公开(公告)号：US20210343678A1

公开(公告)日：2021-11-04

申请号：US17374156

申请日：2021-07-13

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Toshifumi Inamasu

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/02 ,  B23K20/00 ,  H01L21/683

Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.

公开(公告)号：US20210249293A1

公开(公告)日：2021-08-12

申请号：US17164928

申请日：2021-02-02

Applicant: Tokyo Electron Limited

Inventor： Tetsuya Maki ,  Toshifumi Inamasu

IPC: H01L21/68 ,  H01L21/677 ,  H01L21/683 ,  H01L23/00

Abstract: A substrate positioning apparatus includes a holder and a rotating device. The holder is configured to hold a substrate. The rotating device is configured to rotate the holder. The rotating device includes a rotation shaft, a bearing member, a base member, a driving unit and a damping device. The rotation shaft is fixed to the holder. The bearing member is configured to support the rotation shaft in a non-contact state. The bearing member is fixed on the base member. The driving unit is configured to rotate the rotation shaft. The damping device includes a rail connected to the base member and a slider connected to the rotation shaft, and is configured to produce a damping force against a relative operation between the rotation shaft and the base member by a resistance generated between the rail and the slider.

公开(公告)号：US10373847B2

公开(公告)日：2019-08-06

申请号：US15644928

申请日：2017-07-10

Applicant: Tokyo Electron Limited

Inventor： Toshifumi Inamasu

IPC: H01L21/67 ,  H01L21/68 ,  H01L21/683

Abstract: A bonding apparatus includes an upper holding unit, a lower holding unit, a pushing unit and an attracting/holding unit. The upper holding unit is configured to hold a first substrate from a top surface thereof which is a non-bonding surface. The lower holding unit is provided under the upper holding unit and is configured to hold a second substrate from a bottom surface thereof while allowing the second substrate to face the first substrate. The pushing unit is configured to press a central portion of the first substrate from above to bring the central portion of the first substrate into contact with the second substrate. The attracting/holding unit is configured to be moved up and down with respect to the upper holding unit and hold a part of the top surface of the first substrate by attraction before the first substrate is held by the upper holding unit.

公开(公告)号：US20220254636A1

公开(公告)日：2022-08-11

申请号：US17661100

申请日：2022-04-28

Applicant: Tokyo Electron Limited

Inventor： Toshifumi Inamasu ,  Shinichi Shinozuka

IPC: H01L21/18 ,  H01L21/67 ,  B23Q17/24 ,  B23P19/10 ,  B23P21/00 ,  B23Q17/22 ,  H01L21/68

Abstract: A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a first imaging device provided at the first holder and configured to image the second substrate held by the second holder; a first light irradiating device provided at the first holder and configured to irradiate light to the second substrate when the second substrate is imaged; a second imaging device provided at the second holder and configured to image the first substrate held by the first holder; and a second light irradiating device provided at the second holder and configured to irradiate light to the first substrate when the first substrate is imaged. Each of the first light irradiating device and the second light irradiating device is connected to a first light source configured to irradiate white light.

公开(公告)号：US11094667B2

公开(公告)日：2021-08-17

申请号：US16347856

申请日：2017-10-10

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Toshifumi Inamasu

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/02 ,  B23K20/00 ,  H01L21/683

Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.

公开(公告)号：US20200381255A1

公开(公告)日：2020-12-03

申请号：US16884291

申请日：2020-05-27

Applicant: Tokyo Electron Limited

Inventor： Toshifumi Inamasu ,  Shinichi Shinozuka

IPC: H01L21/18 ,  H01L21/67

Abstract: A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a first imaging device provided at the first holder and configured to image the second substrate held by the second holder; a first light irradiating device provided at the first holder and configured to irradiate light to the second substrate when the second substrate is imaged; a second imaging device provided at the second holder and configured to image the first substrate held by the first holder; and a second light irradiating device provided at the second holder and configured to irradiate light to the first substrate when the first substrate is imaged. Each of the first light irradiating device and the second light irradiating device is connected to a first light source configured to irradiate white light.

公开(公告)号：US20200273835A1

公开(公告)日：2020-08-27

申请号：US16799985

申请日：2020-02-25

Applicant: Tokyo Electron Limited

Inventor： Toshifumi Inamasu

IPC: H01L23/00

Abstract: A substrate processing apparatus includes a chuck configured to attract and hold a substrate; an observer configured to observe multiple positions within a second surface of the substrate attracted to and held by the chuck, the second surface being opposite to a first surface thereof which is in contact with the chuck; and an analyzer configured to analyze observation results of the multiple positions. When a singularity regarding a height from a surface of the chuck attracting and holding the substrate exists on the second surface, the analyzer specifies a position of the singularity on the chuck.

公开(公告)号：US20180019140A1

公开(公告)日：2018-01-18

申请号：US15644928

申请日：2017-07-10

Applicant: Tokyo Electron Limited

Inventor： Toshifumi Inamasu

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67092 ,  H01L21/67103 ,  H01L21/67201 ,  H01L21/67248 ,  H01L21/681 ,  H01L21/6838

Abstract: A bonding apparatus includes an upper holding unit, a lower holding unit, a pushing unit and an attracting/holding unit. The upper holding unit is configured to hold a first substrate from a top surface thereof which is a non-bonding surface. The lower holding unit is provided under the upper holding unit and is configured to hold a second substrate from a bottom surface thereof while allowing the second substrate to face the first substrate. The pushing unit is configured to press a central portion of the first substrate from above to bring the central portion of the first substrate into contact with the second substrate. The attracting/holding unit is configured to be moved up and down with respect to the upper holding unit and hold a part of the top surface of the first substrate by attraction before the first substrate is held by the upper holding unit.