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73 条记录 (耗时 0.028 秒)

    Substrate holding apparatus
    11.
    发明授权
    Substrate holding apparatus 有权
    基板保持装置

    公开(公告)号：US07850509B2

    公开(公告)日：2010-12-14

    申请号：US12285936

    申请日：2008-10-16

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B7/22

    CPC分类号： B24B37/30 ,  B24B41/061

    摘要： The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

    摘要翻译： 本发明涉及一种用于将基板保持并压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于接触基板的弹性垫和用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于接触弹性垫的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

    Substrate polishing machine
    13.
    发明授权
    Substrate polishing machine 失效
    基材抛光机

    公开(公告)号：US07156725B2

    公开(公告)日：2007-01-02

    申请号：US10481591

    申请日：2002-07-10

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B29/00 ,  B24B5/00

    CPC分类号： B24B37/30 ,  B24B37/32

    摘要： There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface.

    摘要翻译： 提供了一种衬底抛光机，其包括抛光表面和用于保持衬底并使其与抛光表面接触的衬底载体。 基板载体包括载体主体，用于保持待抛光基板的表面朝向抛光表面的基板的基板保持构件。 衬底保持构件以使得衬底保持构件能够朝向和远离抛光表面移动的方式安装在载体主体上。 基板研磨机还包括基板保持部件定位装置，该基板保持部件定位装置设置在基板保持部件的与保持基板相同的一侧。 衬底保持构件定位装置具有限定腔室的柔性构件，并且在引入不可压缩流体时沿朝向抛光表面的方向膨胀。

    Substrate holding apparatus
    14.
    发明授权
    Substrate holding apparatus 有权
    基板保持装置

    公开(公告)号：US07083507B2

    公开(公告)日：2006-08-01

    申请号：US11028629

    申请日：2005-01-05

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B7/22

    CPC分类号： B24B37/30 ,  B24B41/061

    摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

    摘要翻译： 本发明涉及一种用于保持待抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于与基板接触的弹性垫，以及用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于与弹性垫接触的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

    Substrate holding apparatus
    15.
    发明申请
    Substrate holding apparatus 有权
    基板保持装置

    公开(公告)号：US20050118935A1

    公开(公告)日：2005-06-02

    申请号：US11028629

    申请日：2005-01-05

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B37/005 ,  B24B37/04 ,  B24B37/30 ,  B24B41/06 ,  H01L21/304 ,  B24B1/00

    CPC分类号： B24B37/30 ,  B24B41/061

    摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

    摘要翻译： 本发明涉及一种用于保持待抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于与基板接触的弹性垫，以及用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于与弹性垫接触的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

    Polishing apparatus
    17.
    发明授权
    Polishing apparatus 有权
    抛光设备

    公开(公告)号：US06953390B2

    公开(公告)日：2005-10-11

    申请号：US10342253

    申请日：2003-01-15

    申请人： Kunihiko Sakurai ,  Hiroshi Yoshida ,  Tetsuji Togawa

    发明人： Kunihiko Sakurai ,  Hiroshi Yoshida ,  Tetsuji Togawa

    IPC分类号： B08B3/10 ,  B08B3/12 ,  B24B53/007 ,  B24B53/013 ,  B24B53/017 ,  B24B53/02 ,  H01L21/304 ,  B24B1/00

    CPC分类号： B24B53/017 ,  B08B1/007 ,  B08B3/102 ,  B08B3/12 ,  B24B53/013 ,  B24B53/02

    摘要： A polishing surface is conditioned by pressing a diamond dresser against the polishing surface to thinly shave a surface of the polishing surface. Foreign matter clogging concavities formed in the polishing surface is scraped by pressing a brush dresser against the polishing surface in a state such that a polishing liquid is not supplied to the polishing table. A liquid composed of a mixture of a liquid or inert gas with pure water or a chemical liquid is ejected onto the polishing surface to clean the polishing surface.

    摘要翻译： 通过将金刚石修整器压靠在抛光表面上以对剃磨表面的表面进行稀薄剃刮来调节抛光表面。 在不将研磨液供给到研磨台的状态下，通过将刷式修整器压靠在研磨面上来刮去在研磨面上形成的异物堵塞凹部。 将由液体或惰性气体与纯水或化学液体的混合物组成的液体喷射到抛光表面上以清洁抛光表面。

    Polishing apparatus
    18.
    发明授权
    Polishing apparatus 有权
    抛光设备

    公开(公告)号：US06942541B2

    公开(公告)日：2005-09-13

    申请号：US09922776

    申请日：2001-08-07

    申请人： Tetsuji Togawa ,  Kunihiko Sakurai ,  Ritsuo Kikuta

    发明人： Tetsuji Togawa ,  Kunihiko Sakurai ,  Ritsuo Kikuta

    IPC分类号： H01L21/304 ,  B24B37/04 ,  B24B51/00 ,  B24B53/007 ,  B24B7/22

    CPC分类号： B24B37/345 ,  B24B37/04 ,  B24B51/00 ,  B24B53/017

    摘要： A polishing apparatus polishes a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a storage cassette for storing workpieces to be polished, at least two polishing units each having at least a turntable with a polishing cloth mounted thereon and a top ring for supporting a workpiece and pressing the workpiece against the polishing cloth, and a cleaning unit for cleaning a workpiece which has been polished by either one of the polishing units in such a state that the workpiece is removed from the top ring. The polishing apparatus further includes a transfer robot for transferring a workpiece between two of the storage cassette, the polishing units and the cleaning unit.

    摘要翻译： 抛光装置将诸如半导体晶片的工件抛光成平面镜面。 抛光装置包括用于存储要被抛光的工件的存储盒，至少两个抛光单元，每个抛光单元至少具有安装在其上的抛光布的转台和用于支撑工件并将工件压靠抛光布的顶环，以及 清洁单元，用于在工件从顶环移除的状态下清洁由任一个抛光单元抛光的工件。 抛光装置还包括用于在两个存储盒，抛光单元和清洁单元之间传送工件的传送机器人。

    Robotic transport apparatus
    19.
    发明授权
    Robotic transport apparatus 失效
    机器人运输设备

    公开(公告)号：US5961380A

    公开(公告)日：1999-10-05

    申请号：US12826

    申请日：1998-01-23

    申请人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Kunihiko Sakurai

    发明人： Tetsuji Togawa ,  Kuniaki Yamaguchi ,  Kunihiko Sakurai

    IPC分类号： B65G49/07 ,  H01L21/677 ,  H01L21/687 ,  B24B47/02

    CPC分类号： H01L21/67766 ,  H01L21/68707 ,  Y10S451/914

    摘要： A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided between the workpiece holding section and the robot body and has an area not smaller than the workpiece holding section.

    摘要翻译： 机器人运输装置能够在不使用机械密封的情况下提供工作部件的有效防水功能。 机器人运输装置包括机器人主体，可伸缩地附接到机器人主体的臂组件和附接到臂组件的工件保持部。 在工件保持部和机器人体之间设置用于机器人主体防水的盘构件，并且具有不小于工件保持部的面积。

    Dressing apparatus and method
    20.
    发明授权
    Dressing apparatus and method 失效
    敷料装置和方法

    公开(公告)号：US5643067A

    公开(公告)日：1997-07-01

    申请号：US571598

    申请日：1995-12-13

    申请人： Seiji Katsuoka ,  Kunihiko Sakurai ,  Tetsuji Togawa

    发明人： Seiji Katsuoka ,  Kunihiko Sakurai ,  Tetsuji Togawa

    IPC分类号： B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  B24B21/18 ,  B24B33/00 ,  B24B47/26 ,  B24B55/00

    CPC分类号： B24B53/017 ,  B24B53/00

    摘要： A dressing apparatus is used to resurface a polishing surface of a polish cloth used to polish semiconductor wafers. A dressing brush which spins on its own axis is also coupled to a drive shaft of a main drive of the dressing apparatus through a planetary gear mechanism so that the brush will rotate or orbit about the drive shaft. Therefore, the dressing brush traces a complex path and its dressing action is spread over a wide surface area of the polishing cloth to produce thorough resurfacing of the polishing surface. The service life of the cloth is significantly increased and contributes to improving the overall efficiency of preparing high quality polished semiconductor wafers. For economy, the dressing apparatus can be mounted easily on a conventional polishing apparatus having a dressing facility.

    摘要翻译： 修整装置用于重新表面抛光用于抛光半导体晶片的抛光布的抛光表面。 在其自身的轴线上旋转的修整刷也通过行星齿轮机构联接到修整设备的主驱动器的驱动轴，使得电刷将围绕驱动轴旋转或轨道。 因此，修整刷跟踪复杂的路径，并且其修整作用分布在抛光布的宽表面区域上，以产生抛光表面的彻底表面。 布的使用寿命显着增加，有助于提高制备高质量抛光半导体晶片的整体效率。 为了经济，敷料装置可以容易地安装在具有修整设备的常规抛光装置上。