公开(公告)号：US09972512B2

公开(公告)日：2018-05-15

申请号：US15716663

申请日：2017-09-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Akiko Kai ,  Takafumi Niwa ,  Shogo Takahashi ,  Hiroshi Nishihata ,  Yuichi Terashita ,  Teruhiko Kodama

IPC: H01L21/67 ,  H01L21/311 ,  H01L21/687 ,  G03F7/30 ,  H01L21/033 ,  H01L21/02

CPC classification number: H01L21/67051 ,  G03F7/3021 ,  H01L21/0206 ,  H01L21/0337 ,  H01L21/31133 ,  H01L21/31144 ,  H01L21/6708 ,  H01L21/68742

Abstract: A liquid processing apparatus for liquid-processing a substrate includes a substrate holding device that rotates a substrate in horizontal position, a nozzle holding device holding processing liquid and gas nozzles, the liquid nozzle discharging processing liquid from a discharge port such that the liquid is discharged obliquely to surface of the substrate, the gas nozzle discharging gas perpendicularly to the surface of the substrate, a moving device that moves the nozzle device with respect to the surface of the substrate, and a control device including circuitry that controls the nozzle, substrate and moving devices such that while the substrate is rotated, the liquid is discharged to peripheral portion toward downstream side in rotation direction and along tangential direction of the substrate and gas is discharged from the gas nozzle toward position adjacent to liquid landing position of the liquid on the surface and is on center side of the substrate.

公开(公告)号：US20160096203A1

公开(公告)日：2016-04-07

申请号：US14870609

申请日：2015-09-30

Applicant: TOKYO ELECTRON LIMITED

Inventor： Akiko Kai ,  Takafumi Niwa ,  Shogo Takahashi ,  Hiroshi Nishihata ,  Yuichi Terashita ,  Teruhiko Kodama

IPC: B08B3/10

CPC classification number: H01L21/67051 ,  G03F7/3021 ,  H01L21/0206 ,  H01L21/0337 ,  H01L21/31133 ,  H01L21/31144 ,  H01L21/6708 ,  H01L21/68742

Abstract: A liquid processing method for liquid-processing a substrate includes setting a substrate on a substrate holding device which rotates the substrate such that the substrate is held in horizontal position, supplying processing liquid to center portion of the substrate such that the center portion positioned center side with respect to peripheral portion of the substrate is liquid-processed, positioning a discharge port of a processing liquid nozzle toward downstream side in rotation direction such that the liquid is discharged to the peripheral portion obliquely to surface of the substrate and along tangential direction of the substrate while the substrate is rotated, and discharging gas from a gas nozzle perpendicularly to the surface of the substrate toward position that is adjacent to liquid landing position of the liquid on the surface of the substrate and is on the center side of the substrate, while the liquid is discharged to the peripheral portion.

Abstract translation: 一种用于液体处理衬底的液体处理方法包括：在基板保持装置上设置基板，该基板保持装置旋转基板，使得基板保持在水平位置，将处理液体供应到基板的中心部分，使得位于中心部分的中心部分 相对于基板的周边部分进行液体处理，将处理液喷嘴的排出口朝向旋转方向的下游侧定位，使得液体倾斜地向基板的周边部分排出并且沿着切割方向 衬底，同时衬底旋转，并且将气体从气体喷嘴垂直于衬底的表面朝着与衬底表面上的液体着陆位置相邻的位置，并位于衬底的中心侧，同时 液体被排出到周边部分。