公开(公告)号：US20230154776A1

公开(公告)日：2023-05-18

申请号：US17889624

申请日：2022-08-17

Applicant: Tokyo Electron Limited

Inventor： Tadashi ENOMOTO ,  Nao AKASHI ,  Yutai MATSUHASHI ,  Masakazu YAMAMOTO

IPC: H01L21/673 ,  H01L21/68

CPC classification number: H01L21/67309 ,  H01L21/681

Abstract: A substrate processing apparatus includes: a chamber that accommodates a boat; a transfer mechanism that is provided inside the chamber, and transfers a substrate; a first camera that captures an image of a support column of the boat and the substrate; a support member that is inserted through an opening formed in a wall surface of the chamber, and supports the first camera; and a driver that drives the support member in order to move the first camera between a standby position and a measurement position.

公开(公告)号：US20220207492A1

公开(公告)日：2022-06-30

申请号：US17553909

申请日：2021-12-17

Applicant: Tokyo Electron Limited

Inventor： Masakazu YAMAMOTO ,  Tadashi ENOMOTO

IPC: G06Q10/00 ,  G06Q10/06 ,  G06Q50/04 ,  G06Q10/08 ,  G06F30/20 ,  G01M99/00

Abstract: An information processing apparatus executes a simulation of a state of a process which is being performed in a semiconductor manufacturing apparatus, by using a simulation model of the semiconductor manufacturing apparatus. The information processing apparatus includes: a physical sensor data acquisition unit that acquires physical sensor data measured in the semiconductor manufacturing apparatus that is performing the process according to process parameters; a simulation execution unit that executes the simulation by the simulation model according to the process parameters, thereby outputting virtual sensor data; a simulation result determination unit that performs a pre-detection of a part of the semiconductor manufacturing apparatus that needs to be replaced, based on a difference between the physical sensor data and the virtual sensor data; and a part order unit that orders the part of the semiconductor manufacturing apparatus based on a result of the pre-detection.

公开(公告)号：US20200381281A1

公开(公告)日：2020-12-03

申请号：US16883965

申请日：2020-05-26

Applicant: Tokyo Electron Limited

Inventor： Masakazu YAMAMOTO ,  Tadashi ENOMOTO

IPC: H01L21/673 ,  H01L21/67 ,  H01L21/677

Abstract: A transfer method transfers a substrate between a transfer unit configured to hold and transfer the substrate and a substrate stage serving as a transfer destination or a transfer source of the substrate. The transfer method includes: acquiring positional information of the transfer unit and positional information of the substrate stage; determining whether or not there is a risk for the substrate to contact with the substrate stage, based on the acquired positional information of the transfer unit and positional information of the substrate stage; and when determined that there is a risk for the substrate to contact with the substrate stage, notifying the risk according to the determination at the determining.