Abstract:
The present invention provides systems and methods for performing frequency margin testing of a computer system, such as a server. A system of the invention can include a controller, e.g., a BMC, internal to the computer system and a digital frequency synthesizer that can communicate with the controller and can apply clock frequency to marginable components of the computer system. In response to commands from the controller, the synthesizer generates one or more test frequencies that are applied to one or more of the marginable components. The response of the system to each of the test frequencies is then monitored.
Abstract:
A component for insertion into a hole in a multiple-layer substrate enables impedance matching of the substrate. The component comprises a conductive ground core arranged to extend through multiple-layers of the substrate when the component is inserted, a dielectric layer laterally encasing the conductive ground core, and a signal conductor layer coupled lateral to the dielectric layer.
Abstract:
The present invention provides systems and methods for performing frequency margin testing of a computer system, such as a server. A system of the invention can include a controller, e.g., a BMC, internal to the computer system and a digital frequency synthesizer that can communicate with the controller and can apply clock frequency to marginable components of the computer system. In response to commands from the controller, the synthesizer generates one or more test frequencies that are applied to one or more of the marginable components. The response of the system to each of the test frequencies is then monitored.
Abstract:
A converter assembly comprises a backplane interface to a backplane compliant with a first open architecture modular computing system standard, a component interface capable of coupling to a component compliant with a second open architecture modular computing system standard, and a control element. The control element is coupled between the backplane interface and the component interface and is capable of programmably routing connection lines and signals between the component interface and the backplane interface.
Abstract:
A component for insertion into a hole in a multiple-layer substrate enables impedance matching of the substrate. The component comprises a conductive ground core arranged to extend through multiple-layers of the substrate when the component is inserted, a dielectric layer laterally encasing the conductive ground core, and a signal conductor layer coupled lateral to the dielectric layer.