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公开(公告)号：US20250022757A1
公开(公告)日：2025-01-16
申请号：US18768254
申请日：2024-07-10
Applicant: Tokyo Electron Limited
IPC: H01L21/66
Abstract: A semiconductor manufacturing apparatus includes a first controller that collects radio-frequency vibration data; and a second controller that analyzes the radio-frequency vibration data. The first controller includes a collection unit that collects the radio-frequency vibration data from a sensor, a fast Fourier transform (FFT) unit that performs a FFT processing on the radio-frequency vibration data according to a resolution setting, a FFT data transmission unit that transmits FFT data generated by the FFT processing, to the second controller, and a radio-frequency vibration data transmission unit that transmits the radio-frequency vibration data in a time period in which the FFT data exceeds a threshold value for an abnormality prediction, to the second controller The higher-level controller includes an analysis unit that analyzes the FFT data and the radio-frequency vibration data in the time period.
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公开(公告)号：US20220391562A1
公开(公告)日：2022-12-08
申请号：US17826870
申请日：2022-05-27
Applicant: Tokyo Electron Limited
Inventor： Tadashi ENOMOTO , Masakazu YAMAMOTO
IPC: G06F30/20
Abstract: An information processing apparatus executes a simulation of a process state being executed in a semiconductor manufacturing apparatus using a simulation model of the semiconductor manufacturing apparatus. The information processing apparatus includes: a physical sensor data acquisition unit that acquires physical sensor data measured at the semiconductor manufacturing apparatus that executes a process according to a process parameter; and a simulation execution unit that executes a simulation by the simulation model according to the process parameter including the physical sensor data, and calculate virtual sensor data and virtual process result data. The physical sensor data acquired by the physical sensor data acquisition unit includes a temperature of a gas introduced into the semiconductor manufacturing apparatus that executes the process.
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公开(公告)号：US20220388785A1
公开(公告)日：2022-12-08
申请号：US17664461
申请日：2022-05-23
Applicant: TOKYO ELECTRON LIMITED
Inventor： Tadashi ENOMOTO , Nao AKASHI , Youngtai KANG , Keishi SHIONAGA
Abstract: An information processing apparatus for controlling a conveying apparatus to convey a substrate to be processed by a substrate processing apparatus includes a processor that performs operations including controlling the conveying apparatus, according to teaching data, to perform a first movement operation including putting the substrate into a container configured to carry the substrate and a second movement operation including getting the substrate from the container, acquiring image data including an image of a placement position for the substrate in the container during the first movement operation and the second movement operation, performing image processing on the image data to quantify a relationship between a position of the container and a position of the substrate, determining the quantified relationship to yield a determination result, and outputting correction data for correcting the conveying apparatus with respect to the first movement operation and the second movement operation, based on the determination result.
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公开(公告)号：US20220344180A1
公开(公告)日：2022-10-27
申请号：US17659514
申请日：2022-04-18
Applicant: Tokyo Electron Limited
Inventor： Hiroyuki KARASAWA , Masakazu YAMAMOTO , Tadashi ENOMOTO
IPC: H01L21/67
Abstract: An An information processing system includes a temperature measuring unit configured to measure a temperature distribution, in an array direction of substrates to be treated, at positions between a heater and the substrates in a treatment chamber, a memory, and a processor coupled to the memory and configured to perform a simulation of the temperature distribution during performing the heat treatment on the substrates in the treatment chamber, to obtain a standard-simulation temperature distribution by using a standard-simulation model of the heat treatment apparatus, modify the standard-simulation model to obtain an individual-simulation model in which an individual difference of the heat treatment apparatus is reflected, based on a difference between the measured temperature distribution and the obtained standard-simulation temperature distribution, perform the simulation of the temperature distribution to obtain an individual-simulation temperature distribution by using the obtained individual-simulation model, and correct a target temperature by using the obtained individual-simulation temperature distribution.
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公开(公告)号：US20210398342A1
公开(公告)日：2021-12-23
申请号：US17354062
申请日：2021-06-22
Applicant: Tokyo Electron Limited
Inventor： Masakazu YAMAMOTO , Tadashi ENOMOTO , Yuta KUNITAKE , Yutai MATSUHASHI
Abstract: There is provided a teaching method for a transfer device configured to transfer a substrate between a transfer source object and a transfer destination object on which the substrate is disposable. The teaching method includes: generating three-dimensional image data of a shape of the transfer source object, a shape of the transfer destination object, and a state of the substrate based on captured image data of the transfer source object, the transfer destination object, and the substrate captured by a capturing unit, and based on design data of the transfer source object, the transfer destination object, and the substrate; and teaching the transfer device based on the three-dimensional image data so that the substrate is transferred between the transfer source object and the transfer destination object without colliding with the transfer source object and the transfer destination object.
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Patent Agency Ranking
公开(公告)号：US20250076843A1
公开(公告)日：2025-03-06
申请号：US18812476
申请日：2024-08-22
Applicant: Tokyo Electron Limited
Inventor： Masakazu YAMAMOTO , Tadashi ENOMOTO
IPC: G05B19/4065 , G05B19/404 , G05B19/4069 , G05B19/408
Abstract: An information processing apparatus executes a simulation of a process state, which is being executed in a semiconductor manufacturing apparatus using a physical model of the semiconductor manufacturing apparatus. The information processing apparatus includes a simulation execution unit that executes the simulation by setting operating conditions of the physical model to the same conditions as those of the semiconductor manufacturing apparatus; a physical coefficient change unit that changes a physical coefficient of the physical model such that an output value of the physical model approximates to a corresponding output value of the semiconductor manufacturing apparatus a deterioration state analysis unit that analyzes a deterioration state of the semiconductor manufacturing apparatus, based on a change in the physical coefficient; and a deterioration state output unit that outputs information regarding the deterioration state of the semiconductor manufacturing apparatus, analyzed by the deterioration state analysis unit.
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公开(公告)号：US20210264076A1
公开(公告)日：2021-08-26
申请号：US17175744
申请日：2021-02-15
Applicant: Tokyo Electron Limited
Inventor： Masakazu YAMAMOTO , Tadashi ENOMOTO
IPC: G06F30/20
Abstract: An information processing system includes: a physical sensor data acquisition unit configured to acquire physical sensor data measured by a semiconductor manufacturing apparatus that executes a process according to a process parameter; a simulation execution unit configured to execute a simulation by a simulation model of the semiconductor manufacturing apparatus according to the process parameter and calculate virtual sensor data and virtual process result data; and a display controller that visualizes a process state of the semiconductor manufacturing apparatus and displays the process state on a display unit during the execution of the process using the physical sensor data, the virtual sensor data, and the virtual process result data.
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8.发明公开公开(公告)号：US20240061413A1
公开(公告)日：2024-02-22
申请号：US18229441
申请日：2023-08-02
Applicant: Tokyo Electron Limited
Inventor： Masakazu YAMAMOTO , Tadashi ENOMOTO
CPC classification number: G05B23/0243 , G06F30/20
Abstract: An information processing system includes a heat treatment apparatus that performs heat treatment on a processing target substrate by using a heating unit, and an information processing apparatus that controls power supplied to the heating unit. The information processing system further includes a heating control unit that controls the power supplied to the heating unit based on a measured temperature and a set temperature, a virtual power output unit that outputs virtual power supplied to a simulation model of the heat treatment apparatus based on the set temperature and a predicted temperature, a temperature prediction unit that outputs the predicted temperature, based on the virtual power, to the virtual power output unit by using the simulation model, and an abnormality detection unit that detects an abnormality in the heat treatment apparatus based on a difference between the power controlled by the heating control unit and the virtual power.
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公开(公告)号：US20230154776A1
公开(公告)日：2023-05-18
申请号：US17889624
申请日：2022-08-17
Applicant: Tokyo Electron Limited
Inventor： Tadashi ENOMOTO , Nao AKASHI , Yutai MATSUHASHI , Masakazu YAMAMOTO
IPC: H01L21/673 , H01L21/68
CPC classification number: H01L21/67309 , H01L21/681
Abstract: A substrate processing apparatus includes: a chamber that accommodates a boat; a transfer mechanism that is provided inside the chamber, and transfers a substrate; a first camera that captures an image of a support column of the boat and the substrate; a support member that is inserted through an opening formed in a wall surface of the chamber, and supports the first camera; and a driver that drives the support member in order to move the first camera between a standby position and a measurement position.
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10.发明申请公开(公告)号：US20220207492A1
公开(公告)日：2022-06-30
申请号：US17553909
申请日：2021-12-17
Applicant: Tokyo Electron Limited
Inventor： Masakazu YAMAMOTO , Tadashi ENOMOTO
Abstract: An information processing apparatus executes a simulation of a state of a process which is being performed in a semiconductor manufacturing apparatus, by using a simulation model of the semiconductor manufacturing apparatus. The information processing apparatus includes: a physical sensor data acquisition unit that acquires physical sensor data measured in the semiconductor manufacturing apparatus that is performing the process according to process parameters; a simulation execution unit that executes the simulation by the simulation model according to the process parameters, thereby outputting virtual sensor data; a simulation result determination unit that performs a pre-detection of a part of the semiconductor manufacturing apparatus that needs to be replaced, based on a difference between the physical sensor data and the virtual sensor data; and a part order unit that orders the part of the semiconductor manufacturing apparatus based on a result of the pre-detection.
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