Shift controller and shift controlling method
    1.
    发明授权
    Shift controller and shift controlling method 失效
    换档控制器和换档控制方式

    公开(公告)号:US08512202B2

    公开(公告)日:2013-08-20

    申请号:US13168235

    申请日:2011-06-24

    IPC分类号: B60W20/00

    摘要: A shift controller controls a transmission for a hybrid vehicle in which: an engine and a motor are connected together via a clutch; and the transmission is placed between the motor and driving wheels. The shift controller has: a first shift controlling unit which performs shift control on a basis of at least one of transmission efficiency of the transmission and power generation efficiency of the motor in a case where regeneration is performed with the clutch disengaged during deceleration of the hybrid vehicle; and a second shift controlling unit which performs shift control to make a transmission gear ratio of the transmission smaller than in the shift control performed by the first shift controlling unit in a case where the regeneration is performed with the clutch engaged during the deceleration of the hybrid vehicle.

    摘要翻译: 变速控制器控制混合动力车辆的变速器,其中:发动机和电动机通过离合器连接在一起; 并且变速器被放置在电动机和驱动轮之间。 变速控制器具有:第一变速控制单元,其基于变速器的传动效率和电动机的发电效率中的至少一个进行换档控制,在进行再生时,离合器在混合动力减速期间分离 车辆; 以及第二变速控制单元,其执行变速控制,以使得变速箱的变速比小于在第一变速控制单元执行的变速控制中的变速比,其中在混合动力减速期间离合器接合时进行再生的情况下 车辆。

    Electronic component mounting apparatus and electronic component mounting method
    2.
    发明授权
    Electronic component mounting apparatus and electronic component mounting method 失效
    电子元件安装装置和电子元件安装方法

    公开(公告)号:US08152049B2

    公开(公告)日:2012-04-10

    申请号:US12439282

    申请日:2007-08-23

    IPC分类号: B23K35/12 B23K1/00

    摘要: The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.The electronic component mounting apparatus of the present invention has a paste transfer unit 10 that horizontally, relatively moves a squeegee 11b and a transfer surface 13 with respect to each other, thereby spreading, over the transfer surface 13, a paste film 3 whose thickness is equivalent to the height of a squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13; a storage unit 18 that stores a database defining correlation among bump heights, paste types, and squeegee-gap heights; a computing unit 20 that derives, from the database, a squeegee-gap height G21 in correspondence with a height H1 of a bump of an electronic component to be mounted and a type P2 of paste to be transferred; and a vertical movement mechanism 16b that adjusts the height of the squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13 to a derived squeegee-gap height.

    摘要翻译: 本发明的目的在于提供一种执行膏膜厚度的自动设定的电子部件安装装置和电子部件安装方法。 本发明的电子部件安装装置具有:水平方向相对于彼此移动刮板11b和转印面13的浆料转印单元10,从而在转印面13上铺展厚度为 相当于由刮板11b和转印面13之间的间隙形成的刮板间隙“c”的高度; 存储单元18,其存储限定凸起高度,糊剂类型和刮刀间隙高度之间的相关性的数据库; 计算单元20从数据库导出与要安装的电子部件的凸起的高度H1相对应的刮板间隙高度G21和待传送的浆料的类型P2; 以及垂直移动机构16b,其将由刮板11b和转印面13之间的间隙形成的刮板间隙“c”的高度调节到衍生的刮刀间隙高度。

    TEMPERATURE SENSOR
    3.
    发明申请
    TEMPERATURE SENSOR 有权
    温度感应器

    公开(公告)号:US20090147826A1

    公开(公告)日:2009-06-11

    申请号:US12326175

    申请日:2008-12-02

    IPC分类号: G01K1/00

    摘要: A temperature sensor includes: a temperature-sensing element comprising a temperature-sensing portion and an element electrode wire connected to the temperature-sensing portion; a sheath member comprising a sheath tube and a sheath core wire extending from the sheath tube, the sheath core wire being joined to the element electrode wire to form a joint portion; an enclosing member comprising a closed-bottomed tube having a bottom portion at one end, and enclosing at least the temperature-sensing element and the joint portion; and a holding material filling at least a portion of a space enclosed by the enclosing member extending between a front end face of the temperature-sensing portion and the bottom portion of the enclosing member. The element electrode wire includes a bend at an intermediate portion of the element electrode wire between the temperature-sensing portion and the joint portion.

    摘要翻译: 温度传感器包括:温度感测元件,包括温度感测部分和连接到温度感测部分的元件电极线; 护套构件,其包括护套管和从所述护套管延伸的鞘芯线,所述护芯线与所述元件电极线接合以形成接合部; 封闭构件,其包括在一端具有底部的封闭底管,并且至少包围所述温度感测元件和所述接合部分; 以及保持材料,其填充由所述封闭构件包围的空间的至少一部分,所述封闭构件在所述温度检测部的前端面与所述封闭构件的底部之间延伸。 元件电极线包括在温度感测部分和接头部分之间的元件电极线的中间部分处的弯曲部。

    Method of making a semiconductor device manufacturing mask substrate
    4.
    发明授权
    Method of making a semiconductor device manufacturing mask substrate 有权
    制造半导体器件制造掩模基板的方法

    公开(公告)号:US07157192B2

    公开(公告)日:2007-01-02

    申请号:US11101396

    申请日:2005-04-08

    申请人: Takeshi Morita

    发明人: Takeshi Morita

    IPC分类号: G03F1/00 G03C5/00

    CPC分类号: G03F1/36

    摘要: A method of making a semiconductor device manufacturing mask, which makes it possible to suppress a semiconductor-device global step and simply manufacture a highly reliable semiconductor device. Square dummy patterns each having one side of, for example, 0.25 μm or less are inserted into an area other than an actual pattern lying within a semiconductor device manufacturing mask to thereby uniformize a pattern density, enable etching processing without changing conditions set for every semiconductor device manufacturing mask an prevent an increase in global step of a post-CMP interlayer insulating film.

    摘要翻译: 制造半导体器件制造掩模的方法,其可以抑制半导体器件全局步骤并简单地制造高可靠性的半导体器件。 将各自具有例如0.25μm或更小的一侧的平面虚拟图案插入到位于半导体器件制造掩模内的实际图案之外的区域中,从而使图案密度均匀化,使得能够进行蚀刻处理而不改变为每个半导体设置的条件 器件制造掩模,防止后CMP层间绝缘膜的全局步长增加。

    METHOD FOR ESTIMATING REMAINING FILM THICKNESS DISTRIBUTION, METHOD FOR DESIGNING PATTERNING MASK USING THE METHOD FOR ESTIMATING REMAINING FILM THICKNESS DISTRIBUTION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES BY USING PATTERNING MASK DESIGNED BY USING THE METHOD FOR ESTIMATING REMAINING FILM THICKNESS DISTRIBUTION
    5.
    发明授权
    METHOD FOR ESTIMATING REMAINING FILM THICKNESS DISTRIBUTION, METHOD FOR DESIGNING PATTERNING MASK USING THE METHOD FOR ESTIMATING REMAINING FILM THICKNESS DISTRIBUTION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES BY USING PATTERNING MASK DESIGNED BY USING THE METHOD FOR ESTIMATING REMAINING FILM THICKNESS DISTRIBUTION 失效
    用于估算剩余薄膜厚度分布的方法,使用用于估算剩余薄膜厚度分布的方法来设计图案掩模的方法,以及通过使用通过使用用于估计剩余薄膜厚度分布的方法设计的图案面来制造半导体器件的方法

    公开(公告)号:US06905966B2

    公开(公告)日:2005-06-14

    申请号:US10627734

    申请日:2003-07-28

    申请人: Takeshi Morita

    发明人: Takeshi Morita

    摘要: A method for estimating relative remaining film thickness distribution (CMP pattern ratio distribution) among sparse and dense active regions after CMP on the basis of the layout of a mask pattern in a one-chip mask region. In each mask pattern, a reduced region is created by removing an area of a predetermined width from the mask pattern along the edge of the mask pattern. Then, the one-chip mask region is segmentalized into predetermined regions to create a plurality of segmentalized regions. On each of the segmentalized regions, the area ratio of all reduced regions occupying a region that includes a segmentalized region at a fixed position and has the same size and shape as those of the foregoing one-chip mask region is acquired. Based on the acquired area ratio, the distribution of remaining film thickness of a surface protection film in the one-chip mask region, i.e., the CMP pattern ratio, is acquired.

    摘要翻译: 基于在单片掩模区域中的掩模图案的布局来估计CMP之后的稀疏和致密有源区域中的相对剩余膜厚度分布(CMP图案比分布)的方法。 在每个掩模图案中,通过从掩模图案沿着掩模图案的边缘去除预定宽度的区域来产生缩小区域。 然后,将单芯片掩模区域分割成预定区域以产生多个分段化区域。 在每个分段区域上,获取占据包括固定位置处的分段区域并且具有与上述单片掩模区域相同的尺寸和形状的区域的所有缩小区域的面积比。 基于所获取的面积比,获得单片掩模区域中的表面保护膜的剩余膜厚度的分布,即CMP图案比。

    Gas sensor and gas concentration detecting device
    6.
    发明授权
    Gas sensor and gas concentration detecting device 失效
    气体传感器和气体浓度检测装置

    公开(公告)号:US06892565B2

    公开(公告)日:2005-05-17

    申请号:US10379202

    申请日:2003-03-06

    摘要: A gas sensor includes an element case 42 with an internal peripheral surface formed as a taper surface 100. A portion of a housing section 43 surrounded by the taper surface 100 and a protective film 48 is filled with a filler 49. When the filler 49 thermally expands at high temperature, the filler 49 is subjected to a component of force in an upward direction by the taper surface 100. Therefore, projection of an element portion 44 involving deformation of the protective film 48 is suppressed, a change ΔL of a propagation distance L to a reflecting section 33 is also suppressed, and a detection accuracy never decreases. In addition, reverberation is reduced.

    摘要翻译: 气体传感器包括具有形成为锥形表面100的内周面的元件壳体42。 被锥形表面100包围的容纳部分43的一部分和保护膜48填充有填充物49。 当填料49在高温下热膨胀时,通过锥形表面100使填料49向上的方向受到力的分量。 因此,抑制涉及保护膜48的变形的元件部44的突出,也抑制了与反射部33的传播距离L的变化量ΔL,并且检测精度不会降低。 此外,混响减少。

    Semiconductor device and method of manufacturing the same
    7.
    发明申请
    Semiconductor device and method of manufacturing the same 失效
    半导体装置及其制造方法

    公开(公告)号:US20050093165A1

    公开(公告)日:2005-05-05

    申请号:US10766471

    申请日:2004-01-29

    申请人: Takeshi Morita

    发明人: Takeshi Morita

    摘要: Disclosed herein are a semiconductor device capable of avoiding an increase in pattern ratio and allowing wiring dummy patterns to improve global steps developed by CMP upon insertion of the dummy patterns different from an actual wiring pattern. The semiconductor device has a configuration wherein a gate wiring pattern is formed on a semiconductor substrate, a plurality of dummy patterns are provided therearound, and a BPSG oxide film flattened by CMP is formed on the gate wiring pattern and the dummy patterns as an interlayer insulating film. In the semiconductor device, the dummy patterns are formed so as to include pattern non-forming regions such as slits.

    摘要翻译: 这里公开了一种半导体器件,其能够避免图案比率的增加,并且允许布线虚拟图案在插入与实际布线图案不同的伪图案时改善CMP产生的全局步骤。 半导体器件具有其中在半导体衬底上形成栅极布线图案的构造,在其周围设置多个虚设图案,并且在栅极布线图案和虚设图案上形成由CMP平坦化的BPSG氧化膜作为层间绝缘 电影。 在半导体器件中,虚设图案形成为包括图案非形成区域,例如狭缝。

    Device and method for mounting electronic parts
    8.
    发明授权
    Device and method for mounting electronic parts 失效
    用于安装电子部件的装置和方法

    公开(公告)号:US6016599A

    公开(公告)日:2000-01-25

    申请号:US875348

    申请日:1997-11-25

    摘要: An electronic components mounting machine comprising an actuator(7), whereby electronic components are mounted on a substrate, a camera(5) whereby coordinates of recognition marks formed on the substrate at four places at least, are detected, a controller(6) whereby actuator(7) is controlled, a mounting data table(9) wherein information on mounting coordinates and mounting angles of electronic components to be mounted is stored, and a correction data table(10) wherein information on correction values to be applied to the mounting coordinates and mounting angles in reference to the substrate, on which the electronic components are mounted, is stored, and characterized in that the correction data table(10) stores information on correction values for each respective cell, which is formed by dividing the substrate into a plurality of small sections according to a specified rule in reference to the coordinates of recognition marks detected by the camera(5), thus enabling to mount each respective electronic component in accordance with the information on the mounting coordinates and mounting angles stored in the mounting data table(9) after the information is corrected according to the information on correction values stored in the correction data table(10) for each respective cell, where a corresponding electronic component is mounted.

    摘要翻译: PCT No.PCT / JP96 / 03412 Sec。 371日期:1997年11月25日 102(e)1997年11月25日日期PCT 1996年11月21日PCT PCT。 公开号WO97 / 20456 日期:1997年5月6日电子元件安装机包括致动器(7),其中电子部件安装在基板上,照相机(5)至少检测在四个位置形成在基板上的识别标记的坐标,控制器 (6),其中控制致动器(7),其中存储有关要安装的电子部件的安装坐标和安装角度的信息的安装数据表(9),以及校正数据表(10),其中关于校正值的信息为 应用于相对于其上安装有电子部件的基板的安装坐标和安装角度,并且其特征在于,校正数据表(10)存储关于每个相应单元的校正值的信息,每个单元由 根据照相机(5)检测到的识别标记的坐标,根据规定将基板分割为多个小部分,从而能够 根据存储在校正数据表(10)中的关于校正数据表(10)中的每个相应的校正值的信息,根据关于存储在安装数据表(9)中的安装坐标和安装角度的信息,安装每个相应的电子部件 其中安装相应的电子部件。

    Electrical connector with rotatable locking ring
    9.
    发明授权
    Electrical connector with rotatable locking ring 失效
    带可旋转锁定环的电气连接器

    公开(公告)号:US5181860A

    公开(公告)日:1993-01-26

    申请号:US675253

    申请日:1991-03-26

    IPC分类号: H01R13/623 H01R13/639

    CPC分类号: H01R13/639 H01R13/623

    摘要: An electrical connector includes a plug connector having a plug shell formed with a flange and a receptacle connector having a receptacle shell provided on its outer circumference with a fitting device. The electrical connector further includes a coupling ring surrounding the plug shell and rotatable and holding the flange of the plug shell. The coupling ring has on its inner circumference a fitting device fitted with the first mentioned fitting device and a flange urging portion for urging the flange, and a key provided between the receptacle shell and the plug shell for preventing relative rotation therebetween. The electrical connector includes at least one wave-shaped annular spring interposed between the flange and the flange urging portion and rotatable together with the coupling ring. The wave-shaped annular ring and the flange are formed in their opposed surfaces with at least one protrusion and at least one recess, respectively, which are detachably fitted with each other, thereby forming a click lock device for causing the protrusion to fall into the recesses to produce click sound when the plug connector and the receptacle connector have been fitted.In an alternate embodiment, the electrical connector has some contacts connected to earth circuits which comprise earth lugs.

    摘要翻译: 电连接器包括具有形成有凸缘的插头壳和插座连接器的插头连接器,插座连接器具有在其外圆周上设置有插入装置的插座壳体。 电连接器还包括围绕插头外壳并可旋转并保持插头外壳的凸缘的联接环。 联接环在其内周上具有装配有第一所述装配装置的装配装置和用于推动凸缘的凸缘推动部分,以及设置在插座壳体和插塞壳体之间的钥匙,用于防止它们之间的相对旋转。 电连接器包括至少一个波形环形弹簧,其插入在凸缘和凸缘推动部分之间并与联接环一起旋转。 波形环形环和凸缘在其相对表面上分别形成有至少一个突起和至少一个凹部,该凹部彼此可拆卸地配合,从而形成用于使突起落入 当安装插头连接器和插座连接器时,产生点击声的凹槽。 在替代实施例中,电连接器具有连接到包括接地片的接地电路的一些触点。

    Method for forming a fiber-reinforced metal sheet
    10.
    发明授权
    Method for forming a fiber-reinforced metal sheet 失效
    纤维增强金属板的形成方法

    公开(公告)号:US4886108A

    公开(公告)日:1989-12-12

    申请号:US250230

    申请日:1988-09-28

    IPC分类号: C22C47/20 B22D11/00

    摘要: A method for forming a fiber-reinforced metal sheet including the steps of preparing a wire preform in which fibers and a matrix are combined together; arranging regularly a plurality of wire preforms in a predetermined direction in a side-by-side relation; irradiating simultaneously using a CO.sub.2 laser beam, and a YAG laser beam the regularly arranged wire preforms to elevate the temperature of the wire preforms; and pressing the wire preforms by rollers while the wire preforms are at the elevated temperature.

    摘要翻译: 一种形成纤维增强金属板的方法,包括以下步骤:制备其中将纤维和基体结合在一起的线坯; 并排布置规则地沿预定方向布置多个线条预制件; 使用CO2激光束同时照射,并且YAG激光束具有规则布置的线预制件,以提高线材预制件的温度; 并且当钢丝预成型件处于升高的温度时,通过辊压线材预成型件。