公开(公告)号：US20240295027A1

公开(公告)日：2024-09-05

申请号：US18581954

申请日：2024-02-20

Applicant: Tokyo Electron Limited

Inventor： Junnosuke TAGUCHI ,  Yasushi TAKEUCHI ,  Manabu HONMA ,  Ibuki HAYASHI

IPC: C23C16/458

CPC classification number: C23C16/4584

Abstract: A substrate processing apparatus includes a vacuum chamber; a rotary table rotatably provided in the vacuum chamber; and a stage configured to rotate together with the rotary table. The rotary table has an opening provided at a position spaced apart from a rotation center of the rotary table. An inner surface of the opening is continuous with an upper surface and a lower surface of the rotary table. The stage is spaced apart from the inner surface of the opening by a clearance.

公开(公告)号：US20230062671A1

公开(公告)日：2023-03-02

申请号：US17822249

申请日：2022-08-25

Applicant: Tokyo Electron Limited

Inventor： Junnosuke TAGUCHI ,  Yasushi TAKEUCHI ,  Manabu HONMA

IPC: C23C16/458 ,  C23C16/46 ,  C23C16/44

Abstract: A substrate processing apparatus includes a processing chamber; a rotary table that is rotatably provided in the processing chamber; a heater provided below the rotary table; a partition, provided between the rotary table and the heater with a gap with respect to a lower surface of the rotary table, configured to partition the processing chamber into a first region in which the rotary table is provided and a second region in which the heater is provided; a first processing region in which a first processing gas is supplied to an upper surface of the rotary table; a second processing region in which a second processing gas is supplied to the upper surface of the rotary table; and a separation region in which a separation gas for separating the first and second processing gas is supplied to the upper surface of the rotary table.

公开(公告)号：US20220037977A1

公开(公告)日：2022-02-03

申请号：US17387569

申请日：2021-07-28

Applicant: Hitachi Metals, Ltd. ,  Tokyo Electron Limited

Inventor： Akihiro KIMOTO ,  Junnosuke TAGUCHI ,  Satoshi YOSHIMOTO ,  Norihiko KISHIMOTO ,  Keita HAYASHI

IPC: H02K49/10 ,  F16H49/00

Abstract: A magnetic coupling device includes a driving magnet array having multiple annular sector-shaped, circumferentially arranged first permanent magnets, and a driven magnet array having multiple circular sector-shaped, circumferentially arranged second permanent magnets with pole surfaces facing pole surfaces of the first permanent magnets. The driven magnet array is rotated by the driving magnet array being rotated. A repulsion zone where a repulsive force acts is designed to have an area that is 5% to 15% of that of an attraction zone where an attractive force acts between a specific first permanent magnet and a specific second permanent magnet, with a radial first centerline of the specific first permanent magnet overlapping a radial second centerline of the specific second permanent magnet so that opposite poles face each other, including between first and second permanent magnets respectively adjacent the specific first and second permanent magnets with overlapping the centerlines.

公开(公告)号：US20210180187A1

公开(公告)日：2021-06-17

申请号：US17110719

申请日：2020-12-03

Applicant: Tokyo Electron Limited

Inventor： Junnosuke TAGUCHI ,  Yasutomo KIMURA

IPC: C23C16/458 ,  H01L21/67

Abstract: A rotational drive device includes a first rotator configured to rotate with respect to a stator, a plurality of second rotators configured to rotate with respect to the first rotator, a plurality of drivers configured to rotatably drive the respective second rotators, and a plurality of driver controllers configured to rotate integrally with the first rotator and to control rotation of the drivers, respectively, the respective driver controllers being connected to one another by a communication network.

公开(公告)号：US20190013224A1

公开(公告)日：2019-01-10

申请号：US16025560

申请日：2018-07-02

Applicant: TOKYO ELECTRON LIMITED

Inventor： Toshiya CHIBA ,  Yuya SASAKI ,  Junnosuke TAGUCHI

IPC: H01L21/67 ,  C23C16/52 ,  C23C16/458 ,  H01L21/687 ,  G01B11/16

Abstract: There is provided a substrate warping monitoring device for monitoring a warping of a substrate mounted in a substrate mounting region formed in a rotary table along a circumferential direction during rotation of the rotary table, including: an optical displacement meter located above the rotary table and configured to irradiate a light to a predetermined position on the rotary table, receive a reflected light reflected off the rotary table and the substrate which passes through the predetermined position and measure a surface profile of the substrate; a memory part configured to store a measurement value acquired when the light is irradiated on a predetermined reference surface, as a reference value; and a calculation part configured to calculate a warping amount of the substrate based on the surface profile of the substrate measured by the optical displacement meter and the reference value stored in the memory part.