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公开(公告)号：US20240063034A1
公开(公告)日：2024-02-22
申请号：US18229471
申请日：2023-08-02
Applicant: Tokyo Electron Limited
Inventor： Masakazu YAMAMOTO , Tadashi ENOMOTO , Hiroyuki KARASAWA
IPC: H01L21/67
CPC classification number: H01L21/67109 , H01L21/67248 , H01L21/67253 , H01L21/6719
Abstract: An information processing system includes a heat treatment apparatus that forms a film on a processing target substrate by using a heating unit that heats the processing target substrate inside a processing container, and an information processing apparatus that controls power supplied to the heating part, the information processing system comprising a prediction unit configured to predict an influence of a cumulative film adhering inside the processing container, on a temperature of the processing target substrate by using a simulation model of the heat treatment apparatus and an adjuster configured to adjust the power supplied to the heating part based on the predicted influence of the cumulative film adhering inside the processing container, on the temperature of the processing target substrate.
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公开(公告)号：US20220392791A1
公开(公告)日：2022-12-08
申请号：US17804671
申请日：2022-05-31
Applicant: Tokyo Electron Limited
Inventor： Masakazu YAMAMOTO , Tadashi ENOMOTO
Abstract: A measurement jig for measuring the conditions in a device and a processing method are provided. A measurement jig having a substrate, a back-surface camera provided on a back-surface side of the substrate, and a controller configured to control the back-surface camera.
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3.发明公开公开(公告)号：US20240256919A1
公开(公告)日：2024-08-01
申请号：US18425060
申请日：2024-01-29
Applicant: Tokyo Electron Limited
Inventor： Yusuke TSUCHIYA , Masakazu YAMAMOTO , Hiroyuki KARASAWA
IPC: G06N5/022
CPC classification number: G06N5/022
Abstract: An information processing apparatus that identifies a machine difference in a heat treatment apparatus for heat-treating a processing target substrate includes a time series data acquisition unit that acquires time series data regarding temperature behavior of heat treatment apparatuses that have executed a recipe, a time series data prediction unit that predicts time series data regarding temperature behavior of the heat treatment apparatuses that have executed the recipe, using an ideal virtual model of the heat treatment apparatuses, a difference data calculation unit that calculates difference data between the acquired time series data and the predicted time series data for each of the heat treatment apparatuses, an adjustment unit that adjusts a parameter of the virtual model for each heat treatment apparatus, using the difference data, and a machine difference identification unit that identifies the machine difference candidate parameter based on a change in the parameter before and after adjustment.
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公开(公告)号：US20220391562A1
公开(公告)日：2022-12-08
申请号：US17826870
申请日：2022-05-27
Applicant: Tokyo Electron Limited
Inventor： Tadashi ENOMOTO , Masakazu YAMAMOTO
IPC: G06F30/20
Abstract: An information processing apparatus executes a simulation of a process state being executed in a semiconductor manufacturing apparatus using a simulation model of the semiconductor manufacturing apparatus. The information processing apparatus includes: a physical sensor data acquisition unit that acquires physical sensor data measured at the semiconductor manufacturing apparatus that executes a process according to a process parameter; and a simulation execution unit that executes a simulation by the simulation model according to the process parameter including the physical sensor data, and calculate virtual sensor data and virtual process result data. The physical sensor data acquired by the physical sensor data acquisition unit includes a temperature of a gas introduced into the semiconductor manufacturing apparatus that executes the process.
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公开(公告)号：US20220344180A1
公开(公告)日：2022-10-27
申请号：US17659514
申请日：2022-04-18
Applicant: Tokyo Electron Limited
Inventor： Hiroyuki KARASAWA , Masakazu YAMAMOTO , Tadashi ENOMOTO
IPC: H01L21/67
Abstract: An An information processing system includes a temperature measuring unit configured to measure a temperature distribution, in an array direction of substrates to be treated, at positions between a heater and the substrates in a treatment chamber, a memory, and a processor coupled to the memory and configured to perform a simulation of the temperature distribution during performing the heat treatment on the substrates in the treatment chamber, to obtain a standard-simulation temperature distribution by using a standard-simulation model of the heat treatment apparatus, modify the standard-simulation model to obtain an individual-simulation model in which an individual difference of the heat treatment apparatus is reflected, based on a difference between the measured temperature distribution and the obtained standard-simulation temperature distribution, perform the simulation of the temperature distribution to obtain an individual-simulation temperature distribution by using the obtained individual-simulation model, and correct a target temperature by using the obtained individual-simulation temperature distribution.
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Patent Agency Ranking
公开(公告)号：US20210398342A1
公开(公告)日：2021-12-23
申请号：US17354062
申请日：2021-06-22
Applicant: Tokyo Electron Limited
Inventor： Masakazu YAMAMOTO , Tadashi ENOMOTO , Yuta KUNITAKE , Yutai MATSUHASHI
Abstract: There is provided a teaching method for a transfer device configured to transfer a substrate between a transfer source object and a transfer destination object on which the substrate is disposable. The teaching method includes: generating three-dimensional image data of a shape of the transfer source object, a shape of the transfer destination object, and a state of the substrate based on captured image data of the transfer source object, the transfer destination object, and the substrate captured by a capturing unit, and based on design data of the transfer source object, the transfer destination object, and the substrate; and teaching the transfer device based on the three-dimensional image data so that the substrate is transferred between the transfer source object and the transfer destination object without colliding with the transfer source object and the transfer destination object.
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公开(公告)号：US20250076843A1
公开(公告)日：2025-03-06
申请号：US18812476
申请日：2024-08-22
Applicant: Tokyo Electron Limited
Inventor： Masakazu YAMAMOTO , Tadashi ENOMOTO
IPC: G05B19/4065 , G05B19/404 , G05B19/4069 , G05B19/408
Abstract: An information processing apparatus executes a simulation of a process state, which is being executed in a semiconductor manufacturing apparatus using a physical model of the semiconductor manufacturing apparatus. The information processing apparatus includes a simulation execution unit that executes the simulation by setting operating conditions of the physical model to the same conditions as those of the semiconductor manufacturing apparatus; a physical coefficient change unit that changes a physical coefficient of the physical model such that an output value of the physical model approximates to a corresponding output value of the semiconductor manufacturing apparatus a deterioration state analysis unit that analyzes a deterioration state of the semiconductor manufacturing apparatus, based on a change in the physical coefficient; and a deterioration state output unit that outputs information regarding the deterioration state of the semiconductor manufacturing apparatus, analyzed by the deterioration state analysis unit.
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公开(公告)号：US20250046658A1
公开(公告)日：2025-02-06
申请号：US18782981
申请日：2024-07-24
Applicant: Tokyo Electron Limited
Inventor： Hiroyuki KARASAWA , Masakazu YAMAMOTO , Yuichi TAKENAGA , Youngtai KANG , Shota YAMAZAKI
Abstract: A substrate processing method includes providing a substrate processing apparatus including a processing container that accommodates a substrate, and a heater that heats an inside of the processing container; setting a specific section with an in-plane temperature distribution of a substrate that results in a desired outcome of substrate processing based on a first prediction model that predicts a time-dependent change of the in-plane temperature distribution of the substrate after temperature increase or decrease caused by the heater; and performing the substrate processing in the specific section.
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公开(公告)号：US20210264076A1
公开(公告)日：2021-08-26
申请号：US17175744
申请日：2021-02-15
Applicant: Tokyo Electron Limited
Inventor： Masakazu YAMAMOTO , Tadashi ENOMOTO
IPC: G06F30/20
Abstract: An information processing system includes: a physical sensor data acquisition unit configured to acquire physical sensor data measured by a semiconductor manufacturing apparatus that executes a process according to a process parameter; a simulation execution unit configured to execute a simulation by a simulation model of the semiconductor manufacturing apparatus according to the process parameter and calculate virtual sensor data and virtual process result data; and a display controller that visualizes a process state of the semiconductor manufacturing apparatus and displays the process state on a display unit during the execution of the process using the physical sensor data, the virtual sensor data, and the virtual process result data.
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10.发明公开公开(公告)号：US20240061413A1
公开(公告)日：2024-02-22
申请号：US18229441
申请日：2023-08-02
Applicant: Tokyo Electron Limited
Inventor： Masakazu YAMAMOTO , Tadashi ENOMOTO
CPC classification number: G05B23/0243 , G06F30/20
Abstract: An information processing system includes a heat treatment apparatus that performs heat treatment on a processing target substrate by using a heating unit, and an information processing apparatus that controls power supplied to the heating unit. The information processing system further includes a heating control unit that controls the power supplied to the heating unit based on a measured temperature and a set temperature, a virtual power output unit that outputs virtual power supplied to a simulation model of the heat treatment apparatus based on the set temperature and a predicted temperature, a temperature prediction unit that outputs the predicted temperature, based on the virtual power, to the virtual power output unit by using the simulation model, and an abnormality detection unit that detects an abnormality in the heat treatment apparatus based on a difference between the power controlled by the heating control unit and the virtual power.
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