公开(公告)号：US20250144892A1

公开(公告)日：2025-05-08

申请号：US19010575

申请日：2025-01-06

Applicant: Tokyo Electron Limited

Inventor： Hirokazu UEDA ,  Kenji SEKIGUCHI ,  Mitsuaki IWASHITA

IPC: B29C65/48

Abstract: A bonding method includes a first operation of preparing a first substrate having a first surface and a second substrate having a second surface, each of the first surface and the second surface having a first region in which an insulating film is exposed and a second region in which a conductive film is exposed, a second operation of applying an ionic liquid to at least one of the first surface of the first substrate or the second surface of the second substrate, and a third operation of bonding the first surface of the first substrate and the second surface of the second substrate with the ionic liquid.

公开(公告)号：US20230111710A1

公开(公告)日：2023-04-13

申请号：US17960746

申请日：2022-10-05

Applicant: Tokyo Electron Limited

Inventor： Takeya INOUE ,  Kenji SEKIGUCHI ,  Mitsuaki IWASHITA ,  Hirokazu UEDA ,  Koji AKIYAMA ,  Ryuichi ASAKO

IPC: B01D11/04 ,  B01D17/02 ,  B08B3/08 ,  C07C29/86

Abstract: A purification processing apparatus for supplying purified isopropyl alcohol to a substrate processing apparatus. The purification processing apparatus includes: a processing chamber in which unpurified isopropyl alcohol and ionic liquid are mixed, and the isopropyl alcohol and the ionic liquid are separated to purify the isopropyl alcohol; an unpurified solvent supply port configured to supply the unpurified isopropyl alcohol to the processing chamber; an ionic liquid supply port configured to supply the ionic liquid to the processing chamber; and a purified solvent outlet configured to supply the purified isopropyl alcohol from the processing chamber to the substrate processing apparatus.

公开(公告)号：US20220001426A1

公开(公告)日：2022-01-06

申请号：US17295971

申请日：2019-11-20

Applicant: Tokyo Electron Limited

Inventor： Kyoko IKEDA ,  Kazuya DOBASHI ,  Tsunenaga NAKASHIMA ,  Kenji SEKIGUCHI ,  Shuuichi NISHIKIDO ,  Masato NAKAJO ,  Takahiro YASUTAKE

IPC: B08B5/02

Abstract: A substrate cleaning method includes: arranging a substrate within a processing container; spraying gas from a spray port of a gas nozzle arranged within the processing container; causing vertical shock waves, generated by spraying the gas from the gas nozzle, to collide with a main surface of the substrate; and removing particles adhering to the main surface of the substrate, by causing the vertical shock waves to collide with the main surface of the substrate.

公开(公告)号：US20170345685A1

公开(公告)日：2017-11-30

申请号：US15599067

申请日：2017-05-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kenji SEKIGUCHI ,  Itaru KANNO ,  Meitoku AIBARA ,  Kouzou TACHIBANA

IPC: H01L21/67 ,  B08B3/04 ,  B08B7/00 ,  H01L21/02

Abstract: A substrate cleaning method includes supplying, onto a substrate, a film-forming processing liquid including a volatile component and a polar organic material that forms a processing film on the substrate, volatilizing the volatile component such that the film-forming processing liquid solidifies or cures and forms the processing film on the substrate, supplying, to the processing film formed on the substrate, a peeling processing liquid that peels off the processing film from the substrate and includes a non-polar solvent, and supplying, to the processing film, a dissolution processing liquid that dissolves the processing film and includes a polar solvent after the supplying of the peeling processing liquid. The non-polar solvent does not contain water, and the polar solvent does not contain water.