembly rotatable about its own axis and at least two nozzles attached to the rotating shaft so as to be rotatable in accordance with the rotation thereof. The nozzles are coupled to an external vacuum device so as to allow a suction of the electronic component and allow it to be carried toward the circuit board, and positioned so that one of the nozzles can face the monitoring device by rotation of the rotating shaft so as to allow the monitoring device to monitor the electronic component picked up by the nozzle. This arrangement permits the electronic component to be effectively mounted on the circuit board in a relative short time.
摘要:
An apparatus for removing stone and gravel from excavated soil by vibration. The apparatus is particularly useful for operation at the foot of a volcano, mountainous district or the like. Characteristic features of the apparatus are that it is self-propelled by means of endless tracks and the excavated soil is separated into stone, gravel and soil with the aid of a sieving means and the separated stone and gravel are discharged from the apparatus by way of a conveyor, while the separated fine soil is conveyed by way of another conveyor and then is scattered rearward by means of a scattering device to be piled up on the working ground.