摘要:
A shift controller controls a transmission for a hybrid vehicle in which: an engine and a motor are connected together via a clutch; and the transmission is placed between the motor and driving wheels. The shift controller has: a first shift controlling unit which performs shift control on a basis of at least one of transmission efficiency of the transmission and power generation efficiency of the motor in a case where regeneration is performed with the clutch disengaged during deceleration of the hybrid vehicle; and a second shift controlling unit which performs shift control to make a transmission gear ratio of the transmission smaller than in the shift control performed by the first shift controlling unit in a case where the regeneration is performed with the clutch engaged during the deceleration of the hybrid vehicle.
摘要:
The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.The electronic component mounting apparatus of the present invention has a paste transfer unit 10 that horizontally, relatively moves a squeegee 11b and a transfer surface 13 with respect to each other, thereby spreading, over the transfer surface 13, a paste film 3 whose thickness is equivalent to the height of a squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13; a storage unit 18 that stores a database defining correlation among bump heights, paste types, and squeegee-gap heights; a computing unit 20 that derives, from the database, a squeegee-gap height G21 in correspondence with a height H1 of a bump of an electronic component to be mounted and a type P2 of paste to be transferred; and a vertical movement mechanism 16b that adjusts the height of the squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13 to a derived squeegee-gap height.
摘要:
A temperature sensor includes: a temperature-sensing element comprising a temperature-sensing portion and an element electrode wire connected to the temperature-sensing portion; a sheath member comprising a sheath tube and a sheath core wire extending from the sheath tube, the sheath core wire being joined to the element electrode wire to form a joint portion; an enclosing member comprising a closed-bottomed tube having a bottom portion at one end, and enclosing at least the temperature-sensing element and the joint portion; and a holding material filling at least a portion of a space enclosed by the enclosing member extending between a front end face of the temperature-sensing portion and the bottom portion of the enclosing member. The element electrode wire includes a bend at an intermediate portion of the element electrode wire between the temperature-sensing portion and the joint portion.
摘要:
A method of making a semiconductor device manufacturing mask, which makes it possible to suppress a semiconductor-device global step and simply manufacture a highly reliable semiconductor device. Square dummy patterns each having one side of, for example, 0.25 μm or less are inserted into an area other than an actual pattern lying within a semiconductor device manufacturing mask to thereby uniformize a pattern density, enable etching processing without changing conditions set for every semiconductor device manufacturing mask an prevent an increase in global step of a post-CMP interlayer insulating film.
摘要:
A method for estimating relative remaining film thickness distribution (CMP pattern ratio distribution) among sparse and dense active regions after CMP on the basis of the layout of a mask pattern in a one-chip mask region. In each mask pattern, a reduced region is created by removing an area of a predetermined width from the mask pattern along the edge of the mask pattern. Then, the one-chip mask region is segmentalized into predetermined regions to create a plurality of segmentalized regions. On each of the segmentalized regions, the area ratio of all reduced regions occupying a region that includes a segmentalized region at a fixed position and has the same size and shape as those of the foregoing one-chip mask region is acquired. Based on the acquired area ratio, the distribution of remaining film thickness of a surface protection film in the one-chip mask region, i.e., the CMP pattern ratio, is acquired.
摘要:
A gas sensor includes an element case 42 with an internal peripheral surface formed as a taper surface 100. A portion of a housing section 43 surrounded by the taper surface 100 and a protective film 48 is filled with a filler 49. When the filler 49 thermally expands at high temperature, the filler 49 is subjected to a component of force in an upward direction by the taper surface 100. Therefore, projection of an element portion 44 involving deformation of the protective film 48 is suppressed, a change ΔL of a propagation distance L to a reflecting section 33 is also suppressed, and a detection accuracy never decreases. In addition, reverberation is reduced.
摘要:
Disclosed herein are a semiconductor device capable of avoiding an increase in pattern ratio and allowing wiring dummy patterns to improve global steps developed by CMP upon insertion of the dummy patterns different from an actual wiring pattern. The semiconductor device has a configuration wherein a gate wiring pattern is formed on a semiconductor substrate, a plurality of dummy patterns are provided therearound, and a BPSG oxide film flattened by CMP is formed on the gate wiring pattern and the dummy patterns as an interlayer insulating film. In the semiconductor device, the dummy patterns are formed so as to include pattern non-forming regions such as slits.
摘要:
An electronic components mounting machine comprising an actuator(7), whereby electronic components are mounted on a substrate, a camera(5) whereby coordinates of recognition marks formed on the substrate at four places at least, are detected, a controller(6) whereby actuator(7) is controlled, a mounting data table(9) wherein information on mounting coordinates and mounting angles of electronic components to be mounted is stored, and a correction data table(10) wherein information on correction values to be applied to the mounting coordinates and mounting angles in reference to the substrate, on which the electronic components are mounted, is stored, and characterized in that the correction data table(10) stores information on correction values for each respective cell, which is formed by dividing the substrate into a plurality of small sections according to a specified rule in reference to the coordinates of recognition marks detected by the camera(5), thus enabling to mount each respective electronic component in accordance with the information on the mounting coordinates and mounting angles stored in the mounting data table(9) after the information is corrected according to the information on correction values stored in the correction data table(10) for each respective cell, where a corresponding electronic component is mounted.
摘要:
An electrical connector includes a plug connector having a plug shell formed with a flange and a receptacle connector having a receptacle shell provided on its outer circumference with a fitting device. The electrical connector further includes a coupling ring surrounding the plug shell and rotatable and holding the flange of the plug shell. The coupling ring has on its inner circumference a fitting device fitted with the first mentioned fitting device and a flange urging portion for urging the flange, and a key provided between the receptacle shell and the plug shell for preventing relative rotation therebetween. The electrical connector includes at least one wave-shaped annular spring interposed between the flange and the flange urging portion and rotatable together with the coupling ring. The wave-shaped annular ring and the flange are formed in their opposed surfaces with at least one protrusion and at least one recess, respectively, which are detachably fitted with each other, thereby forming a click lock device for causing the protrusion to fall into the recesses to produce click sound when the plug connector and the receptacle connector have been fitted.In an alternate embodiment, the electrical connector has some contacts connected to earth circuits which comprise earth lugs.
摘要:
A method for forming a fiber-reinforced metal sheet including the steps of preparing a wire preform in which fibers and a matrix are combined together; arranging regularly a plurality of wire preforms in a predetermined direction in a side-by-side relation; irradiating simultaneously using a CO.sub.2 laser beam, and a YAG laser beam the regularly arranged wire preforms to elevate the temperature of the wire preforms; and pressing the wire preforms by rollers while the wire preforms are at the elevated temperature.